IP Library Patent Application 12561195
Patent Application
App. No. 12/561,195

VOLTAGE SWITCHABLE DIELECTRIC MATERIAL CONTAINING BORON COMPOUND

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Quick Facts
Patent No.
US None
App. No.
12/561,195
Abstract

A composition of voltage switchable dielectric (VSD) material that comprises Boron. According to embodiments, VSD material is formulated that includes particle constituents that include one or more of Boron-nitride polymers, Boron nanotubes, and/or Boron nanoparticles.

Claims (28)

1 . A composition of voltage switchable dielectric (VSD) material comprising Boron material.

2 . The composition of claim 1 , wherein the Boron material comprises a concentration of nano-dimensioned Boron particles.

3 . The composition of claim 1 , wherein the Boron material includes Boron-nitride.

4 . The composition of claim 1 , wherein the Boron material includes Boron-nitride polymers.

5 . The composition of claim 2 , wherein the Boron material includes Boron-nitride nanotubes.

6 . The composition of claim 1 , wherein the VSD material further comprises a concentration of high-aspect ratio nano-particles other than Boron material.

7 . The composition of claim 5 , wherein the concentration of high-aspect ratio nano-particles include organic high-aspect ratio particles.

8 . The composition of claim 5 , wherein the concentration of high-aspect ratio nano-particles include metallic high-aspect ratio particles.

9 . The composition of claim 1 , wherein the Boron material includes a combination of Boron-nitride polymers, Boron nanoparticles, and/or Boron nanorods.

11 . The composition of claim 1 , further comprising a concentration of particles that exceeds a percolation threshold of the VSD composition.

12 . The composition of claim 1 , further comprising a concentration of varistor particles.

13 . A method for forming a composition of voltage switchable dielectric (VSD) material, the method comprising:

selecting particle constituents for the composition, wherein at least some of the particle constituents include Boron;

uniformly mixing the particle constituents in a binder.

14 . The method of claim 13 , wherein the Boron particle constituents correspond to one or more of Boron-nitride polymers, Boron nanotubes, and/or Boron nanoparticles.

15 . The method of claim 14 , further comprising adjusting an electrical characteristic of the VSD material by doping the Boron particle constituents with carbon.

16 . A composition comprising:

a binder;

multiple types of particle constituents, including a concentration of conductor and/or semiconductor particle constituents, and a concentration of particles that include Boron; and

wherein said composition is (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of a voltage that exceeds a characteristic voltage level of the composition.

17 . The composition of claim 16 , wherein the binder is a polymer.

18 . The composition of claim 16 , wherein the multiple types of particle constituents are mixed so that the composition is non-layered.

19 . The composition of claim 16 , wherein the concentration of particles that include Boron include nano-dimensioned Boron particles.

20 . The composition of claim 13 , wherein the concentration of particles that include Boron-nitride.

21 . The composition of claim 13 , wherein the particle constituents exceed a percolation threshold of the composition.

22 . The composition of claim 13 , wherein the multiple types of particle constituents include a concentration of varistor particles.

23 . The composition of claim 13 , wherein the concentration of particles that include Boron further include Boron-nitride polymers.

24 . The composition of claim 13 , wherein the concentration of particles that include Boron further include Boron-nitride nanotubes.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2014
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 032123/0747 →
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2012
From: SILICON VALLEY BANK
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 029333/0469 →
SECURITY AGREEMENT Recorded Nov 20, 2012
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 029340/0806 →
SECURITY AGREEMENT Recorded Jul 23, 2010
From: SHOCKING TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 024733/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2009
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 023287/0743 →