Granted Patent B2

US 7,262,494 · App. 11/082,096 · Granted Aug 28, 2007

Abstract

Claims (12)

1. A three dimensional (3D) package, comprising:

a first integrated circuit (IC) die electrically connected to a first lead frame;

a second IC die electrically connected to a second lead frame, wherein the first lead frame is stacked on the second lead frame;

at least one stud bump electrically connecting the first lead frame to the second lead frame, wherein the at least one stud bump is selectively formed where an electrical connection between the first lead frame and the second lead frame is required;

a mold compound encapsulating the first and second lead frames, the first and second IC dies, and the stud bump; and

a passive electronic device electrically connected to at least one terminal on one side of the package, wherein the passive electronic device electrically connects the 3D package to a second 3D package.

2. The 3D package of claim 1 , wherein the 3D packages are Quad Flat No-Lead type packages.

3. The 3D package of claim 1 , further comprising a plurality of terminals on each side of the packages.

4. The 3D package of claim 1 , wherein the passive electronic device is one of a capacitor and a resistor.

5. The 3D package of claim 1 , further comprising a third IC die electrically connected to a third lead frame and wherein the third lead frame is stacked on the second lead frame and electrically connected thereto with a plurality of stud bumps and the mold compound encapsulates the first, second and third lead frames, the first, second and third IC dies, and the stud bumps.

6. The 3D package of claim 1 , wherein the first IC die is electrically connected to the first lead frame via wirebonding.

7. The 3D package of claim 1 , wherein the first IC die is electrically connected to the first lead frame as a flip-chip with a plurality of second stud bumps.

Assignments (17)