Memory card with chamfer
The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.
1. A non-volatile memory card, comprising:
a bottom surface;
a top surface opposite the bottom surface, the top surface having a raised portion;
a bottom edge extending between the top and bottom surfaces;
a top edge opposite the bottom edge;
a pair of side edges extending between the top and bottom surfaces and the top and bottom edges, one of the pair of side edges including a notch;
a set of contacts on said bottom surface adjacent the top edge;
a circuit board in said card;
a plurality of non-volatile storage elements enclosed within said card and connected to said circuit board;
molding material encapsulating the printed circuit board and plurality of non-volatile storage elements, the molding material generally defining the top and bottom surfaces, the top and bottom edges and the pair of side edges;
test pins, exposed through a surface of the molding material, for testing operation of the non-volatile storage elements;
a conformal coating removably covering the test pins;
passive electrical elements enclosed within said card and connected to said circuit board, said passive electrical elements are positioned in a part of said card at least partially defined by said raised portion;
a chamfer forming a sloped surface between the bottom surface and the top edge; and
electrical memory system components enclosed within said card and accessible via said contacts.
2. A non-volatile memory system according to claim 1 , wherein:
said electrical memory system components include a controller in communication with said contacts.
3. A non-volatile memory according to claim 1 , wherein: said electrical memory system components include a flash memory array.
4. A non-volatile memory according to claim 1 , wherein said chamfer cuts through said circuit board and said molding material.
5. A non-volatile memory according to claim 1 , wherein said chamfer cuts through said circuit board.
6. A non-volatile memory according to claim 1 , wherein said chamfer cuts through said molding material.
7. A non-volatile memory according to claim 1 , wherein:
said chamfer cuts said second surface and a front surface, said chamfer cuts said front surface at 60 degrees relative to said front surface.
8. A non-volatile memory according to claim 1 , wherein:
said card is rectangular.
9. A non-volatile memory according to claim 1 , wherein:
said card is removable.
10. A memory card, comprising:
a bottom surface including a first planar portion and a second planar portion residing in a different plane than the first planar portion;
a top surface opposite the bottom surface, the top surface having a raised portion;
a bottom edge extending between the top and bottom surfaces;
a top edge opposite the bottom edge;
a pair of side edges extending between the top and bottom surfaces and the top and bottom edges, one side edge of the pair of said edges including first and second sections extending generally parallel to each other and a third section extending between the first and second sections and forming an oblique angle with each of the first and second sections, one of the first and second sections including a notch;
a set of contacts on said bottom surface, in the first planar portion and adjacent the top edge;
a circuit board having a front surface and a chamfer cut in said front surface;
a memory device connected to said circuit board; and
molding material covering said memory device
passive electrical elements enclosed within said card, said passive electrical elements are positioned in said second portion.
11. A memory card according to claim 10 , wherein:
said molding material and said circuit board comprise an exterior surface of said memory card.
12. A memory card according to claim 11 , wherein:
said chamfer cuts through said circuit board and said molding material.
13. A memory card according to claim 10 , wherein:
said chamfer cuts through said circuit board and said molding material.
14. A memory card according to claim 10 , wherein:
said molding material includes an external surface, said external surface having a raised portion;
said memory card further comprising passive electrical elements positioned in a part of said card at least partially defined by said raised portion.
15. A memory card according to claim 14 , wherein:
said external surface having a rear external region, said raised portion is on said rear external region;
said external surface having a front external region, said chamfer is on said front external region.
16. A memory card according to claim 10 , wherein:
said memory device is mounted on said circuit board.
17. A memory card according to claim 10 , wherein:
said memory device includes flash memory.
18. A memory card according to claim 10 , wherein:
said memory card having a length, a width and a thickness, said chamfer reduces said thickness within said chamfer.
19. A memory card according to claim 10 , wherein:
said memory card having a bottom surface and a front surface; and
said chamfer cuts through said bottom surface and said front surface.
20. A memory card, comprising:
a bottom surface including a first planar portion and a second planar portion residing in a different plane than the first planar portion, the card being thinner at the first planar portion than at the second planar portion;
a top surface opposite the bottom surface, the top surface having a raised portion;
a bottom edge extending between the top and bottom surfaces;
a top edge opposite the bottom edge;
a pair of side edges extending between the top and bottom surfaces and the top and bottom edges, one side edge of the pair of said edges including first and second sections extending generally parallel to each other and a third section extending between the first and second sections and forming an oblique angle with each of the first and second sections, one of the first and second sections including a notch;
a circuit board;
a memory device connected to said circuit board;
molding material covering said memory device, said molding material having an exterior surface with a chamfer on said exterior surface
test pins, exposed through a surface of the molding compound, for testing operation of the non-volatile storage elements;
a conformal coating removably covering the test pins; and
a passive electrical element enclosed within said card and connected to said circuit board, said passive electrical elements is positioned in a part of said card at least partially defined by said raised portion.
21. A memory card according to claim 20 , wherein:
said molding material includes an external surface, said external surface having a raised portion; and
said memory card further comprising passive electrical elements positioned in a part of said card at least partially defined by said raised portion.
22. A memory card according to claim 21 , wherein:
said external surface having a rear external region, said raised portion is on said rear external region; and
said external surface having a front external region, said chamfer is on said front external region.
23. A memory card according to claim 20 , wherein:
said memory device includes flash memory.
24. A memory card according to claim 23 , wherein:
said memory card having a length, a width and a thickness, said chamfer reduces said thickness within said chamfer.