IP Library Granted Patent US 7,285,792
Granted Patent B2
US 7,285,792 · App. 11/086,812 · Granted Oct 23, 2007

Scratch repairing processing method and scanning probe microscope (SPM) used therefor

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Quick Facts
Patent No.
US 7,285,792
App. No.
11/086,812
Granted
Oct 23, 2007
Kind
B2
Abstract

A sample to be processed is disposed within a processing cell which contains a liquid. Scratch processing using a scanning probe microscope is performed within the liquid so that chips or shavings removed from the sample scatter within the liquid rather than collecting on the surface of the sample. The processing cell has a supply port and a discharge port so that new liquid can be supplied within the cell through the supply port after the termination of the scratch processing to clean the cell. In this manner, chips or shavings generated by scratch processing a defect portion of the sample can be removed completely without being collected at the surface of a sample despite the surface tension of adsorbed water existing on the sample surface and/or electrostatic charges caused by friction.

Claims (27)

1. A scratch repairing processing method for scratch-processing an excessive defect of a sample by using a probe of a scanning probe microscope, the method comprising the steps of:

providing a sample having an excessive defect; and

scratch-processing the sample using the probe of the scanning probe microscope to remove the excessive defect while the sample is placed within a liquid so that chips or shavings removed from the sample scatter within the liquid rather than remaining on a surface of the sample.

2. A scanning probe microscope for a scratch repairing processing: comprising:

a sample stage;

a processing cell placed on the sample stage and containing a liquid in which is placed, during use of the scanning probe microscope, a sample having an excessive defect;

moving means for scan driving a probe within the liquid contained in the processing cell under control of control means to remove the excessive defect; and

means for detecting a deviation of the probe.

3. A scanning probe microscope for a scratch repairing processing according to claim 2 ; wherein the processing cell has a supply port and a discharge port for the liquid so that new liquid can be supplied within the cell through the supply port to clean within the cell.

4. A scratch repairing processing method according to claim 1 ; further including the steps of providing a processing cell that contains the liquid; carrying out the scratch-processing step while the sample is placed within the liquid in the processing cell; and replacing the liquid in the processing cell to remove the chips or shavings scattered within the liquid.

5. A scratch repairing processing method according to claim 4 ; further including the step of withdrawing the scratch-processed sample from the liquid.

6. A scratch repairing processing method according to claim 1 ; further including the step of withdrawing the scratch-processed sample from the liquid.

7. A scratch repairing processing method according to claim 6 ; wherein the sample is a photo mask and the excessive defect is a black defect.

8. A scratch repairing processing method according to claim 1 ; wherein the sample is a photo mask and the excessive defect is a black defect.

9. A method of removing an unwanted portion of a sample, comprising the steps:

providing a sample having an unwanted portion that is to be removed;

immersing the sample in a liquid; and

using a probe of a scanning probe apparatus to remove the unwanted portion of the sample while the sample is immersed in the liquid.

10. A method according to claim 9 , further including the step of withdrawing the sample from the liquid after removal of the unwanted portion of the sample.

11. A method according to claim 10 ; wherein the using step comprises scanning the probe while pressing the probe against the unwanted portion of the sample so that the probe scrapes off the unwanted portion of the sample and the scraped-off scrapings disperse in the liquid.

12. A method according to claim 11 ; wherein the immersing step comprises immersing the sample in a container containing the liquid.

13. A method according to claim 11 ; wherein the sample is a photo mask and the unwanted portion is a black defect.

14. A method according to claim 9 ; wherein the using step comprises scanning the probe while pressing the probe against the unwanted portion of the sample so that the probe scrapes off the unwanted portion of the sample and the scraped-off scrapings disperse in the liquid.

15. A method according to claim 9 ; wherein the sample is a photo mask and the unwanted portion is a black defect.

16. A method according to claim 9 ; wherein the immersing step comprises immersing the sample in a container that is disposed on a sample stage of the scanning probe apparatus and that contains the liquid.

17. A method according to claim 16 ; wherein the using step comprises scanning the probe while pressing the probe against the unwanted portion of the sample so that the probe scrapes off the unwanted portion of the sample and the scraped-off scrapings disperse in the liquid.

18. A method according to claim 17 ; further including the step of withdrawing the sample from the liquid after removal of the unwanted portion of the sample.

Assignments (2)
CHANGE OF NAME Recorded Sep 25, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033817/0078 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2005
From: WATANABE, NAOYA; TAKAOKA, OSAMU
To: SII NANO TECHNOLOGY INC.
Reel/Frame 016497/0242 →