Patent Assignment
Reel/Frame 048682/0212
Change of Name
Recorded: 2019-03-25
Pages: 7
Assignor
INTERCONNECT DEVICES, INC.
Executed: 2017-07-31
Assignee
SMITHS INTERCONNECT AMERICAS, INC.
THE CORPORATION TRUST COMPANY, CORPORATION TRUST CENTER, 1209 ORANGE STREET,, WILMINGTON,, DELAWARE, 19801
Covered Properties
(10)
Chip Attenuator Having a Capacitor Therein
Patent:
5,986,516 →
Application:
08/998,672 →
High Power Resistor
Patent:
5,945,905 →
Application:
09/217,301 →
Temperature Sensing Termination
Patent:
6,361,207 →
Application:
09/325,360 →
Tuned Reactance Cavity Electrical Termination
Patent:
6,326,862 →
Application:
09/394,721 →
Wideband Temperature-Variable Attenuator
High-Frequency Temperature-Variable Attenuator
Voltage Controlled Attenuator with No Intermodulation Distortion
Patent:
7,256,664 →
Application:
11/107,586 →
Frequency Adaptive Temperature Variable Attenuator
Patent:
7,855,615 →
Application:
12/114,492 →
Integrated Hybrid-Direct Couplers
Chip Resistor with Outrigger Heat Sink
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 29, 1997
From: MAZZOCHETTE, JOSEPH B.
To: EMC TECHNOLOGY, INC.
Reel/Frame 008925/0225 →
Security Interest
Sep 23, 1998
From: EMC TECHNOLOGY LLC
To: FIRST SOURCE FINANCIAL LLP
Reel/Frame 009453/0957 →
Assignment of Assignor's Interest
Sep 28, 1998
From: EMC TECHNOLOGY, INC.
To: EMC TECHNOLOGY LLC
Reel/Frame 009479/0080 →
Assignment of Assignor's Interest
Dec 21, 1998
From: MAZZOCHETTE, JOSEPH B.
To: EMC TECHNOLOGY LLC
Reel/Frame 009666/0176 →
Corrective Assignment to Correct the Title of Invention, Filing Dates and the Erroneous Assignment of Serial Number 08/988672, Previously Recorded 9-28-98, at Reel 9479, Frame 0080.
Feb 12, 1999
From: EMC TECHNOLOGY, INC.
To: EMC TECHNOLOGY LLC
Reel/Frame 009885/0650 →
Assignment of Assignor's Interest
Jun 4, 1999
From: FERGUSON, DONALD A.
To: FLORIDA RF LABS, INC.
Reel/Frame 010017/0870 →
Assignment of Assignor's Interest
Sep 13, 1999
From: FERGUSON, DONALD A.; GOTTSCHALK, MARTIN
To: FLORIDA RF LABS, INC.
Reel/Frame 010241/0524 →
Assignment of Assignor's Interest
Apr 5, 2000
From: EMC TECHNOLOGY, LLC
To: SIEMC ACQUISITION CORP.
Reel/Frame 010719/0300 →
Merger
Dec 8, 2004
From: EMC TECHNOLOGY, INC.
To: FLORIDA RF LABS, INC.
Reel/Frame 016069/0823 →
Change of Name
Dec 8, 2004
From: FLORIDA RF LABS, INC.
To: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
Reel/Frame 016069/0821 →
Assignment of Assignor's Interest
May 3, 2005
From: FLORIDA RF LABS, INC.
To: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
Reel/Frame 016535/0448 →
Confirmation That All 19 Documents Listed on Recordation Cover Sheet Should Be Recorded. Please Adjust Fee to Deduct Original $40 Paid with First Submission.
Jul 8, 2005
From: SIEMC ACQUISITION CORP
To: EMC TECHNOLOGY, INC.
Reel/Frame 016237/0256 →
Assignment of Assignor's Interest
Jul 18, 2005
From: BLACKA, ROBERT J.; ROLDAN, NELSON
To: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
Reel/Frame 016801/0918 →
Assignment of Assignor's Interest
May 6, 2008
From: KARR, SHAWN E.
To: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
Reel/Frame 020906/0887 →
Assignment of Assignor's Interest
Mar 31, 2012
From: TORSIELLO, ROB; BAILLY, MARK; DAVIDSSON, PAUL
To: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
Reel/Frame 027968/0362 →
Assignment of Assignor's Interest
Aug 30, 2013
From: DAVIDSSON, PAUL; BLACKA, ROBERT; LOH, KAI
To: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
Reel/Frame 031121/0815 →
Merger
Mar 25, 2019
From: SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC.
To: INTERCONNECT DEVICES, INC.
Reel/Frame 048682/0201 →