IP Library Granted Patent US 7,035,141
Granted Patent B1
US 7,035,141 · App. 10/990,706 · Granted Apr 25, 2006

Diode array architecture for addressing nanoscale resistive memory arrays

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Quick Facts
Patent No.
US 7,035,141
App. No.
10/990,706
Granted
Apr 25, 2006
Kind
B1
Abstract

The present memory structure includes thereof a first conductor, a second conductor, a resistive memory cell connected to the second conductor, a first diode connected to the resistive memory cell and the first conductor, and oriented in the forward direction from the resistive memory cell to the first conductor, and a second diode connected to the resistive memory cell and the first conductor, in parallel with the first diode, and oriented in the reverse direction from the resistive memory cell to the first conductor. The first and second diodes have different threshold voltages.

Claims (24)

1. A memory structure comprising:

a first conductor,

a second conductor;

a resistive memory cell connected to the second conductor;

a first diode connected to the resistive memory cell and the first conductor, and oriented in the forward direction from the resistive memory cell to the first conductor; and

a second diode connected to the resistive memory cell and the first conductor, in parallel with the first diode, and oriented in the reverse direction from the resistive memory cell to the first conductor;

wherein the first and second diodes have different threshold voltages.

2. A memory structure comprising:

a first conductor;

a second conductor;

a memory cell connected to the second conductor;

a first diode connected to the memory cell and the first conductor; and

a second diode connected to the memory cell and the first conductor, in parallel with the first diode;

wherein the first and second diodes have different threshold voltages.

3. The memory structure of claim 2 wherein the first diode is oriented in the forward direction from the memory cell to the first conductor, and the second diode is oriented in the reverse direction from the memory cell to the first conductor.

4. The memory structure of claim 2 wherein the memory cell is a resistive memory cell.

5. A memory array comprising;

a first plurality of conductors;

a second plurality of conductors, and;

a plurality of memory structures, each connecting a conductor of the first plurality thereof with a conductor of the second plurality thereof, each memory structure comprising;

a resistive memory cell connected to a conductor of the second plurality thereof;

a first diode connected to the resistive memory cell and a conductor of the first plurality thereof, and oriented in the forward direction from the resistive memory cell to the conductor of the first plurality thereof; and

a second diode connected to the resistive memory cell and the conductor of the first plurality thereof, in parallel with the first diode, and oriented in the reverse direction from the resistive memory cell to the conductor of the first plurality thereof;

wherein the first and second diodes have different threshold voltages.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036038/0001 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2004
From: TRIPSAS, NICHOLAS H.; BILL, COLIN S.; VANBUSKIRK, MICHAEL A.; BUYNOSKI, MATTHEW; FANG, TZU-NING; CAI, WEI DAISY; PANGRIE, SUZETTE; AVANZINO, STEVEN
To: SPANSION LLC
Reel/Frame 016030/0452 →