Methods and systems for driving robotic components of a semiconductor handling system
Methods and systems are provided for handling materials in a vacuum semiconductor manufacturing process. The methods and systems include a motor drive system for a robotic component of the vacuum handling system, where the motor drive system can be removed from the robotic component without breaking the seal of the vacuum.
1 . A system comprising:
a robotic component positioned in a vacuum maintained in a chamber of a vacuum manufacturing process;
one or more drives for actuating movement of the robotic component, the one or more drives including motor drive hardware external to the vacuum; and
a removable cartridge, wherein the motor drive hardware can be removed from the robotic component without breaking the vacuum.
2 . The system of claim 1 wherein the motor drive hardware includes one or more electrical wires.
3 . The system of claim 1 wherein the motor drive hardware includes one or more encoders.
4 . The system of claim 1 , wherein the motor drive hardware includes one or more resolvers.
5 . The system of claim 4 wherein the motor drive hardware includes one or more facilities for determining at least one of the position, the angle, and the speed of a robotic component.
6 . The system of claim 1 wherein the motor drive hardware includes one or more signal LEDs.
7 . The system of claim 1 wherein the motor drive hardware includes one or more pick-ups.
8 . The system of claim 1 wherein the motor drive hardware includes one or more bearings.
9 . The system of claim 1 wherein the motor drive hardware includes one or more magnets.
10 . The system of claim 1 wherein the motor drive hardware is sealed from the vacuum.
11 . The system of claim 10 wherein the motor drive hardware is sealed from the vacuum using lip-seals.
12 . The system of claim 10 wherein the motor drive hardware is sealed from the vacuum using ferrofluidic seals.
13 . The system of claim 1 wherein there is minimal outgassing of components.
14 . The system of claim 1 further comprising a vacuum pump that provides quick vacuum pump downs.
15 . The system of claim 1 wherein serviceability of the motor drive hardware is improved by permitting access to the motor drive hardware without releasing the vacuum in the processing module.
16 . The system of claim 1 wherein the motor drive hardware includes robot drives.
17 . The system of claim 1 wherein the motor drive hardware is external to the process module.
18 . The system of claim 1 wherein the motor drive hardware is positioned to present minimal surface in the vacuum.
19 . The system of claim 1 wherein minimal materials are used for reducing outgassing.
20 . The system of claim 1 wherein the positioning of motor drive hardware outside the vacuum provides for quicker pump down.
21 . The system of claim 1 further comprising at least one drive cavity for the robotic component.
22 . The system of claim 21 wherein a vacuum is maintained in the drive cavity.
23 . The system of claim 21 wherein the volume of the drive cavity is small.
24 . A system for driving a robot in a vacuum-based semiconductor handling system, comprising:
a drive cartridge that provides rotary drive force to a drive shaft for a robot;
a rotary seal unit, wherein the rotary seal unit seals the drive cartridge having motor drive hardware outside the vacuum while the drive shaft is disposed in the vacuum; and
a removable cartridge, wherein the motor drive hardware can be removed from the robotic component without breaking the vacuum.
25 . The system of claim 24 wherein the robot comprises a robotic arm.
26 . The system of claim 24 wherein the robot comprises a four-link SCARA arm.
27 . The system of claim 24 wherein the robotic comprises a SCARA arm.
28 . The system of claim 24 wherein the drive cartridge includes at least two drive cartridges each having an integral encoder, bearings, and magnets.
29 . The system of claim 24 wherein the rotary seal unit is a concentric, dual-shaft rotary seal unit.
30 . The system of claim 24 wherein the rotary seal unit uses a lip seal.
31 . The system of claim 24 wherein the rotary seal unit uses a ferrofluidic seal.
32 . The system of claim 24 wherein the drive cartridge is removeably and replaceably coupled to the drive shaft.
33 . The system of claim 24 wherein the rotary seal unit uses a double O-ring seal.
34 . The system of claim 24 wherein the rotary seal unit uses a muff seal.
35 . The system of claim 24 wherein the rotary seal unit uses an air pressure seal.
36 . The system of claim 24 wherein the rotary seal unit uses a screw-type seal.
37 . The system of claim 24 wherein the rotary seal unit uses a differential seal.
38 . A method comprising:
positioning a robotic component in a vacuum maintained in a chamber of a vacuum manufacturing process;
positioning one or more drives for actuating movement of the robotic component outside the vacuum, the one or more drives including motor drive hardware; and
coupling the robotic component to the one or more drives through a vacuum-sealed interface.
39 . The method of claim 38 wherein the motor drive hardware includes one or more electrical wires.
40 . The method of claim 38 wherein the motor drive hardware includes one or more encoders.
41 . The method of claim 38 wherein the motor drive hardware includes one or more resolvers.
42 . The method of claim 38 wherein the motor drive hardware includes one or more facilities for determining at least one of the position and speed of the motor drive hardware.
43 . The method of claim 38 wherein the motor drive hardware includes one or more signal LEDs.
44 . The method of claim 38 wherein the motor drive hardware includes one or more pick-ups.
45 . The method of claim 38 wherein the motor drive hardware includes one or more bearings.
46 . The method of claim 38 wherein the motor drive hardware includes one or more magnets.
47 . The method of claim 38 wherein the motor drive hardware is sealed from the vacuum.
48 . The method of claim 47 wherein the motor drive hardware is sealed from the vacuum using lip-seals.
49 . The method of claim 47 wherein the motor drive hardware is sealed from the vacuum using ferrofluidic seals.
50 . The method of claim 47 wherein the seal is a double O-ring seal.
51 . The method of claim 47 wherein the seal is a muff seal.
52 . The method of claim 47 wherein the seal is an air pressure seal.
53 . The method of claim 47 wherein the seal is a screw-type seal.
54 . The method of claim 47 wherein the seal is a differential seal.
55 . The method of claim 38 wherein there is minimal outgassing of components.
56 . The method of claim 38 further comprising providing a vacuum pump that provides quick vacuum pump downs.
57 . The method of claim 38 wherein serviceability of the motor drive hardware is improved by permitting access to the motor drive hardware without releasing the vacuum in the processing module.
58 . The method of claim 38 wherein the motor drive hardware includes robot drives.
59 . The method of claim 38 wherein the motor drive hardware is external to the processing module.
60 . The method of claim 38 wherein the motor drive hardware is positioned to present minimal surface in the vacuum.
61 . The method of claim 38 wherein minimal materials are used for reducing outgassing.
62 . The method of claim 38 wherein the positioning of motor drive hardware outside the vacuum provides for quicker pump down.
63 . The method of claim 38 further comprising providing at least one drive cavity for the robotic component.
64 . The method of claim 63 wherein a vacuum is maintained in the drive cavity.
65 . The method of claim 63 wherein the volume of the drive cavity is small.
66 . The method of claim 63 wherein the drive cavity is large.
67 . A system comprising:
a robotic component positioned in a vacuum maintained in a chamber of a vacuum manufacturing process;
one or more components of motor drive hardware external to the vacuum; and
coupling means for coupling the one or more components of motor drive hardware to the robotic component, wherein the coupling means preserves the vacuum when the components of the motor drive hardware are removed from the robotic component.