IP Library Granted Patent US 7,150,095
Granted Patent B2
US 7,150,095 · App. 11/006,762 · Granted Dec 19, 2006

Method for manufacturing probe needle, method for manufacturing probe card, and probe card

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Quick Facts
Patent No.
US 7,150,095
App. No.
11/006,762
Granted
Dec 19, 2006
Kind
B2
Abstract

A probe needle having a coaxial structure that facilitates assembly of a probe card. The probe needle is manufactured by covering a central conductive body with an insulative tube, and forming a conductive layer around the insulative tube by superimposing a film of fine conductive grains around the insulative tube.

Claims (22)

1. A method for manufacturing a probe needle having a coaxial structure, the method comprising:

preparing a central conductive body including a reduced diameter portion having a diameter smaller than that of other portions of the central conductive body;

covering the reduced diameter portion of the central conductive body with an insulative tube; and

forming a conductive layer around the insulative tube by superimposing a film of fine conductive grains around the insulative tube.

2. The method of claim 1 , wherein the conductive layer has a thickness of about 5–10 μm.

3. A method for manufacturing a probe needle having a coaxial structure, the method comprising:

preparing a central conductive body including a reduced diameter portion having a diameter smaller than that of other portions of the central conductive body;

covering the reduced diameter portion of the central conductive body with an insulative tube; and

forming a conductive layer around the insulative tube by applying a solvent, in which a conductive substance is mixed, around the insulative tube.

4. A method for manufacturing a probe needle having a coaxial structure, the method comprising:

preparing a central conductive body including a reduced diameter portion having a diameter smaller than that of other portions of the central conductive body;

covering the reduced diameter portion of the central conductive body with an insulative tube; and

forming a conductive layer around the insulative tube by performing vapor deposition to superimpose a conductive substance around the insulative tube.

5. The method of claim 4 , wherein the conductive layer has a thickness of about 5–10 μm.

6. A method for manufacturing a probe needle having a coaxial structure, the method comprising:

covering a central conductive body with an insulative tube, wherein the insulative tube includes a first end portion and a second end portion that are not covered by the insulative tube; and

forming a conductive layer around the insulative tube and the second end portion, said forming a conductive layer including

immersing the central conductive body in a first solvent containing a conductive substance excluding the first end portion,

taking out the central conductive body from the first solvent,

drying the central conductive body; and

removing a portion of the conductive layer on the second end portion of the insulative tube with a second solvent.

7. The method according to claim 6 , wherein the first solvent includes silver grains and a high polymer acrylic resin.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0469 →
CHANGE OF NAME Recorded Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2004
From: ONO, YASUKAZU; YAKURA, MOTOHARU
To: FUJITSU LIMITED
Reel/Frame 016072/0417 →