Voltage switchable dielectric material having bonded particle constituents
A voltage switchable dielectric material comprising a concentration of multi-component particles that are individually formed by a mechanical or mechanochemical bonding process that bonds a semiconductive or conductive-type host particle with multiple insulative, conductive, or semi-conductive guest particles.
1. A composition comprising:
a binder;
particles dispersed uniformly within the binder, wherein at least some of the particles are multi-component particles that singularly comprise: a conductive host particle that is micron sized, and multiple insulative or semi-conductive guest particles that are nano or sub-micron sized;
wherein at least some of the particles comprise the conductive host particle being bonded with the multiple insulative or semi-conductive guest particles through mechanical or mechano-chemical bonding; and
wherein said composition is (i) dielectric in absence of any voltage that exceeds a characteristic voltage level, and (ii) conductive with application of a voltage that exceeds the characteristic voltage level.
2. The composition of claim 1 , wherein the particles are dispersed into the binder beyond a percolation threshold.
3. The composition of claim 2 , wherein the percolation threshold coincides with a conductor or semiconductor particle concentration in range of 20-80% by volume.
4. The composition of claim 1 , wherein the guest particles include organic material.
5. The composition of claim 4 , wherein the organic material corresponds to carbon nanotubes, perylene, or graphene.
6. The composition of claim 1 , wherein the multiple insulative or semi-conductive guest particles includes titanium dioxide or fumed silica.
7. The composition of claim 1 , wherein at least some of the particles are (i) selected from a group consisting of graphenes, carbon nanotubes, nanowires, nanorods, antimony in oxide (ATO) nanorods, and (ii) uniformly dispersed in the binder.
8. The composition of claim 1 , wherein the particles are dispersed into the binder beyond a percolation threshold, and wherein the characteristic voltage is dependent in part on a resistive characteristic of the multiple insulative or semi-conductive guest particles of the multi-component particles.
9. A composition comprising:
a binder;
particles dispersed uniformly within the binder, wherein at least some of the particles are multi-component particles that singularly comprise: a conductive host particle, and multiple insulative or semi-conductive guest particles that include organic material;
wherein at least some of the particles comprise the conductive host particle being bonded with the multiple insulative or semi-conductive guest particles through mechanical or mechano-chemical bonding; and
wherein said composition is (i) dielectric in absence of any voltage that exceeds a characteristic voltage level, and (ii) conductive with application of a voltage that exceeds the characteristic voltage level.
10. The composition of claim 9 , wherein the particles are dispersed into the binder beyond a percolation threshold.
11. The composition of claim 10 , wherein the percolation threshold coincides with a conductor or semiconductor particle concentration in range of 20-80% by volume.
12. The composition of claim 9 , wherein, for the at least some of the multi-component particles, the conductive host particle are micron sized, and multiple insulative or semi-conductive guest particles are nano or sub-micron sized.
13. The composition of claim 9 , wherein the organic material corresponds to carbon nanotubes, perylene, or graphene.
14. The composition of claim 9 , wherein the multiple insulative or semi-conductive guest particles includes titanium dioxide or fumed silica.
15. The composition of claim 9 , wherein at least some of the particles are (i) selected from a group consisting of graphenes, carbon nanotubes, nanowires, nanorods, antimony in oxide (ATO) nanorods, and (ii) uniformly dispersed in the binder.
16. The composition of claim 9 , wherein the particles are dispersed into the binder beyond a percolation threshold, and wherein the characteristic voltage is dependent in part on a resistive characteristic of the multiple insulative or semi-conductive guest particles of the multi-component particles.