BGA semiconductor device having a dummy bump
View Patent ↗A BGA semiconductor device includes a semiconductor package and a mounting board mounting thereon the semiconductor package, wherein an array of signal electrodes of the semiconductor package and an array of signal electrodes of the mounting board are coupled together via signal bumps. The BGA semiconductor device also includes a dummy bump, which reinforces the bending strength of the BGA semiconductor device and is broken by a shearing force caused by thermal expansion to alleviate the stress for the signal bumps.
1. A ball-grid array (BGA) semiconductor device comprising:
a semiconductor package including a package substrate having first and second main surfaces opposing to each other, an IC chip mounted on said first main surface of said package substrate, and an array of first signal electrodes formed on said second main surface of said package substrate;
a mounting board having an array of second signal electrodes, each of said second electrodes being bonded onto a corresponding one of said first signal electrodes via a signal bump; and
a dummy bump intervening between said package substrate and said mounting board, said dummy bump being fixed onto said package substrate and in contact with said mounting board without fixation thereon,
wherein said mounting board further has a first insulating film which covers said mounting board with leaving at least a part of each of said second electrodes exposed, said first insulating film having a hole that exposes a portion of said mounting board, the dummy bump being in contact with said exposed portion of said mounting board such that said dummy bump is in direct contact with a surface of said mounting board and said dummy bump is allowed to slide directly on said surface of said mounting board.
2. The semiconductor device as claimed in claim 1 , wherein said semiconductor package further having a dummy electrode on said second main surface of said package substrate of said semiconductor package, said dummy bump is fixed onto said dummy electrode on said package substrate of said semiconductor package.
3. The semiconductor device as claimed in claim 2 , wherein said semiconductor package further includes a second insulating film which covers said second main surface of said package substrate with leaving at least a part of each of said first electrodes and said dummy electrode uncovered.
4. The semiconductor device as claimed in claim 3 , wherein said second insulating film includes a solder resist film.
5. The semiconductor device as claimed in claim 1 , wherein said first insulating film includes a solder resist film.