Pattern reversal employing thick residual layers
View Patent ↗The present invention features a method of patterning a substrate that includes forming, on the substrate, a first layer having a first pattern and selectively shifting in tone, as well as along a first direction, a subsequent pattern formed into the same layer that corresponds to the first pattern. To that end, one method of the present invention includes generating into the first layer, a second pattern having a shape inverse to the first pattern. A third pattern is then transferred into the first layer that has a shape inverse to the second pattern.
1. A method of patterning a substrate, said method comprising:
forming, on said substrate through viscous dominated forces, a first layer having a first pattern with a residual thickness that is substantially independent of compressive forces employed to form said first layer; and
generating into said first layer, a second pattern having a shape inverse to said first pattern.
2. The method as recited in claim 1 wherein forming further includes depositing said first layer with a plurality of projections, a pair of which are separated by a recession having a nadir surface, with said plurality of projections extending from said nadir surface, terminating in an apex surface, defining a height therebetween, said first layer having a nadir region extending between said substrate and said nadir surface, said nadir region having a thickness associated therewith that is greater than said height.
3. The method as recited in claim 1 wherein forming further includes depositing said first layer with a plurality of projections, a pair of which are separated by a recession having a nadir surface, with said plurality of projections extending from said nadir surface, terminating in an apex surface, defining a height therebetween, said first layer having a nadir region extending between said substrate and said nadir surface, said nadir region having a thickness associated therewith that is two times greater than said height.
4. The method as recited in claim 1 wherein forming further includes depositing said first layer with a plurality of projections, a pair of which are separated by a recession having a nadir surface, with said plurality of projections extending from said nadir surface, terminating in an apex surface, defining a height therebetween, said first layer having a nadir region extending between said substrate and said nadir surface, said nadir region having a thickness associated therewith that is ten times greater than said height.
5. The method as recited in claim 1 wherein forming further includes forming said first layer with a plurality of projections having shoulder disposed between an apex surface and a nadir surface.
6. The method as recited in claim 1 wherein forming further includes depositing said first layer with a plurality of original projections and generating further includes selectively removing portions of said first layer to expose areas of said first layer, while avoiding removal of parts of said first layer outside of said portions to form a plurality of additional projections shifted in phase along a first direction with respect to said original projections.
7. The method as recited in claim 6 further including after generating, selectively removing segments of said first layer to expose regions of said first layer, in superimposition with said plurality additional projections while avoiding exposure of sub-parts of said first layer outside of said segments.
8. The method as recited in claim 1 wherein forming further includes forming said first layer with a first material substantially free of silicon and generating includes depositing a second layer upon said first layers with a first quantity of silicon, forming a crown surface and exposing said crown surface to an oxygen rich etch process to generate an etch pattern.
9. The method as recited in claim 8 further including, following exposing, removing substantially all of said second layer, wherein, forming further includes depositing a third layer upon said etch pattern, with said third layer having a second quantity of silicon and forming an additional crown surface and exposing said additional crown surface to an additional oxygen rich etch process to generate said etch pattern.
10. A method of patterning a substrate, said method comprising:
forming, on said substrate, a first layer having a first pattern;
generating into said first layer, a second pattern having a shape inverse to said first pattern and phase-shifted along a first direction; and
transferring a third pattern into said first layer with said third pattern having a shape inverse to said shape of said second pattern and shifted in phase along a second direction.
11. The method as recited in claim 10 wherein transferring farther includes transferring said third pattern along said second direction, opposite to said first direction.
12. The method as recited in claim 10 wherein said first pattern includes a plurality of projections, a pair of which are separated by a recession and transferring farther includes providing said third pattern with a plurality of additional projections, with said first and additional projections being in superimposition with common regions of said substrate.
13. The method as recited in claim 12 wherein forming further includes forming said first layer to include a plurality of projections with a shoulder disposed between an apex surface and an nadir surface.
14. The method as recited in claim 10 wherein said first pattern includes a plurality of projections, a pair of which are separated by a recession having a nadir surface, with said plurality of projections extending from said nadir surface, terminating in an apex surface, defining height therebetween, said first layer having a nadir region extending between said substrate and said nadir surface, said nadir region having a thickness associated therewith that is greater than said height.
15. The method as recited in claim 10 wherein forming further includes forming said first layer with a first material substantially free of silicon and generating includes depositing a second layer upon said first layer with a first quantity of silicon, forming a crown surface and exposing said crown surface to an oxygen rich etch process to generate an etch pattern.
16. The method as recited in claim 15 further including, following exposing, removing substantially all of said second layer, wherein forming further includes depositing a third layer upon said etch pattern, with said third layer having a second quantity of silicon and forming an additional crown surface and exposing said additional crown surface to an additional oxygen rich etch process to generate said etch pattern.
17. A method of patterning a substrate haying surface planarity perturbations, said method comprising:
forming, on said substrate, a first layer having a first pattern that includes a plurality of projections, a pair of which are separated by a recession having a nadir region, with said plurality of projections extending from said nadir surface, terminating in an apex surface, defining a height therebetween, with said nadir region having a thickness associated therewith that is greater than said height;
generating into said first layer, a second pattern having a shape inverse to said first pattern by selectively removing portions of said first layer to expose areas of said first film, in superimposition with said plurality of projections, while avoiding removal of parts of said first layer outside of said portions to form a plurality of additional projections shifted in phase along a first direction with respect to said projections; and
transferring into said first layer, a third pattern having a shape inverse to said second pattern and shifted in phase with respect thereto along a second direction, opposite to said first direction.
18. The method as recited in claim 17 wherein transferring further includes, after generating, selectively removing segments of said first layer to expose regions of said first layer, in superimposition with said plurality additional projections while avoiding exposure of sub-parts of said first layer outside of said segments.
19. The method as recited in claim 18 wherein forming further includes forming said first layer with a first material substantially free of silicon and generating includes depositing a second layer upon said first layer with a first quantity of silicon, forming a crown surface and exposing said crown surface to an oxygen rich etch process to generate an etch pattern.
20. The method as recited in claim 19 further including, following exposing, removing substantially all of said second layer, wherein forming further includes depositing a third layer upon said etch pattern, with said third layer having a second quantity of silicon and forming an additional crown surface and exposing said additional crown surface to an additional oxygen rich etch process to generate said etch pattern.
21. The method as recited in claim 20 wherein forming further includes forming said first layer to provide a subset of said plurality of projections with a shoulder disposed between said apex surface and said nadir surface.