Method of separating a mold from a solidified layer disposed on a substrate
View Patent ↗The present invention is directed towards a method of separating a mold, included in a template, from a layer disposed on a substrate, the method including, inter alia, applying a separation force to the template to separate the template from the layer; and facilitating localized deformation in the substrate to reduce the separation force required to achieve separation.
1. A method of separating a mold, included in a template, from a layer disposed on a substrate, said method comprising:
applying a separation force to said template to separate said template from said layer; and
facilitating localized deformation in said substrate, wherein facilitating further includes applying a positive pressure to first regions of said substrate and applying a vacuum to second regions of said substrate such that said vacuum constrains said substrate in second regions of said substrate as said positive pressure deforms first regions of said substrate in a first direction.
2. The method as recited in claim 1 wherein facilitating further includes facilitating localized deformation in response to said separation force.
3. The method as recited in claim 1 wherein facilitating further includes facilitating localized deformation of said substrate in a region in superimposition with said mold.
4. The method as recited in claim 1 wherein facilitating further includes said facilitating localized deformation of said substrate in a region in superimposition with said mold while avoiding deformation of areas of said substrate outside of said region.
5. The method as recited in claim 1 wherein said mold is adhered to said layer by an adhesion force with applying further including applying said separation force with a magnitude to overcome said adhesion force.
6. A method of separating a mold, included in a template, from a layer disposed on a substrate, said method comprising:
applying a separation force to said template to separate said template from said layer; and
facilitating localized deformation in said substrate, wherein facilitating further includes applying a vacuum to said substrate at a plurality of spaced-apart regions, a subset of which has a vacuum associated therewith that is less than the vacuum associated with the remaining regions of said plurality of spaced-apart regions.
7. The method as recited in claim 1 wherein facilitating further includes applying a pushing force directed against said substrate to move said substrate away from said template.
8. A method of separating a mold, included in a template, from a layer disposed on a substrate, said method comprising:
applying a separation force to said template to separate said template from said layer; and
facilitating localized deformation in said substrate, wherein facilitating further includes applying a positive pressure to first regions of said substrate, in superimposition with said mold, and applying a vacuum to second regions of said substrate outside of said first regions such that said vacuum constrains said substrate in second regions of said substrate as said positive pressure deforms first regions of said substrate in a first direction.
9. The method as recited in claim 8 wherein generating further includes facilitating localized deformation of said substrate in a region in superimposition with said mold while avoiding deformation of areas of said substrate outside of said region.
10. A method of separating a mold, included in a template, adhered to a layer, with an adhesion force, which is disposed on a substrate, said method comprising:
applying a separation force, having a magnitude associate therewith, to said template, and
generating sufficient localized deformation in said substrate to facilitate overcoming said adhesion force with said separation force, wherein generating further includes applying a vacuum to said substrate at a plurality of spaced-apart regions, a subset of which has a vacuum associated therewith that is less than the vacuum associated with the remaining regions of said plurality of spaced-apart regions.
11. A method of separating a mold, included in a template, adhered to a layer, with an adhesion force, which is disposed on a substrate, said method comprising:
applying a separation force, having a magnitude associated therewith, to said template; and
generating sufficient localized deformation in said substrate to facilitate overcoming said adhesion force with said separation force, wherein generating further includes applying a positive pressure to first regions of said substrate and applying a vacuum to second regions of said substrate such that said vacuum constrains said substrate in second regions of said substrate as said positive pressure deforms first regions of said substrate in a first direction.
12. The method as recited in claim 10 wherein facilitating further includes generating localized deformation in response to said separation force.
13. A method of separating a mold, included in a template, adhered to a layer, with an adhesion force, which is disposed on a substrate, said method comprising:
applying a separation force, having a magnitude associated therewith, to said template; and
generating sufficient localized deformation in said substrate to facilitate overcoming said adhesion force with said separation force, wherein generating further includes applying a positive pressure to first regions of said substrate and applying a vacuum to second regions of said substrate such that said vacuum constrains said substrate in second regions of said substrate as said positive pressure deforms first regions of said substrate in a first direction; and
applying a pushing force directed against said substrate to move said substrate away from said template.
14. The method as recited in claim 13 wherein pushing further includes directing a flow of gas against regions of said substrate outside of a zone of said substrate in superimposition with said mold.
15. A method of separating a mold, included in a template, adhered to a layer, with an adhesion force, which is disposed on a substrate, said method comprising:
applying a separation force, having a magnitude associated therewith, to said template; and
generating sufficient localized deformation in said substrate to facilitate overcoming said adhesion force with said separation force; and
applying a pushing force directed against said substrate to move said substrate away from said template, wherein generating further includes applying a vacuum to said substrate at a plurality of spaced-apart regions, a subset of which has a vacuum associated therewith that is less than the vacuum associated with the remaining regions of said plurality of spaced-apart regions.