Method for matching two measurement methods for measuring structure widths on a substrate

1. A method of setting a measuring height of a first measurement method for measuring structure widths of trapezoidally tapering structures on a substrate wafer to a measuring height of a second measurement method for measuring the structure widths to obtain measured values for the structure width which are comparable with one another, in the setting procedure the second measurement method measuring a second structure width at an unknown second height above a surface of the substrate, and the first measurement method measuring a first structure width at a first height, the first height being set, comprising:

measuring the first structure width of a test structure by using the first measurement method at the first height;

determining at least one further parameter using the first measurement method to completely describe the trapezoidal form of the test structure;

measuring the second structure width of the test structure using the second measurement method;

determining the second height from the first structure width, the first height, the second structure width, and from the at least one further parameter; and

setting the measuring height of the first measurement method to the second height of the second measurement method.

2. The method as claimed in claim 1 , the second measurement method being at least one of a method of electron beam microscopy and the first measurement method being an optical measurement method based on ellipsometry or reflectometry.

3. The method as claimed in claim 1 , the at least one parameter for determining the trapezoidal form of the test structure comprising at least one of the sidewall angle and the structure width at a further height.

4. The method as claimed in claim 1 , the determination of the at least one further parameter in the first measurement method being based on an underlying model.