IP Library › Granted Patent US 7,211,848
Granted Patent B2
US 7,211,848 · App. 10/921,274 · Granted May 1, 2007

Masked spacer etching for imagers

Assignee: Micron Technology, Inc.
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Quick Facts
Patent No.
US 7,211,848
App. No.
10/921,274
Granted
May 1, 2007
Kind
B2
Abstract

The invention relates to a dual masked spacer etch for improved dark current performance in imagers. After deposition of spacer material such as oxide, N-channel regions are first opened for N + source/drain implant and P-channel regions are then opened for P + source/drain implant. Prior to the N + source/drain implant, the wafer receives a patterned first spacer etch. During this first spacer etch, the photosensor region is covered with resist. Prior to the P + source/drain implant, a masked second spacer etch is performed. Again the photosensor region is protected with photoresist. In such a manner, spacers are formed on the gates of both the N-channel and P-channel transistors but in the photodiode region the spacer insulator remains.

Claims (57)

1. An imaging array comprising:

at least one pixel comprising:

a photosensitive region;

a gate structure;

a continuous layer of an insulating material formed over the photosensitive region;

a spacer of the insulating material formed on at least one side of the gate structure; and

a layer of insulating material formed over said continuous layer of insulating material, said gate structure and said spacer.

2. The imaging array of claim 1 , wherein the pixel is part of a CMOS imager.

3. The imaging array of claim 1 , wherein said gate structure is a transfer gate.

4. The imaging array of claim 1 , wherein said gate structure is a reset gate.

5. The imaging array of claim 1 , wherein said gate structure is a source follower gate.

6. An integrated circuit with an imaging array comprising:

at least one pixel comprising:

a photosensitive region;

a gate structure;

a continuous layer of an insulating material formed over the photosensitive region;

a spacer of the insulating material formed on at least one side of the gate structure;

a peripheral circuit, said peripheral circuit having at least one transistor with a second gate structure and a second spacer of the insulating material formed on at least one side of the second gate structure; and

a layer of insulating material formed over said continuous layer of insulating material, said gate structure, said spacer and said peripheral circuit.

7. The integrated circuit of claim 6 , wherein the pixel is part of a CMOS imager.

8. The integrated circuit of claim 6 , wherein said gate structure is a source follower gate.

9. The integrated circuit of claim 6 , wherein said gate structure is a reset gate.

10. The integrated circuit of claim 6 , wherein said gate structure is a transfer gate.

11. The integrated circuit of claim 6 , wherein said gate structure is a row select gate.

12. The integrated circuit of claim 6 , wherein said second gate structure is a source follower gate.

13. The integrated circuit of claim 6 , wherein said second gate structure is a reset gate.

14. The integrated circuit of claim 6 , wherein said second gate structure is a transfer gate.

15. The integrated circuit of claim 6 , wherein said second gate structure is a row select gate.

16. An imager system, comprising:

a processor; and

an integrated circuit connected to provide signals to said processor, said integrated circuit comprising:

a pixel array which comprises a plurality of pixels, at least one said pixel of said pixel array comprising:

a photosensitive region;

at least one gate structure;

a layer of an insulating material over the photosensitive region; and

a spacer of the insulating material formed on at least one side of at least one gate structure; and

a peripheral circuit, said peripheral circuit having at least one transistor with a second gate structure having a second spacer of the insulating material formed on at least one side of the second gate structure.

17. An imaging array comprising:

at least one pixel comprising:

a photosensitive region;

a gate structure for a row select gate;

a layer of an insulating material formed over the photosensitive region; and

a spacer of the insulating material formed on at least one side of the gate structure.

18. An integrated circuit with an imaging array comprising:

at least one pixel comprising:

a photosensitive region;

a gate structure for a row select gate;

a layer of an insulating material formed over the photosensitive region; and

a spacer of the insulating material formed on at least one side of the gate structure; and

a peripheral circuit, said peripheral circuit having at least one transistor with a second gate structure and a spacer of the insulating material formed on at least one side of the second gate structure.

19. An integrated circuit with an imaging array comprising:

at least one pixel comprising:

a photosensitive region;

a gate structure;

a layer of an insulating material formed over the photosensitive region; and

a spacer of the insulating material formed on at least one side of the gate structure; and

a peripheral circuit, said peripheral circuit having at least one transistor with a second gate structure for a row select gate and a spacer of the insulating material formed on at least one side of the second gate structure.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2016
From: RHODES, HOWARD E.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 040329/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2016
From: MICRON TECHNOLOGY, INC.
To: APTINA IMAGING CORPORATION
Reel/Frame 040329/0950 →
Continuity (2)
Division 1066369400 · Sep 17, 2003
Related Publication 20050059180A1 · Mar 17, 2005