IP Library Patent Application 12407346
Patent Application
App. No. 12/407,346

VOLTAGE SWITCHABLE DIELECTRIC MATERIALS WITH LOW BAND GAP POLYMER BINDER OR COMPOSITE

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Quick Facts
Patent No.
US None
App. No.
12/407,346
Abstract

A composition is provided that includes a polymer binder, and one or more classes of particle constituents. At least one class of particle constituents includes semiconductive particles that individually have a band gap that is no greater than 2 eV. As VSD material, the composition is (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage that exceeds the characteristic voltage level.

Claims (26)

1 . A composition of voltage switchable dielectric material comprising a polymer binder comprising a mixture of two or more types of polymers or copolymers, wherein an effective band gap of the polymer binder is less than 2 eV.

2 . The composition of claim 1 , wherein at least one type of polymer in the polymer binder has a band gap that is sufficiently low to enable the effective band gap of the polymer binder to be less than 2 eV.

3 . The composition of claim 1 , wherein at least another type of polymer in the polymer binder is epoxy.

4 . A composition comprising:

a polymer binder that has an effective band gap of less than 2 eV;

one or more classes of particle constituents, including a class of semiconductive particles that individually have a band gap that is less than 2 eV;

wherein said composition is (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage that exceeds the characteristic voltage level.

5 . The composition of claim 4 , wherein the semiconductive particles are micron or nanometer in dimension.

6 . The composition of claim 4 , wherein the band gap of the individual semiconductive particles is substantially equal to or less than the band gap of the polymer binder.

7 . The composition of claim 4 , wherein the one or more classes of particle constituents include conductive particles.

8 . The composition of claim 4 , wherein the one or more classes of particle constituents include high aspect ratio particles other than the class of semiconductive particles with the band gap of less than 2 eV.

9 . The composition of claim 4 , wherein the semiconductive particles include or correspond to compound semiconductors of a class III-V, II-VI, III-VI, and I-III-VI.

10 . The composition of claim 9 , wherein the compound semiconductors are high aspect ratio particles.

11 . The composition of claim 9 , wherein the compound semiconductor includes at least some concentration of Quantum Dot particles.

12 . The composition of claim 9 , wherein the semiconductor includes at least some concentration of nano-sized crystalline silicon.

13 . The composition of claim 4 , wherein the polymer corresponds to epoxy or acrylate.

14 . The composition of claim 4 , wherein the polymer binder includes a blend of polymers that includes at least one polymer with band gap that is sufficiently low to enable the effective band gap of the blend to be less than 2 eV.

15 . A device comprising:

a protective layer of voltage switchable dielectric (VSD) material comprising:

a polymer binder;

a concentration of semiconductive particles dispersed in the polymer that individually have a band gap that is substantially equal to or less than a band gap of the polymer binder.

16 . The device of claim 15 , wherein the concentration of semiconductive particles are micron or nanometer in dimension.

17 . The device of claim 16 , wherein the VSD material further comprises, in addition to the concentration of semiconductive particles, a concentration of one or more classes of particles corresponding to conductive particles, higher band gap semiconductive particles, or high aspect ratio particles.

18 . The device of claim 15 , wherein the semiconductive particles with the band gap of less than 2 eV include or correspond to compound semiconductors of a class III-V, II-VI, III-VI, and I-III-VI.

19 . The device of claim 15 , wherein the semiconductor particles with the band gap of less than 2 eV includes at least some concentration of Quantum Dot particles.

20 . The device of claim 15 , wherein the semiconductor particles with the band gap of less than 2 eV includes at least some concentration of nanometer dimensioned crystalline silicon.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2014
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 032123/0747 →
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2012
From: SILICON VALLEY BANK
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 029333/0469 →
SECURITY AGREEMENT Recorded Nov 20, 2012
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 029340/0806 →
SECURITY AGREEMENT Recorded Jul 23, 2010
From: SHOCKING TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 024733/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2009
From: FLEMING, ROBERT; KOSOWSKY, LEX; SHI, NING; WU, JUNJUN
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 023393/0004 →