IP Library Granted Patent US 7,282,730
Granted Patent B2
US 7,282,730 · App. 11/037,850 · Granted Oct 16, 2007

Forming a carbon layer between phase change layers of a phase change memory

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Quick Facts
Patent No.
US 7,282,730
App. No.
11/037,850
Granted
Oct 16, 2007
Kind
B2
Abstract

A carbon containing layer may be formed between a pair of chalcogenide containing layers of a phase change memory. When the lower chalcogenide layer allows current to pass, a filament may be formed therein. The filament then localizes the electrical heating of the carbon containing layer, converting a relatively localized region to a lower conductivity region. This region then causes the localization of heating and current flow through the upper phase change material layer. In some embodiments, less phase change material may be required to change phase to form a phase change memory, reducing the current requirements of the resulting phase change memory.

Claims (10)

1. A method comprising:

forming a carbon containing layer between and contacting a first and a second chalcogenide containing layer, said first chalcogenide containing layer being part of a select device and said second chalcogenide layer being part of a memory element.

2. The method of claim 1 including forming said carbon containing layer entirely of carbon.

3. The method of claim 2 including forming said carbon containing layer by sputtering.

4. The method of claim 1 including forming said first chalcogenide containing layer of different material than said second chalcogenide containing layer.

5. The method of claim 1 wherein only said second chalcogenide containing layer changes phase between amorphous and crystalline phases.

6. A method comprising:

causing a carbon containing layer between and contacting a first chalcogenide containing layer and a second chalcogenide containing layer to change phase, said first chalcogenide containing layer being part of a select device and said second chalcogenide containing layer being part of a memory element.

7. The method of claim 6 including passing current through said carbon containing layer to change its phase.

8. The method of claim 6 including forming a filament in one of said pair of chalcogenide containing layers, and using said filament to change the phase of said carbon containing layer.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2012
From: INTEL CORPORATION
To: NUMONYX B.V.
Reel/Frame 028055/0625 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027075/0682 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2005
From: CZUBATYJ, WOLODYMYR; KOSTYLEV, SERGEY; LOWREY, TYLER A.; WICKER, GUY C.
To: INTEL CORPORATION
Reel/Frame 016198/0281 →