Print stripper for ESD control
View Patent ↗A system may include a static dissipative device to secure a semiconductor component, and a printer to print indicia on the semiconductor component while the semiconductor component is secured with the static dissipative device.
1. A system comprising:
a static dissipative device to hold a semiconductor component; and
a printer to print indicia on the semiconductor component while the semiconductor component is held by the static dissipative device, the printer comprising:
an ink pad to contact the semiconductor component and the static dissipative device while the semiconductor component is held by the static dissipative device.
2. A system according to claim 1 , further comprising:
a receiving unit to receive the semiconductor component; and
a cleaner to clean a surface of the semiconductor component.
3. A system according to claim 2 , further comprising:
an inspection station to inspect of the indicia; and
a curing station to cure the indicia.
4. A system according to claim 1 , wherein the static dissipative device exhibits a resistance between 10 5 and 10 11 ohms per square.
5. A system according to claim 1 , further comprising:
a tray conforming to standards promulgated by the Joint Electron Device Engineering Council,
wherein the static dissipative device is to hold the semiconductor component against the tray.
6. A system according to claim 1 , wherein the ink pad comprises silicon.
7. A system according to claim 1 , wherein the static dissipative device is to control a dissipation rate of tribocharge-generated charge to the semiconductor component.
8. A system comprising:
a thin small outline package semiconductor component;
a static dissipative device to hold the semiconductor component; and
a printer to print indicia on the semiconductor component while the semiconductor component is held by the static dissipative device, the printer comprising:
an ink pad to contact the semiconductor component and the static dissipative device while the semiconductor component is held by the static dissipative device.
9. A system according to claim 8 , further comprising:
a receiving unit to receive the semiconductor component;
a cleaner to clean a surface of the semiconductor component;
an inspection station to inspect of the indicia; and
a curing station to cure the indicia.
10. A system according to claim 8 , wherein the static dissipative device exhibits a resistance between 10 5 and 10 11 ohms per square.
11. A system according to claim 8 , wherein the static dissipative device is to control a dissipation rate of tribocharge-generated charge to the semiconductor component.