IP Library Granted Patent US 7,170,807
Granted Patent B2
US 7,170,807 · App. 11/048,387 · Granted Jan 30, 2007

Data storage device and refreshing method for use with such device

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Quick Facts
Patent No.
US 7,170,807
App. No.
11/048,387
Granted
Jan 30, 2007
Kind
B2
Abstract

A data storage device such as a DRAM memory having a plurality of data storage cells 10 is disclosed. Each data storage cell 10 has a physical parameter which varies with time and represents one of two binary logic states. A selection circuit 16 , writing circuits 18 and a refreshing circuit 22 apply input signals to the data storage cells to reverse the variation of the physical parameter with time of at least those cells representing one of the binary logic states by causing a different variation in the physical parameter of cells in one of said states than in the other.

Claims (45)

1. A semiconductor memory array comprising:

a plurality of memory cells, including a first memory cell and a second memory cell, wherein each memory cell of the plurality of memory cells includes an associated transistor having a source region, a drain region, an electrically floating body region disposed therebetween, and a gate disposed over the electrically floating body region, and wherein each memory cell further includes a charge in the body region of the associated transistor which varies with time and

a first data state representative of a first charge provided in the body region of the associated transistor, and

a second data state representative of a second charge in the body region of the associated transistor, wherein the first charge is greater than the second charge; and

circuitry, coupled to the plurality of memory cells, to simultaneously apply first electrical signals to the first memory cell, which is in the first data state, and the second memory cell, which is in the second data state, wherein, in response to the first electrical signals, the first memory cell is refreshed and the second memory cell maintains the second data state.

2. The semiconductor memory array of claim 1 wherein the circuitry includes a refreshing circuit, a selection circuit and a writing circuit.

3. The semiconductor memory array of claim 1 wherein, in response to the first electrical signals, the first memory cell is refreshed by increasing the number of majority carriers in the body region of the associated transistor.

4. The semiconductor memory array of claim 1 wherein, in response to the first electrical signals, the first memory cell is in the first state.

5. The semiconductor memory array of claim 1 wherein, in response to the first electrical signals, the second memory cell is in the second state.

6. The semiconductor memory array of claim 1 wherein the conductivity of memory cells in the first state is higher than the conductivity of memory cells in the second state.

7. The semiconductor memory array of claim 1 wherein, in response to the first electrical signals:

the first memory cell includes a conductive channel in the body region of the associated transistor and between the source region and the drain region of the associated transistor; and

the second memory cell does not include a conductive channel in the body region of the associated transistor and between the source region and the drain region of the associated transistor.

8. The semiconductor memory array of claim 1 wherein the circuitry simultaneously applies second electrical signals to the first and second memory cells, wherein, in response to the second electrical signals, the second memory cell is refreshed and the first memory cell maintains the first data state.

9. The semiconductor memory array of claim 8 wherein, in response to the second electrical signals, the second memory cell is refreshed by reducing the number of majority carriers in the body region of the associated transistor.

10. The semiconductor memory array of claim 8 wherein the second electrical signals include (1) a second gate signal applied: (i) to the gate of the transistor associated with the first memory cell and (ii) to the gate of the transistor associated with the second memory cell, and (2) a second drain signal applied: (i) to the drain region of the transistor associated with the first memory cell and (ii) to the drain region of the transistor associated with the second memory cell.

11. The semiconductor memory array of claim 1 wherein the first electrical signals include (1) a first gate signal applied: (i) to the gate of the

transistor associated with the first memory cell and (ii) to the gate of the transistor associated with the second memory cell, and (2) a first drain signal applied: (i) to the drain region of the transistor associated with the first memory cell and (ii) to the drain region of the transistor associated with the second memory cell.

12. A semiconductor memory array comprising:

a plurality of memory cells, each memory cell including an associated transistor having a source region, a drain region, an electrically floating body region disposed therebetween, and a gate disposed over the electrically floating body region and separated therefrom by a dielectric, wherein each memory cell (i) further includes a charge in the body region of the associated transistor which varies with time and (ii) is reversibly programmed in:

a first data state which is representative of a first charge state provided in the body region of the associated transistor; and

a second data state which is representative of a second charge in the body region of the associated transistor, wherein the first charge is greater than the second charge; and

circuitry, coupled to the plurality of memory cells, to apply first electrical signals to the plurality of memory cells wherein:

memory cells that are in the first data state, in response to the first electrical signals, are refreshed, and

memory cells that are in the second data state, in response to the first electrical signals, maintain the second data state.

13. The semiconductor memory array of claim 12 wherein the circuitry includes a refreshing circuit, a selection circuit and a writing circuit.

14. The semiconductor memory array of claim 12 wherein, in response to the first electrical signals, each memory cell that is in the first data state is refreshed by increasing the number of majority carriers in the body region of the associated transistor.

15. The semiconductor memory array of claim 12 wherein, in response to the first electrical signals:

the transistor of each memory cell in the first data state includes a conductive channel, in the body region, between the source region and the drain region; and

the transistor of each memory cell in the second data state does not include a conductive channel, in the body region, between the source region and the drain region.

16. The semiconductor memory array of claim 12 wherein the conductivity of memory cells in the first state is higher than the conductivity of memory cells in the second state.

17. The semiconductor memory array of claim 12 wherein the circuitry simultaneously applies second electrical signals to the plurality of memory cells, wherein, in response, the memory cells that are in the second data state are refreshed, and the memory cells that are in the first data state maintain the first data state.

18. The semiconductor memory array of claim 17 wherein, in response to the second electrical signals, each memory cell that is in the second data state is refreshed by reducing the number of majority carriers in the body region of the associated transistor.

19. The semiconductor memory array of claim 12 wherein the first electrical signals include (1) a first gate signal applied to the gate of each transistor of each memory cell of the plurality of memory cells and (2) a first drain signal applied to the drain region of each transistor of each memory cell of the plurality of memory cells.

20. A semiconductor memory array comprising:

a plurality of memory cells arranged in a matrix form, each memory cell including an associated transistor having a source region, a drain region, an electrically floating body region disposed therebetween, and a gate disposed over the electrically floating body region and separated therefrom by a dielectric, wherein each memory cell is in:

a first data state which is representative of a first charge in the body region of the associated transistor; or

a second data state which is representative of a second charge in the body region of the associated transistor; and

circuitry, coupled to the plurality of memory cells, to simultaneously apply first electrical signals to a plurality of memory cells wherein, in response to the first electrical signals, the memory cells: (1) that are in the first data state are refreshed, and (2) that are in the second data state maintain the second data state.

21. The semiconductor memory array of claim 20 wherein the circuitry includes a refreshing circuit, a selection circuit and a writing circuit.

22. The semiconductor memory array of claim 20 wherein, in response to the first electrical signals, each memory cell that is in the first data state is refreshed by increasing the number of majority carriers in the body region of the associated transistor.

23. The semiconductor memory array of claim 20 wherein, in response to the first electrical signals:

the transistor of each memory cell in the first data state includes a conductive channel, in the body region, between the source region and the drain region; and

the transistor of each memory cell in the second data state does not include a conductive channel, in the body region, between the source region and the drain region.

24. The semiconductor memory array of claim 20 wherein the conductivity of memory cells in the first state is higher than the conductivity of memory cells in the second state.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2011
From: INNOVATIVE SILICON ISI S.A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025850/0798 →