Patent Assignment
Reel/Frame 029333/0469
Release of Security Interest
Recorded: 2012-11-20
Pages: 9
Assignor
SILICON VALLEY BANK
Executed: 2012-11-16
Assignee
SHOCKING TECHNOLOGIES, INC.
5870 HELLYER AVENUE, SAN JOSE, CALIFORNIA, 95138
Covered Properties
(36)
Current Carrying Structure Using Voltage Switchable Dielectric Material
Methods for Fabricating Current-Carrying Structures Using Voltage Switchable Dielectric Materials
Wireless communication device using voltage switchable dielectric material
Application:
11/562,222 →
Publication:
US 2012/0195018
Light-Emitting Device Using Voltage Switchable Dielectric Material
Semiconductor Devices Including Voltage Switchable Materials for Over-Voltage Protection
Voltage Switchable Dielectric Material Having Conductive or Semi-Conductive Organic Material
Application:
11/829,946 →
Publication:
US 2008/0029405
Voltage Switchable Dielectric Material Having High Aspect Ratio Particles
Application:
11/829,948 →
Publication:
US 2008/0032049
Device Applications for Voltage Switchable Dielectric Material Having Conductive or Semi-Conductive Organic Material
Application:
11/829,951 →
Publication:
US 2008/0035370
Technique for Plating Substrate Devices Using Voltage Switchable Dielectric Material and Light Assistance
Application:
11/860,522 →
Publication:
US 2008/0073114
System and Method for Including Protective Voltage Switchable Dielectric Material in the Design or Simulation of Substrate Devices
Device Applications for Voltage Switchable Dielectric Material Having High Aspect Ratio Particles
Formulations for Voltage Switchable Dielectric Material Having a Stepped Voltage Response and Methods for Making the Same
Voltage Switchable Dielectric Material Incorporating Modified High Aspect Ratio Particles
Application:
12/193,603 →
Publication:
US 2009/0050856
Current-Carrying Structures Fabricated Using Voltage Switchable Dielectric Materials
Voltage Switchable Dielectric Material Having Bonded Particle Constituents
Voltage Switchable Dielectric Material with Superior Physical Properties for Structural Applications
Application:
12/370,589 →
Publication:
US 2009/0220771
Voltage Switchable Dielectric Materials with Low Band Gap Particles
Application:
12/407,346 →
Publication:
US 2009/0242855
Substrate Device or Package Using Embedded Layer of Voltage Switchable Dielectric Material in a Vertical Switching Configuration
Core Layer Structure Having Voltage Switchable Dielectric Material
Application:
12/541,963 →
Publication:
US 2010/0047535
Voltage Switchable Dielectric Material Containing Boron Compound
Application:
12/561,195 →
Publication:
US 2010/0065785
Voltage Switchable Dielectric Material Containing Conductive Core Shelled Particles
Geometric and Electric Field Considerations for Including Transient Protective Material in Substrate Devices
Metal Deposition
Application:
12/608,297 →
Publication:
US 2010/0038121
Metal Deposition
Application:
12/608,301 →
Publication:
US 2010/0038119
Metal Deposition
Application:
12/608,309 →
Publication:
US 2010/0040896
Metal Deposition
Application:
12/608,315 →
Publication:
US 2010/0044079
Metal Deposition
Application:
12/608,326 →
Publication:
US 2010/0044080
Voltage Switchable Dielectric Material Containing Conductor-on-Conductor Core Shelled Particles
Voltage Switchable Dielectric Material Containing Insulative and/or Low-Dielectric Core Shell Particles
Application:
12/638,632 →
Publication:
US 2010/0148129
Voltage Switchable Dielectric Material Incorporating P and N Type Material
Application:
12/642,799 →
Publication:
US 2010/0159259
Voltage Switchable Dielectric Composition Using Binder with Enhanced Electron Mobility at High Electric Fields
Application:
12/692,573 →
Publication:
US 2010/0187483
Substrates Having Voltage Switchable Dielectric Materials
Method for Electroplating a Substrate
Voltage Switchable Dielectric Material Having a Quantity of Carbon Nanotubes Distributed Therein
Application:
12/714,354 →
Publication:
US 2010/0155672
Method for Creating Voltage Switchable Dielectric Material
Application:
12/714,358 →
Publication:
US 2010/0155671
Components Having Voltage Switchable Dielectric Materials
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 14, 2004
From: KOSOWSKY, LEX
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 015806/0627 →
Assignment of Assignor's Interest
Nov 21, 2006
From: KOSOWSKY, LEX
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 018610/0194 →
Assignment of Assignor's Interest
Mar 27, 2007
From: KOSOWSKY, LEX
To: SHOCKING TECHNOLOGIES INC.
Reel/Frame 019072/0730 →
Assignment of Assignor's Interest
Mar 28, 2007
From: KOSOWSKY, LEX
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 019081/0755 →
Assignment of Assignor's Interest
Jul 30, 2007
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 019619/0567 →
Assignment of Assignor's Interest
Sep 24, 2007
From: KOSOWSKY, LEX, MR; FLEMING, ROBERT, MR.
To: SHOCKING TECHNOLOGIES INC.
Reel/Frame 019869/0662 →
Assignment of Assignor's Interest
Sep 24, 2007
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 019947/0936 →
Assignment of Assignor's Interest
Sep 24, 2007
From: KOSOWSKY, LEX, MR; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES INC
Reel/Frame 019869/0671 →
Assignment of Assignor's Interest
Jun 5, 2008
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES INC.
Reel/Frame 021052/0105 →
Assignment of Assignor's Interest
Aug 21, 2008
From: KOSOWSKY, LEX; FLEMING, ROBERT; WU, JUNJUN
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 021422/0873 →
Assignment of Assignor's Interest
Sep 24, 2008
From: KOSOWSKY, LEX
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 021657/0778 →
Assignment of Assignor's Interest
May 5, 2009
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 022642/0058 →
Assignment of Assignor's Interest
May 8, 2009
From: FLEMING, ROBERT; KOSOWSKY, LEX; WU, JUNJUN
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 022661/0347 →
Assignment of Assignor's Interest
Jun 1, 2009
From: KOSOWSKY, LEX; FLEMING, ROBERT; GRAYDON, BHRET
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 022762/0606 →
Assignment of Assignor's Interest
Sep 25, 2009
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 023287/0743 →
Assignment of Assignor's Interest
Oct 19, 2009
From: FLEMING, ROBERT; KOSOWSKY, LEX; SHI, NING; WU, JUNJUN
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 023393/0004 →
Assignment of Assignor's Interest
Oct 23, 2009
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES INC.
Reel/Frame 023417/0939 →
Security Agreement
Jul 23, 2010
From: SHOCKING TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 024733/0299 →
Security Agreement
Nov 20, 2012
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 029340/0806 →
Assignment of Assignor's Interest
Jan 23, 2014
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 032123/0747 →