Memory card ESC substrate insert
View Patent ↗A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts of the insert. A body covers the die pad and the semiconductor die and partially covers the insert such that the contacts are exposed in an exterior surface of the body.
1. A memory card, comprising:
metal die pad;
an insert comprising a substrate having a plurality of contacts and a conductive pattern disposed thereon, the contacts being electrically connected to the conductive pattern by conductive vias which extend through the substrate;
a semiconductor die attached to the metal die pad and electrically connected to the conductive pattern; and
a body covering the metal die pad and the semiconductor die and partially covering the insert such that the contacts are exposed in a bottom surface of the body.
2. The memory card of claim 1 wherein the semiconductor die is electrically connected to the conductive pattern of the substrate by conductive wires which are covered by the body.
3. The memory card of claim 1 wherein the substrate has a bottom surface which extends in generally co-planar relation to the bottom surface of the body.
4. The memory card of claim 1 wherein:
the body includes a side surface;
the substrate of the insert includes at least one edge which is exposed in the side surface of the body; and
the edge of the substrate and a portion of the side surface of the body in which the edge of the substrate is exposed collectively define a leading edge of the memory card.
5. The memory card of claim 1 wherein the insert and the die pad extend along respective ones of a spaced, generally parallel pair of planes.
6. The memory card of claim 1 wherein the die pad partially overlaps the insert.
7. A memory card, comprising:
a metal die pad;
an insert having a plurality of contacts, the metal die pad partially overlapping the insert;
a semiconductor die attached to the metal die pad and electrically connected to the contacts of the insert; and
a body covering the metal die pad and the semiconductor die and partially covering the insert such that the contacts are exposed in a bottom surface of the body.
8. The memory card of claim 7 wherein the insert comprises:
a substrate having opposed, generally planar top and bottom surfaces, the contacts being disposed on the bottom surface;
a conductive pattern disposed on the top surface; and
conductive vias extending through the substrate and electrically connecting the contacts to the conductive pattern.
9. The memory card of claim 8 wherein the semiconductor die is electrically connected to the conductive pattern of the insert by conductive wires which are covered by the body.
10. The memory card of claim 8 wherein the bottom surface of the substrate and the bottom surface of the body extend in generally co-planar relation to each other.
11. The memory card of claim 7 wherein:
the body defines a side surface;
the insert includes at least one edge which is exposed in the side surface of the body; and
the edge of the insert and a portion of the side surface of the body in which the edge of the insert is exposed collectively define a leading edge of the memory card.
12. A memory card, comprising:
a laminate substrate;
at least one electronic component connected to the laminate substrate;
an insert having a plurality of contacts and attached to the laminate substrate such that the laminate substrate at least partially overlaps the insert, the electronic component being electrically connected to the contacts; and
a body covering the electronic component and partially covering the insert such that the contacts are exposed in a bottom surface of the body.
13. The memory card of claim 12 wherein:
the insert has a first side including a conductive pattern disposed thereon which is electrically connected to the electronic component, a second side opposite the first side and having the contacts disposed thereon, and conductive vias which electrically connect the contacts to the conductive pattern of the insert.
14. The memory card of claim 13 wherein the body is sized and configured such that the second side of the insert having the contacts disposed thereon extends in generally co-planar relation to the bottom surface of the body.
15. The memory card of claim 13 wherein the electronic component is electrically connected to the conductive pattern of the insert by conductive wires which are covered by the body.
16. The memory card of claim 12 wherein the at least one electronic component comprises a TSOP device.
17. The memory card of claim 4 wherein the substrate of the insert has a generally quadrangular configuration.
18. The memory card of claim 11 wherein the insert has a generally quadrangular configuration.
19. The memory card of claim 12 wherein the insert has a generally quadrangular configuration.