Heat radiation device for memory module
View Patent ↗There is disclosed a heat radiation device for memory modules intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed in parallel. The device comprises heat radiation plates in pairs composed of front face side heat radiation plates in contact with memory elements that are installed on the front face side of the substrate for each of the memory modules, and of rear face side heat radiation plates in contact with memory elements that are installed on the rear face side of the substrate; and connecting members for heat radiation plates in pairs which connect the heat radiation plates in pairs so that heat is conducted among a plurality of the heat radiation plates in pairs.
1. A heat radiation device for memory modules intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed in parallel, said device comprising:
heat radiation plates in pairs composed of a front face side heat radiation plate in contact with the memory elements that are installed on a front face side of the substrate for each of said memory modules, and composed of a rear face side heat radiation plate in contact with memory elements that are installed on a rear face side of the substrate therefore;
a connecting member for the heat radiation plates in pairs which connect the heat radiation plates in pairs that are installed per each of said memory modules; and
a fixing means for fixing the front face side heat radiation plates and the rear face side heat radiation plates to the memory modules so that both said radiation plates closely adhere to the memory elements.
2. The heat radiation device for memory modules according to claim 1 wherein the front face side heat radiation plates, rear face side heat radiation plates and connecting members for the heat radiation plates in pairs are each formed of the same material.
3. The heat radiation device for memory modules according to claim 1 , wherein the connecting member includes copper.
4. A heat radiation device for memory modules, intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed in parallel, said device comprising:
heat radiation niates in pairs comnosed of a front face side heat radiation ulate in contact with the memory elements that are installed on a front face side of the substrate for each of said memory modules, and composed of a rear face side heat radiation plate in contact with memory elements that are installed on a rear face side of the substrate therefore:
a connecting member for the heat radiation plates in pairs which connect the heat radiation plates in pairs that are installed per each of said memory modules; and
a means for biasing the front face side heat radiation plates and the rear face side heat radiation plates to be attached to the memory modules so that both said radiation plates closely adhere to the memory elements.
5. A heat radiation device for memory modules intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements and inner heat radiation plates which radiate heat generated from the memory elements on both a front and a rear face sides of a substrate are placed in parallel, said device comprising:
outer heat radiation plates in pairs composed of a front face side heat radiation plates in contact with the inner heat radiation plates that are installed on the front face side of the substrate, and composed of a rear face side heat radiation plates in contact with the inner heat radiation plates that are installed on the rear face side of the substrate; and
connecting members for the outer heat radiation plates in pairs which connect the inner heat radiation plates in pairs that are installed per each of said memory modules.
6. The heat radiation device for memory modules according to claim 5 wherein the front face side heat radiation plates, rear face side heat radiation plates and connecting members for the outer heat radiation plates in pairs are each formed of the same material.
7. The heat radiation device for memory modules according to claim 5 wherein at least two slits are formed on the connecting members for the outer heat radiation plates in pairs.
8. The heat radiation device for memory modules according to claim 5 , wherein the connecting members include copper.
9. The heat radiation device for memory modules according to claim 5 , wherein the outer heat radiation plates in pairs are attached directly to each other by a fixing arrangement.
10. The heat radiation device for memory modules according to claim 9 , wherein the fixing arrangement includes a spring.
11. The heat radiation device for memory modules intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed in parallel, said device comprising:
heat radiation plates in pairs composed of a front face side heat radiation plate in contact with the memory elements that are installed on a front face side of the substrate for each of said memory modules, and composed of a rear face side heat radiation plate in contact with memory elements that are installed on a rear face side of the substrate therefore; and
a connecting member for the heat radiation plates in pairs which connect The heat radiation plates in pairs that are installed per each of said memory modules:
wherein at least two slits are formed on the connecting member for the heat radiation plates in pairs.