Semiconductor device
View Patent ↗In a conventional semiconductor device, there was a problem that, in a guard ring region, a shape of a depletion layer is distorted and stable withstand voltage characteristics cannot be obtained. In a semiconductor device of the present invention, a thermal oxide film in an actual operation region and a thermal oxide film in a guard ring region are formed in the same process. Thereafter, the thermal oxide film is once removed and is formed again. Thus, a film thickness of the thermal oxide film on the upper surface of the guard ring region is set to, for example, about 8000 to 10000 Å. Accordingly, a CVD oxide film including moving ions is formed in a position distant from a surface of an epitaxial layer. Consequently, distortion of a depletion layer, which is influenced by the moving ions, is suppressed and desired withstand voltage characteristics can be maintained.
1. A semiconductor device comprising:
a semiconductor layer comprising an actual operation region in which a plurality of cells are formed and a guard ring region disposed around the actual operation region, the cells comprising corresponding source, gate and drain regions;
a diffusion region which forms a boundary between the actual operation region and the guard ring region and is formed in a surface of the semiconductor layer;
a thermally-grown oxide film formed on the surface of the semiconductor layer;
a CVD oxide film formed on the thermally-grown oxide film;
a metal wiring layer electrically connected to the diffusion region and formed on the CVD oxide film, the metal wiring layer being connected to the diffusion region through a contact region provided in the first thermally-grown oxide film and the CVD oxide film; and
a gate electrode disposed on the gate regions and electrically connected to the metal wiring layer,
wherein the thermally-grown oxide film comprises first and second thermally-grown oxide films juxtaposed on the semiconductor layer, the second thermally-grown oxide film is thicker than the first thermally-grown oxide film and is formed on the guard ring region, and the first thermally-grown oxide film is formed on at least part of the actual operation region, and
one end of the metal wiring layer extends toward the side of the guard ring region beyond one end of the diffusion region, said one end being the farther end of said metal wiring layer from the actual operation region.
2. The semiconductor device according to claim 1 , wherein an annular ring is formed in the outermost periphery of the guard ring region and the second thermally-grown oxide film is formed at least on the surface of the semiconductor layer between the diffusion region and the annular ring.
3. The semiconductor device according to claim 1 , wherein the metal wiring layer is disposed so as to surround the actual operation region.
4. The semiconductor device according to claim 1 , wherein the gate regions are embedded in the semiconductor layer.
5. The semiconductor device according to claim 1 , wherein the metal wiring layer is an extension of the gate electrode.