IP Library Granted Patent US 7,135,696
Granted Patent B2
US 7,135,696 · App. 10/949,090 · Granted Nov 14, 2006

Phase change memory with damascene memory element

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,135,696
App. No.
10/949,090
Granted
Nov 14, 2006
Kind
B2
Abstract

A phase change material may be formed within a trench in a first layer to form a damascene memory element and in an overlying layer to form a threshold device. Below the first layer may be a wall heater. The wall heater that heats the overlying phase change material may be formed in a U-shape in some embodiments of the present invention. The phase change material for the memory element may be elongated in one direction to provide greater alignment tolerances with said heater and said threshold device.

Claims (36)

1. An apparatus comprising:

a wall heater;

a damascene phase change memory element on said wall heater; and

a pair of transverse conductors and an elongated phase change material between said pair of conductors, said material being elongated in the direction of one of said conductors.

2. The apparatus of claim 1 wherein said wall heater is U-shaped including an upstanding arm in contact with said elongated phase change material.

3. The apparatus of claim 1 including a threshold device over said elongated phase change material.

4. The apparatus of claim 3 wherein said threshold device includes a chalcogenide material.

5. The apparatus of claim 3 including a threshold device including a chalcogenide material that does not change phase.

6. The apparatus of claim 3 including a threshold device formed within a dielectric layer over said elongated phase change material.

7. The apparatus of claim 1 including a dielectric layer with an opening, said elongated phase change material formed in said opening.

8. The apparatus of claim 7 including a second dielectric layer having an opening, said heater formed in said opening in said second dielectric layer, said second dielectric layer being below said first dielectric layer.

9. The apparatus of claim 1 wherein elongated phase change material is oval in shape.

10. A system comprising:

a controller;

a wireless interface coupled to said controller; and

a phase change memory coupled to said controller including a wall heater and a damascene phase change memory element on said wall heater, said memory including a pair of transverse conductors and an elongated phase change material between said pair of conductors, said material being elongated in the direction of one of said conductors.

11. The system of claim 10 wherein said wall heater is U-shaped including an upstanding arm in contact with said elongated phase change material.

12. The system of claim 10 including a threshold device over said elongated phase change material.

13. The system of claim 12 wherein said threshold device includes a chalcogenide material.

14. The system of claim 12 including a threshold device including a chalcogenide material that does not change phase.

15. The system of claim 12 including a threshold device formed with a dielectric layer over said elongated phase change material.

16. The system of claim 10 including a dielectric layer with an opening, said elongated phase change material formed in said opening.

17. The system of claim 16 including a second dielectric layer having an opening, said heater formed in said opening in said second dielectric layer, said second dielectric layer being below said first dielectric layer.

18. The system of claim 10 wherein said elongated phase change material is oval in shape.

19. The system of claim 10 wherein said wireless interface includes a dipole antenna.

20. An apparatus comprising:

a U-shaped heater including a pair of upstanding arms extending away from a base;

a damascene phase change memory element coupled to one of said arms; and

a pair of transverse conductors and an elongated phase change material between said pair of conductors, said material being elongated in the direction of one of said conductors.

21. The apparatus of claim 20 including a threshold device over said elongated phase change material.

22. The apparatus of claim 21 wherein said threshold device includes a chalcogenide material.

23. The apparatus of claim 21 wherein said threshold device includes a chalcogenide material that does not change phase.

24. The apparatus of claim 21 wherein said threshold device is formed within a dielectric layer over said elongated phase change material.

25. The apparatus of claim 20 including a dielectric layer with an opening, said elongated phase change material formed in said opening.

26. The apparatus of claim 25 including a second dielectric layer having an opening, said heater formed in said opening in said second dielectric layer, said second dielectric layer being below said first dielectric layer.

27. The apparatus of claim 20 wherein elongated phase change material is oval in shape.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2012
From: INTEL CORPORATION
To: NUMONYX B.V.
Reel/Frame 028055/0625 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027075/0682 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2004
From: KARPOV, ILYA V.; KUO, CHARLES C.; KIM, YUDONG; PELLIZZER, FABIO
To: INTEL CORPORATION
Reel/Frame 015860/0926 →