IP Library Granted Patent US 7,079,424
Granted Patent B1
US 7,079,424 · App. 10/945,914 · Granted Jul 18, 2006

Methods and systems for reducing erase times in flash memory devices

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Quick Facts
Patent No.
US 7,079,424
App. No.
10/945,914
Granted
Jul 18, 2006
Kind
B1
Abstract

A method is provided for erasing a memory cell having a substrate, a control gate, a floating gate, a source region and a drain region. The method includes pre-programming the memory cell to raise a threshold voltage of the memory cell to a first predetermined level, wherein pre-programming the memory cell does not include a verification process for ensuring that the threshold voltage of the memory cell has been raised to the first predetermined level. The memory cell may be erased to lower the threshold voltage of the memory cell to a second predetermined level.

Claims (60)

1. A method for erasing a memory cell having a control gate and a floating gate formed over a substrate, a source region and a drain region, comprising:

pre-programming the memory cell to raise a threshold voltage of the memory cell to a first predetermined level,

wherein pre-programming the memory cell does not include a verification process for ensuring that the threshold voltage of the memory cell has been raised to the first predetermined level;

erasing the memory cell by applying a voltage to the memory cell to lower the threshold voltage of the memory cell to a second predetermined level;

performing erase verification on the memory cell to determine whether the threshold voltage of the memory cell has been lowered to the second predetermined level; and

applying a second erase voltage to the memory cell to lower the threshold voltage of the memory cell to the second predetermined level if it is determined during erase verification that the threshold voltage of the memory cell has not been lowered to the second predetermined level.

2. The method of claim 1 , wherein pre-programming the memory cell further comprises:

applying a voltage to the memory cell to raise the threshold voltage of the memory cell to the first predetermined level.

3. The method of claim 1 , wherein erasing the memory cell further comprises:

applying a constant voltage to the substrate of the memory cell; and

applying erase pulses to the control gate of the memory cell, the erase pulses having an applied voltage and pulse width.

4. The method of claim 3 , wherein the pulse width of the erase pulses is about 1.2 milliseconds.

5. The method of claim 3 , wherein the applied voltage of the erase pulses includes a number of voltages ranging from a first voltage to a second voltage.

6. The method of claim 5 , wherein the first voltage is about −5.3 volts and the second voltage is about −9.3 volts.

7. The method of claim 3 , wherein applying erase pulses further comprises:

initializing the applied voltage to a first voltage;

applying a series of successive pulses at the first voltage;

incrementing the applied voltage by a predetermined voltage;

applying a series of successive pulses at the incremented voltage; and

repeating the incrementing and applying until the applied voltage reaches a second voltage.

8. The method of claim 7 , wherein the series of successive pulses includes four successive pulses.

9. The method of claim 7 , wherein the predetermined voltage is about 125 millivolts.

10. The method of claim 3 , wherein the applying erase pulses further comprises:

initializing the applied voltage to a first voltage;

applying a first series of successive pulses at the first voltage;

incrementing the first voltage by a predetermined voltage;

applying the first series of successive pulses at the incremented voltage;

repeating the incrementing and applying until a triggering event;

applying a second series of successive pulses after the triggering event at an applied voltage;

incrementing the applied voltage by a predetermined voltage;

applying the second series of successive pulses at the incremented voltage; and

repeating the incrementing and applying after the triggering event until the applied voltage reaches a third voltage.

11. The method of claim 10 , wherein the first series of successive pulses includes four successive pulses and the second series of successive pulses includes two successive pulses.

12. The method of claim 10 , wherein the triggering event corresponds to reaching a second voltage.

13. The method of claim 12 , wherein the second voltage is about −7.3 volts.

14. The method of claim 10 , wherein the triggering event corresponds to expiration of a predetermined time period.

15. The method of claim 14 , wherein the predetermined time period is about 77 milliseconds.

16. A method for erasing a memory cell having a substrate, a control gate, a floating, a source region and a drain region, comprising:

a) applying a voltage to the substrate of the memory cell;

b) initializing an erase voltage to a first voltage;

c) applying a first number of pulses to the control gate of the memory cell at the erase voltage;

d) incrementing the erase voltage by a predetermined voltage;

e) applying the first number of pulses at the incremented erase voltage;

f) repeating steps d and e until a triggering event;

g) applying a second number of pulses to the control gate after the triggering event;

h) incrementing the erase voltage after the triggering event by a predetermined voltage;

i) applying the second number of pulses after the triggering event at the incremented voltage; and

j) repeating steps h and i until the erase voltage reaches a third voltage.

17. A method for erasing a memory cell having a substrate, a control gate, a floating gate, a source region and a drain region, comprising:

applying a voltage to the substrate;

applying a first number of erase pulses to the control gate for a first duration; and

applying a second number of erase pulses to the control gate for a second duration,

wherein each of the first number and the second number of erase pulses includes a first interval portion having a first ramp rate associated with a voltage of the first number and second number of erase pulses and a second interval portion having a second ramp rate associated with a voltage of the first number and second number of erase pulses, the first ramp rate being different from the second ramp rate.

18. A memory device including a memory cell, the memory cell including a substrate, a control gate, a floating gate, a source region and a drain region, comprising:

means for pre-programming the memory cell to raise a threshold voltage of the memory cell to a first predetermined level,

wherein pre-programming the memory cell does not include a verification process for ensuring that the threshold voltage of the memory cell has been raised to the first predetermined level;

means for erasing the memory cell to lower the threshold voltage of the memory cell to a second predetermined level;

means for applying a voltage to the substrate; and

means for applying a variable ramp rate erase pulse to the control gate,

wherein the variable ramp rate erase pulse includes a first interval portion and a second interval portion.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036039/0001 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2004
From: LEE, SUNGCHUL; PARK, SHEUNGHEE; HE, YUE-SONG; KWAN, MING SANG
To: SPANSION L.L.C.
Reel/Frame 015823/0965 →