Plasma processing method and plasma processing apparatus
View Patent ↗In a plasma processing apparatus using electrostatic chuck, increase of plasma potential is prevented and abnormal discharge is avoided. The plasma processing apparatus comprises an RF source for generating plasma in a vacuum container, another RF source for applying an RF bias power to a sample, a sample stage having an electrostatic chuck electrode, a DC power supply for applying an electrostatic chuck voltage to the electrode, and a controller for shifting the electrostatic chuck voltage to negative by a potential difference of quarter to half of peak-to-peak voltage of the RF bias power for suppressing increase of plasma potential.
1. A plasma processing method for a plasma processing apparatus including a first RF source for generating plasma in a vacuum container having an insulating member lining an inner wall surface,
a sample stage having a dielectric coating surrounding at least one electrostatic chuck electrode placed on an upper portion of the sample stage, for electrostatic chucking a sample, a second RF source for applying an RF bias power for the sample on the sample stage; and
a DC power supply for applying at least one electrostatic chuck voltage to the at least one electrostatic chuck electrode within the dielectric coating,
the method comprising:
varying the at least one electrostatic chuck voltage to negative in accordance with application of the RF bias power, for suppressing increase of plasma potential of the plasma.
2. A plasma processing method according to claim 1 , wherein
the at least one electrostatic chuck voltage is shifted to negative by a potential difference of quarter to half of a peak-to-peak voltage of the RF bias power.
3. A plasma processing method according to claim 1 , wherein
the at least one electrostatic chuck voltage is shifted to negative by a potential difference of quarter to half of a peak-to-peak voltage of the RF bias power; and
the at least one electrostatic chuck voltage is shifted according to a monitored result of the peak-to-peak voltage of the RF bias power or a recipe setting of a voltage shift.
4. A plasma processing method according to claim 1 , wherein
the at least one electrostatic chuck electrode at the sample stage is in one of a monopole configuration and a dipole configuration.
5. A plasma processing method according to claim 1 , wherein
the at least one electrostatic chuck electrode at the sample stage is in one of a monopole configuration and a dipole configuration; and
when the at least one electrostatic chuck electrode is in the dipole configuration, the at least one electrostatic chuck voltage is shifted to negative by 50 to 500 V for both electrodes, and
when the at least one electrostatic chuck electrode is in the monopole configuration, the at least one electrostatic chuck voltage is shifted to negative by 50 to 500 V.
6. A plasma processing apparatus comprising:
a first RF source for generating plasma in a vacuum container having an insulating member lining an inner wall surface;
a sample stage having a dielectric coating including at least one electrostatic chuck electrode placed on an upper portion of the sample stage for electrostatic chucking of a sample;
a second RF source for applying an RF bias power for a sample on the sample stage;
a DC power supply for applying at least one electrostatic chuck voltage to the at least one electrostatic chuck electrode within the dielectric coating; and
a controller for varying the at least one electrostatic chuck voltage to negative in accordance with application of the RF bias power, for suppressing increase of plasma potential of the plasma.
7. A plasma processing apparatus according to claim 6 , wherein
the controller controls the at least one electrostatic chuck voltage so that the at least one electrostatic chuck voltage is shifted to negative by a potential difference of quarter to half of a peak-to-peak voltage of the RF bias power.
8. A plasma processing apparatus according to claim 6 , wherein
the controller controls the at least one electrostatic chuck voltage so that the at least one electrostatic chuck voltage is shifted to negative by a potential difference of quarter to half of a peak-to-peak voltage of the RF bias power; and
the controller shifts the at least one electrostatic chuck voltage according to a monitored result of the peak-to-peak voltage of the RF bias power or a recipe setting of a voltage shift.
9. A plasma processing apparatus according to claim 6 , wherein
the at least one electrostatic chuck electrode at the sample stage is in one of a monopole configuration and a dipole configuration.
10. A plasma processing apparatus according to claim 6 , wherein
the at least one electrostatic chuck electrode at the sample stage is in one of a monopole configuration and a dipole configuration; and
when the at least one electrostatic chuck electrode is in the dipole configuration, the controller shifts the at least one electrostatic chuck voltage to negative by 50 to 500 V for both electrodes, and
when the at least one electrostatic chuck electrode is in the monopole configuration, the controller shifts the at least one electrostatic chuck voltage to negative by 50 to 500 V.
11. A plasma processing method according to claim 1 , comprising:
varying the at least one electrostatic chuck voltage to negative in relation to a value of a peak-to-peak voltage of the RF bias power, for suppressing increase of plasma potential of the plasma.
12. A plasma processing apparatus according to claim 6 , comprising:
the controller for varying the at least one electrostatic chuck voltage to negative in relation to a value of a peak-to-peak voltage of the RF bias power, for suppressing increase of plasma potential of the plasma.