IP Library Patent Application 11829951
Patent Application
App. No. 11/829,951

DEVICE APPLICATIONS FOR VOLTAGE SWITCHABLE DIELECTRIC MATERIAL HAVING CONDUCTIVE OR SEMI-CONDUCTIVE ORGANIC MATERIAL

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Patent No.
US None
App. No.
11/829,951
Abstract

An electronic device comprising voltage switchable dielectric material (VSD) material that is composed in part of organic particles.

Claims (38)

1 . A device comprising:

a formation of voltage switchable dielectric (VSD) material, wherein the VSD material comprises:

a binder;

organic material that is conductive or semi-conductive, wherein said organic material is either soluble in the binder or dispersed as nanoscale particles within the binder; and

conductor and/or semiconductor particles other than said organic material, said conductor and/or semiconductor particles being distributed in the binder;

wherein said organic material and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level.

2 . The device of claim 1 , wherein the conductive organic material and the conductor or semiconductor particles the formation of VSD material are substantially uniformly distributed in an overall thickness of the binder.

3 . The device of claim 2 , wherein the organic material the formation of VSD material includes single and/or multi-walled carbon nanotubes.

4 . The device of claim 1 , wherein the device corresponds to a printed circuit board.

5 . The device of claim 4 , wherein the formation of VSD material is provided as a layer within the substrate device.

6 . The device of claim 4 , wherein the formation of VSD material is provided as trace elements on a surface of the substrate device.

7 . The device of claim 1 , wherein the device is a device selected from a group consisting of a discrete device, a semi-conductor package, a display device or backplane, a light-emitting diode, and a radio-frequency identification device.

8 . The device of claim 1 , wherein said organic material of the formation of VSD material includes a pure carbon compound corresponding to one of carbon graphite, carbon fiber, or a diamond powder.

9 . The device of claim 1 , wherein the conductor and/or semiconductor particles of the formation of VSD material includes a metal or a metal complex.

10 . An electronic device comprising:

a layer of voltage switchable dielectric (VSD) material formed by:

(i) creating a mixture comprising a binder, metallic and/or inorganic semi-conductor particles, and conductive or semi-conductive organic material;

(ii) applying the mixture to a target location on the device; and

(iii) curing the mixture at the target location.

11 . The electronic device of claim 10 , further comprising:

a first electrode and a second electrode, and

wherein the target location is a span between the first and second electrode.

12 . The electronic device of claim 10 , wherein the device corresponds to a substrate device, and wherein the VSD material is provided as a layer that is within a thickness of the substrate.

13 . The electronic device of claim 12 , wherein the VSD material underlies one or more contact elements for connecting the substrate to another device, and wherein the one or more contact elements include an aperture to electrically connect a surface of an individual contact element to the VSD layer.

14 . The electronic device of claim 10 , wherein the electronic device is a device selected from a group consisting of a light-emitting diode, a radio-frequency device, a discrete device, and a semi-conductor package or substrate.

15 . The electronic device of claim 10 , wherein the conductive or semi-conductive organic material and the conductor or semiconductor particles the formation of VSD material are substantially uniformly distributed in an overall thickness of the binder.

16 . The device of claim 15 , wherein the conductive or semi-conductive organic material of the formation of VSD material includes single and/or multi-walled carbon nanotubes.

17 . The device of claim 10 , wherein the conductive or semi-conductive organic material of the formation of VSD material includes a pure carbon compound corresponding to one of carbon graphite, carbon fiber, or a diamond powder.

18 . The device of claim 10 , wherein the conductor and/or semiconductor particles the formation of VSD material includes a metal or a metal complex.

19 . A method for electroplating a substrate, the method comprising:

applying a voltage switchable dielectric (VSD) material onto a target region of a device, said VSD material comprising:

a binder;

organic material that is conductive or semi-conductive, wherein said organic material is either soluble in the binder or dispersed as nanoscale particles within the binder; and

conductor and/or semiconductor particles other than said organic material, said conductor and/or semiconductor particles being distributed in the binder;

wherein said organic material and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level;

forming a pattern using the VSD material;

applying the voltage that exceeds the characteristic voltage level so that the VSD material is conductive;

while applying the voltage, exposing the target region of the device to an electrolytic medium.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2014
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 032123/0747 →
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2012
From: SILICON VALLEY BANK
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 029333/0469 →
SECURITY AGREEMENT Recorded Nov 20, 2012
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 029340/0806 →
SECURITY AGREEMENT Recorded Jul 23, 2010
From: SHOCKING TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 024733/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2007
From: KOSOWSKY, LEX; FLEMING, ROBERT
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 019619/0567 →