Method of manufacturing a semiconductor device having damascene structures with air gaps

1. A method of manufacturing a semiconductor device having damascene structures with air gaps, the method comprising:

providing a substantially planar layer having a first metal layer;

depositing a via level dielectric layer on the substantially planar layer;

patterning the via level dielectric layer;

at least partly etching the via level dielectric layer;

depositing a disposable layer on the at least partly etched portion and the remaining non-etched portion of the via level dielectric layer;

patterning the disposable layer;

depositing a second metal layer on the via level dielectric layer and between the patterned portions of the disposable layer;

planarizing the second metal layer;

depositing a permeable dielectric layer on the planarized second metal layer and the patterned portions of the disposable layer; and

removing the patterned portions of the disposable layer through the permeable dielectric layer so as to form air gaps.

2. The method according to claim 1 , further comprising:

depositing a barrier layer on the patterned disposable layer; and

depositing a seed layer on the barrier layer.

3. The method according to claim 2 , further comprising:

depositing a further barrier layer on the planarized second metal layer.

4. The method according to claim 1 , wherein the disposable layer is a photoresist layer or an organic polymer with a low mass.

5. The method according to claim 4 , further comprising:

spinning the photoresist layer on the at least partly etched via level dielectric layer.

6. The method according to claim 2 , wherein the patterning and etching of the via level dielectric layer is adapted to form additional via holes in the via level dielectric layer to provide metal dummy structures in the via level dielectric layer after the removing the patterned portions of the disposable layer.

7. The method according to claim 3 , wherein the patterning and etching of the via level dielectric layer is adapted to form additional via holes in the via level dielectric layer to provide metal dummy structures in the via level dielectric layer after the removing the patterned portions of the disposable layer.

8. The method according to claim 2 , wherein a single CVD reactor is used for performing the removing by heating to decompose the patterned portions of the disposable layer and for depositing a trench dielectric layer thereafter.

9. The method according to claim 3 , wherein a single CVD reactor is used for performing the removing by heating to decompose the patterned portions of the disposable layer and for depositing a trench dielectric layer thereafter.

10. A semiconductor device having damascene structures with air gaps, comprising:

a substantially planar layer having a first metal layer;

a patterned and at least partly etched via level dielectric layer formed on the substantially planar layer;

a patterned disposable layer deposited on the at least partly etched portion and the remaining non-etched portion of the via level dielectric layer;

a planarized second metal layer formed between the patterned portions of the disposable layer;

a permeable dielectric layer formed on the planarized second metal layer and the patterned portions of the disposable layer; and

at least one air gap formed by removing the patterned portions of the disposable layer through the permeable dielectric layer.

11. The semiconductor device of claim 10 , further comprising a first barrier layer formed on the side portions of the second metal layer.

12. The semiconductor device of claim 11 , wherein the first barrier layer comprises Ta, TaN, Ti, TiN, WCN, or combinations thereof or any other suitable metallic diffusion barrier layer.

13. The semiconductor device of claim 11 , further comprising a second barrier layer formed on the top portion of the second metal layer.

14. The semiconductor device of claim 13 , wherein the second barrier layer comprises Ta, TaN, Ti, TiN, WCN, or combinations thereof or any other suitable metallic diffusion barrier layer.

15. A method of manufacturing a semiconductor device having damascene structures with air gaps, the method comprising:

providing a substantially planar layer having a first metal layer;

depositing a via level dielectric layer on the substantially planar layer;

patterning the via level dielectric layer;

at least partly etching the via level dielectric layer;

depositing a disposable layer on the at least partly etched via level dielectric layer;

patterning the disposable layer;

depositing a second metal layer on the via level dielectric layer and between the patterned portions of the disposable layer;

planarizing the second metal layer;

depositing a permeable dielectric layer on the planarized second metal layer and the patterned portions of the disposable layer; and

removing the patterned portions of the disposable layer through the permeable dielectric layer so as to form air gaps, wherein the method is used in processes to manufacture CMOS, RFCMOS and BiCMOS devices.

16. A method of manufacturing a semiconductor device having damascene structures with air gaps, the method comprising:

providing a substantially planar layer having a first metal layer;

depositing and at least partly etching a via level dielectric layer on the substantially planar layer;

forming a patterned disposable layer on the at least partly etched portion and the remaining non-etched portion of the via level dielectric layer;

forming a planarized second metal layer between the patterned portions of the disposable layer; and

depositing a permeable dielectric layer on the patterned portions of the disposable layer and the second metal layer, wherein the patterned portions of the disposable layer are removed through the permeable layer, so as to form air gaps therein.

17. The method according to claim 1 , wherein the depositing of the disposable layer is performed as a single procedure and wherein the same material is deposited on the at least partly etched portion and the remaining non-etched portion of the via level dielectric layer.

18. The method according to claim 16 , wherein the depositing of the disposable layer is performed as a single procedure and wherein the same material is deposited on the at least partly etched portion and the remaining non-etched portion of the via level dielectric layer.