Methods for fabricating current-carrying structures using voltage switchable dielectric materials
A method is provided for fabricating current-carrying formation on substrates. The method includes providing a substrate including a layer of a voltage switchable dielectric material, forming a mask over the layer of the voltage switchable dielectric material, and forming an electrically conductive layer. The mask includes gaps and the electrically conductive layer is formed in the gaps. The voltage switchable dielectric material has a characteristic voltage and the electrically conductive layer is formed by applying a voltage in excess of the characteristic voltage to the substrate and depositing the electrically conductive material through an electrochemical process such as electroplating.
1. A method for fabricating a current-carrying formation, comprising:
providing a substrate including a layer of a voltage switchable dielectric material having a characteristic voltage;
forming a mask over the layer of the voltage switchable dielectric material, the mask including gaps therein; and
forming an electrically conductive layer by
applying a voltage in excess of the characteristic voltage to the layer of the voltage switchable dielectric material, and
depositing an electrically conductive material within the gaps through an electrochemical process.
2. The method of claim 1 wherein the substrate comprises a non-planar structure.
3. The method of claim 1 wherein the substrate is flexible.
4. The method of claim 1 wherein forming the mask includes patterning a non-conductive layer.
5. The method of claim 4 wherein the non-conductive layer includes a dry resist film.
6. The method of claim 1 wherein the electrochemical process includes electroplating.
7. The method of claim 1 wherein the electrochemical process includes plasma deposition.
8. The method of claim 1 wherein the electrochemical process includes vapor deposition.
9. The method of claim 1 wherein the electrochemical process includes an electrostatic process.
10. The method of claim 1 further comprising removing the mask after forming the electrically conductive layer.
11. The method of claim 10 wherein removing the mask includes stripping with a base solution.
12. The method of claim 1 further comprising polishing the electrically conductive layer.
13. The method of claim 12 wherein polishing includes chemical-mechanical polishing.
14. The method of claim 1 wherein the method does not include forming a seed layer on the substrate before forming the electrically conductive material.
15. The method of claim 1 wherein depositing the electrically conductive material includes depositing a magnetic material.
16. The method of claim 1 wherein the electrochemical process includes a pulse plating process.
17. The method of claim 1 wherein the electrochemical process includes a reverse pulse plating process.
18. The method of claim 1 wherein the substrate includes a pin receptacle and forming the mask includes disposing a gap over the pin receptacle.