Schottky barrier integrated circuit
A Schottky barrier integrated circuit is disclosed, the circuit having at least one PMOS device or at least one NMOS device, at least one of the PMOS device or NMOS device having metal source-drain contacts forming Schottky barrier or Schottky-like contacts to the semiconductor substrate. The device provides a new distribution of mobile charge carriers in the bulk region of the semiconductor substrate, which improves device and circuit performance by lowering gate capacitance, improving effective carrier mobility {overscore (μ)}, reducing noise, reducing gate insulator leakage, reducing hot carrier effect and improving reliability.
1 . An integrated circuit, the integrated circuit comprising:
at least one NMOS device or PMOS device;
wherein at least one of the NMOS devices or PMOS devices is a Schottky barrier MOS device with substantial bulk charge transport.
2 . The integrated circuit of claim 1 wherein at least one of the NMOS device and PMOS device exhibits C g,fr of less than or equal to 75% of C g tot, ideal .
3 . The integrated circuit of claim 1 wherein at least one of the NMOS device and PMOS device exhibit transconductance of at least 90% of the maximum transconductance when gate voltage V g is equal to supply voltage, V dd .
4 . The integrated circuit of claim 1 wherein at least one of the NMOS device and PMOS device is a Schottky barrier device comprising:
a semiconductor substrate;
a gate electrode on the semiconductor substrate;
a source electrode and a drain electrode on the semiconductor substrate defining a channel region having a channel-length and having mobile charge carriers, wherein at least one of the source electrode and drain electrode forms a Schottky or Schottky-like contact to the substrate.
5 . The integrated circuit of claim 4 wherein the semiconductor substrate is comprised of silicon, strained silicon, silicon on insulator, silicon germanium, gallium arsenide, or indium phosphide.
6 . The integrated circuit of claim 4 wherein the source electrode and the drain electrode of the Schottky barrier PMOS device are formed of any one or combination of Platinum Silicide, Palladium Silicide or Iridium Silicide.
7 . The integrated circuit of claim 4 wherein the source electrode and the drain electrode of the Schottky barrier NMOS device are formed of rare-earth silicides.
8 . The integrated circuit of claim 4 wherein at least one of the source and drain electrodes of the Schottky barrier PMOS devices or Schottky barrier NMOS devices forms a Schottky or Schottky-like contact with the semiconductor substrate at least in areas adjacent to the channel.
9 . The integrated circuit of claim 4 wherein an entire interface between at least one of the source and the drain electrodes of the Schottky barrier PMOS devices or Schottky barrier NMOS devices and the semiconductor substrate forms a Schottky contact or Schottky-like region with the semiconductor substrate.
10 . The integrated circuit of claim 4 wherein the channel contains channel dopants in the semiconductor substrate.
11 . The integrated circuit of claim 10 wherein the channel dopant concentration varies in a vertical direction of the semiconductor substrate and is substantially constant in a lateral direction in the semiconductor substrate.
12 . The integrated circuit of claim 10 wherein the channel dopant concentration varies in a vertical direction and a lateral direction in the semiconductor substrate.
13 . The integrated circuit of claim 10 wherein the channel dopants for the Schottky barrier PMOS device comprises Arsenic, Phosphorous, Antimony or any combination thereof.
14 . The integrated circuit of claim 10 wherein the channel dopants for the Schottky barrier NMOS device comprises Boron, Indium, Gallium or any combination thereof.
15 . The integrated circuit of claim 4 wherein the gate electrode of the Schottky barrier PMOS devices or Schottky barrier NMOS devices has a length not exceeding 500 nm.
16 . The integrated circuit of claim 4 wherein the gate electrode of at least one of the Schottky barrier NMOS or Schottky barrier PMOS devices comprises:
an insulating layer on the semiconductor substrate;
a conducting film on the insulating layer; and
at least one insulating layer on at least one sidewall of the conducting film.
17 . The integrated circuit of claim 16 wherein the mobile charge carriers are substantially removed from the interface of the insulating layer and the semiconductor substrate.
18 . The integrated circuit of claim 16 wherein the interaction of the mobile charge carriers with the interface of the insulating layer and the semiconductor substrate is substantially reduced.
19 . The integrated circuit of claim 16 wherein the Schottky barrier NMOS device has a gate electrode conducting film comprised of phosphorous doped polysilicon.
20 . The integrated circuit of claim 16 wherein the Schottky barrier PMOS device has a gate electrode conducting film comprised of boron doped polysilicon.
21 . The integrated circuit of claim 16 wherein the Schottky barrier NMOS device has a metal gate electrode conducting film.
22 . The integrated circuit of claim 16 wherein the Schottky barrier PMOS device has a metal gate electrode conducting film.
23 . The integrated circuit of claim 16 wherein the insulating layer on the semiconductor substrate is silicon dioxide.
24 . The integrated circuit of claim 16 wherein the insulating layer on the semiconductor substrate is a high k dielectric formed from a member comprised of nitrided silicon dioxide, silicon nitride, metal oxides, or any combination thereof.
25 . The integrated circuit of claim 1 , wherein the device further comprises at least one NMOS device or PMOS device having an impurity doped source and drain electrode electrically connected to a Schottky barrier NMOS or Schottky barrier PMOS device.
26 . A CMOS circuit, the CMOS circuit, comprising:
at least one Schottky barrier NMOS device;
at least one Schottky barrier PMOS device, electrically connected to at least one Schottky barrier NMOS device;
wherein at least one of the Schottky barrier NMOS devices or the Schottky barrier PMOS devices provides substantial bulk transport.
27 . The CMOS circuit of claim 26 wherein at least one of the Schottky barrier NMOS device and Schottky barrier PMOS device exhibits C g,f T of less than or equal to 75% of C g tot, ideal .
28 . The CMOS circuit of claim 26 wherein at least one of the Schottky barrier NMOS device and Schottky barrier PMOS device exhibit transconductance of at least 90% of the maximum transconductance when gate voltage V g is equal to supply voltage, V dd .
29 . The CMOS circuit of claim 26 wherein the Schottky barrier NMOS and Schottky barrier PMOS devices each comprises:
a semiconductor substrate;
a gate electrode on the semiconductor substrate;
a source electrode and a drain electrode on the semiconductor substrate defining a channel region having a channel-length and having mobile charge carriers, wherein at least one of the source electrode and drain electrode forms a Schottky or Schottky-like contact to the substrate.
30 . The CMOS circuit of claim 29 wherein the semiconductor substrate is comprised of silicon, strained silicon, silicon on insulator, silicon germanium, gallium arsenide, or indium phosphide.
31 . The CMOS circuit of claim 29 wherein the source electrode and the drain electrode of the Schottky barrier PMOS device are formed from a member comprised of Platinum Silicide, Palladium Silicide or Iridium Silicide.
32 . The CMOS circuit of claim 29 wherein the source electrode and the drain electrode of the Schottky barrier NMOS device are formed from a member comprised of rare-earth silicides.
33 . The CMOS circuit of claim 29 wherein at least one of the source and drain electrodes of the Schottky barrier PMOS devices or Schottky barrier NMOS devices forms a Schottky or Schottky-like contact with the semiconductor substrate at least in areas adjacent to the channel.
34 . The CMOS circuit of claim 29 wherein an entire interface between at least one of the source and the drain electrodes of the Schottky barrier PMOS devices or Schottky barrier NMOS devices and the semiconductor substrate forms a Schottky contact or Schottky-like region with the semiconductor substrate.
35 . The CMOS circuit of claim 35 wherein the channel contains channel dopants in the semiconductor substrate.
36 . The CMOS circuit of claim 35 wherein the channel dopant concentration varies in a vertical direction of the semiconductor substrate and is substantially constant in a lateral direction in the semiconductor substrate.
37 . The CMOS circuit of claim 35 wherein the channel dopant concentration varies in a vertical direction and a lateral direction in the semiconductor substrate.
38 . The CMOS circuit of claim 35 wherein the channel dopants for the Schottky barrier PMOS device comprises Arsenic, Phosphorous, Antimony or any combination thereof.
39 . The CMOS circuit of claim 35 wherein the channel dopants for the Schottky barrier NMOS device comprises Boron, Indium, Gallium or any combination thereof.
40 . The CMOS circuit of claim 29 wherein the gate electrode of the Schottky barrier PMOS devices or Schottky barrier NMOS devices has a length not exceeding 500 nm.
41 . The CMOS circuit of claim 29 wherein the gate electrode of at least one of the Schottky barrier NMOS or Schottky barrier PMOS devices comprises:
an insulating layer on the semiconductor substrate;
a conducting film on the insulating layer; and
at least one insulating layer on at least one sidewall of the conducting film.
42 . The CMOS circuit of claim 29 wherein the mobile charge carriers are substantially removed from the interface of the insulating layer and the semiconductor substrate.
43 . The CMOS circuit of claim 29 wherein the interaction of the mobile charge carriers with the interface of the insulating layer and the semiconductor substrate is substantially reduced.
44 . The CMOS circuit of claim 41 wherein the Schottky barrier NMOS device has a gate electrode conducting film comprised of phosphorous doped polysilicon.
45 . The CMOS circuit of claim 41 wherein the Schottky barrier PMOS device has a gate electrode conducting film comprised of boron doped polysilicon.
46 . The CMOS circuit of claim 41 wherein the Schottky barrier NMOS device has a metal gate electrode conducting film.
47 . The CMOS circuit of claim 41 wherein the Schottky barrier PMOS device has a metal gate electrode conducting film.
48 . The CMOS circuit of claim 41 wherein the insulating layer on the semiconductor substrate is silicon dioxide.
49 . The CMOS circuit of claim 48 wherein the insulating layer on the semiconductor substrate is a high k dielectric formed from a member comprised of nitrided silicon dioxide, silicon nitride, metal oxides, or any combination thereof.
50 . The CMOS circuit of claim 26 , wherein the device further comprises at least one NMOS device or PMOS device having an impurity doped source and drain electrode electrically connected to the Schottky barrier NMOS or Schottky barrier PMOS devices.