IP Library Patent Application 11829946
Patent Application
App. No. 11/829,946

VOLTAGE SWITCHABLE DIELECTRIC MATERIAL HAVING CONDUCTIVE OR SEMI-CONDUCTIVE ORGANIC MATERIAL

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
11/829,946
Abstract

One or more embodiments provide for a composition that includes (i) organic material that is conductive or semi-conductive, and (ii) conductor and/or semiconductor particles other than the organic material. The organic material and the conductor and/or semiconductor particles are combined to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

Claims (54)

1 . A composition comprising:

organic material that is conductive or semi-conductive, wherein said organic material is either solvent soluble or dispersed within the composition at nanoscale; and

conductor and/or semiconductor particles other than said organic material;

wherein said organic material and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level.

2 . The composition of claim 1 , further comprising a binder, and wherein the organic material and the conductor and/or semiconductor particles are distributed in the binder.

3 . A composition comprising:

a binder;

organic material that is conductive or semi-conductive, wherein said organic material is either soluble in the binder or dispersed as nanoscale particles within the binder; and

conductor and/or semiconductor particles other than said organic material, said conductor and/or semiconductor particles being distributed in the binder;

wherein said organic material and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level.

4 . The composition of claim 3 , wherein the conductive organic material and the conductor or semiconductor particles are substantially uniformly distributed in an overall thickness of the binder.

5 . The composition of claim 3 , wherein the organic material includes single and/or multi-walled carbon nanotubes.

6 . The composition of claim 3 , wherein the organic material includes C60 or C70 fullerenes.

7 . The composition of claim 3 , wherein the organic material includes a conductive or semi-conductive monomer, oligomer, or polymer.

8 . The composition of claim 3 , wherein the organic material includes electron donor and/or electron acceptor molecules or polymers.

9 . The composition of claim 3 , wherein the organic material includes a compound selected from a class of thiophenes, aniline, phenylenes, vinylenes, flourenes, naphthalene, pyrrolv, acetylene, carbazole, pyrrolidone, cyano materials, anthracene, pentacene, rubrene, or perylene.

10 . The composition of claim 3 , wherein the organic material includes a compound selected from Poly( 3 , 4 ethylenedioxythiophene)/poly(styrenesulfonate), (8-hydroxyquinolinolato) aluminum (III), N,N′-Bis(3-methylphenyl-N,N′-diphenylbenzidine [TPD], N,N′-Di-[(naphthalenyl)-N,N′diphenyl]-1,1′-biphenyl-4,4′-diamine [NPD].

11 . The composition of claim 3 , wherein said organic material includes a pure carbon compound corresponding to one of carbon graphite, carbon fiber, or a diamond powder.

12 . The composition of claim 3 , wherein the conductor and/or semiconductor particles includes a metal or a metal complex.

13 . The composition of claim 12 , wherein the metal complex is selected from a group consisting of oxides, metal nitrides, metal carbides, metal borides, metal sulfides, or a combination thereof.

14 . The composition of claim 3 , wherein the conductor and/or semiconductor particles include a titanium compound.

15 . The composition of claim 14 , wherein the conductor and/or semiconductor particles include titanium dioxide.

16 . The composition of claim 14 , wherein the titanium compound includes titanium diboride or titanium nitride.

17 . The composition of claim 3 , further comprising inorganic semi-conductor particles distributed in the binder.

18 . The composition of claim 3 , wherein the inorganic semi-conductor particles include particles selected from a group consisting of silicon, silicon carbide, boron nitride, aluminum nitride, nickel oxide, zinc oxide, zinc sulfide, bismuth oxide, cerium oxide, iron oxide.

19 . The composition of claim 3 , where at least some of the conductor and/or semiconductor particles are surface bonded by said organic material.

20 . The composition of claim 19 , wherein said organic material that surface coats the conductor and/or semiconductor particles includes carbon nanotubes.

21 . The composition of claim 20 , wherein the conductor and/or semiconductor particles includes one of titanium dioxide, titanium nitride, titanium diboride.

22 . The composition of claim 19 , wherein said organic material that surface coats the conductor and/or semiconductor particles includes organic conductive particles that are grafted onto a surface of individual conductive particles in the binder.

23 . The composition of claim 3 , wherein the binder material is formed from a material selected from a group consisting of silicone polymers, epoxy, polyimide, polyethylene, phenolic resin, polypropylene, polyphenylene oxide, polysulphone, solgel mateterials, ceramers.

24 . The composition of claim 3 , wherein said organic material includes a chemical moiety that covalently bonds to the binder.

25 . A voltage switchable dielectric material having a quantity of carbon nanotubes distributed therein.

26 . The voltage switchable dielectric material of claim 25 , further comprising a binder, and wherein the quantity of carbon nanotubes is distributed as part of the binder.

27 . The voltage switchable dielectric material of claim 26 , further comprising titanium dioxide distributed in the binder.

28 . A composition comprising:

a binder that comprises at least a portion of a binder of the composition, the binder having a volume in the composition that is in a range of 20 to 80% of a composition volume;

conductor particles, having a volume of the composition in a range of 10% to 60% of the composition volume; and

organic material that is conductive or semiconductive and having a volume of the composition in a range of 0.01-40%;

wherein the binder, conductor particles, and organic material combine to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

29 . The composition of claim 28 , wherein said organic material is a solvent soluble in the binder.

30 . The composition of claim 28 , wherein said organic material is distributed as nano-scaled particles in the binder.

31 . A method for creating voltage switchable dielectric material, the method comprising:

creating a mixture containing (i) a binder that is dielectric, (ii) metallic and/or inorganic conductor or semi-conductor particles, and (iii) conductive or semi-conductive organic material that is distributed in the mixture as either a solvent soluble or as nano-scaled particles, wherein creating the mixture includes using a quantity of each of the binder, the metallic and/or inorganic conductor or semi-conductor particles, and the organic material so that the mixture, when cured, is (i) dielectric in absence of a voltage that exceeds a characteristic voltage, and (ii) conductive in presence of the voltage that exceeds the characteristic voltage; and

curing the mixture.

32 . The method of claim 31 , further comprising applying the mixture to a target location on a device, and wherein curing the mixture includes curing the mixture at the target location.

33 . The method of claim 32 , creating a mixture includes creating the mixture using fullerenes as the organic material.

34 . The method of claim 31 , wherein the fullerenes are functionalized C60 or C70.

35 . The method of claim 31 , wherein the fullerenes are carbon nanotubes.

36 . The method of claim 31 , wherein the metallic and/or inorganic conductor or semi-conductor particles are selected from a group consisting of copper, aluminum, nickel, and steel, silicon, silicon carbide, boron nitride, aluminum nitride, nickel oxide, zinc oxide, zinc sulfide, bismuth oxide, cerium oxide, iron oxide.

37 . The method of claim 31 , wherein the metallic and/or inorganic conductor or semi-conductor particles includes a titanium compound.

38 . The method of claim 31 , wherein the metallic and/or inorganic conductor or semi-conductor particles includes a titanium dioxide.

39 . A voltage switchable dielectric material formed by:

creating a mixture comprising (i) a binder that is dielectric, (ii) metallic and/or inorganic conductor or semi-conductor particles, and (iii) conductive or semi-conductive organic material that is distributed as either a solvent soluble or as nano-scale particles in the mixture, wherein creating the mixture includes using a quantity of each of the binder, the metallic and/or inorganic conductor or semi-conductor particles, and the organic material so that the mixture, when cured, is (i) dielectric in absence of a voltage that exceeds a characteristic voltage, and (ii) conductive in presence of the voltage that exceeds the characteristic voltage; and

curing the mixture.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2014
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 032123/0747 →
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2012
From: SILICON VALLEY BANK
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 029333/0469 →
SECURITY AGREEMENT Recorded Nov 20, 2012
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 029340/0806 →
SECURITY AGREEMENT Recorded Jul 23, 2010
From: SHOCKING TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 024733/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2007
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 019619/0567 →