Producing reference voltages using transistors
An exemplary circuit embodiment includes a depletion-mode transistor and an enhancement-mode transistor. The circuit also includes a circuit portion coupled to a gate region of the depletion-mode transistor and to a gate region of the enhancement-mode transistor. In this embodiment, the circuit portion is configured to provide a reference voltage at an output node, wherein the reference voltage is associated with a difference between a voltage at the gate region of the depletion-mode transistor and a voltage at the gate region of the enhancement-mode transistor.
1. A circuit, comprising:
a depletion-mode transistor;
an enhancement-mode transistor; and
a circuit portion coupled to a gate region of the depletion-mode transistor and to a gate region of the enhancement-mode transistor and configured to provide a reference voltage at an output node, the reference voltage being associated with a difference between a first voltage at the gate region of the depletion-mode transistor and a second voltage at the gate region of the enhancement-mode transistor, and wherein the circuit portion is further configured to regulate the first voltage and the second voltage so that respective currents through the depletion-mode transistor and the enhancement-mode transistor are maintained in a substantially fixed relationship.
2. The circuit of claim 1 , wherein the first voltage is a gate-source voltage of the depletion-mode transistor, and wherein the second voltage is a gate-source voltage of the enhancement-mode transistor.
3. The circuit of claim 1 , wherein at least one of the depletion-mode transistor or the enhancement-mode transistor is a high electron mobility transistor (HEMT).
4. The circuit of claim 3 , wherein at least one of the depletion-mode transistor or the enhancement-mode transistor is a pseudomorphic HEMT.
5. The circuit of claim 1 , further comprising a current source coupled to respective parallel current paths through the depletion-mode transistor and the enhancement-mode transistor.
6. The circuit of claim 5 , wherein the circuit portion further comprises an operational amplifier having a first input coupled to a first of the parallel current paths, a second input coupled to a second of the parallel current paths, and an output coupled to the gate region of the enhancement-mode transistor and to the gate region of the depletion-mode transistor, the output being coupled to the gate of the depletion-mode transistor through a resistive element.
7. The circuit of claim 1 , wherein the circuit portion further comprises a temperature compensation circuit of one or more serially connected transistors.
8. The circuit of claim 1 , wherein the depletion-mode transistor, the enhancement-mode transistor, and the circuit portion are defined on a common semiconductor substrate.
9. The circuit of claim 1 , wherein the first transistor and the second transistor are transistors selected from the group consisting of high electron mobility transistors (HEMTs), metal-oxide-semiconductor FETs (MOSFETs), metal-semiconductor FETs (MESFETs), and heterojunction-insulated gate FETs (HIGFETs).
10. The circuit of claim 3 , wherein the HEMTs are meta-morphic HEMTs (mHEMTs) or pseudomorphic HEMTs (pHEMTs).
11. A circuit, comprising:
a first transistor and a second transistor configured to provide a reference voltage based at least in part on a difference between a spatial dimension of the first transistor and a corresponding spatial dimension of the second transistor, wherein the first transistor and the second transistor are field effect transistors (FETs), the first and the second transistors comprising respective channel layers in electrical communication with respective gate control surfaces, a separation between the channel layer and the gate control surface of the first transistor being different than a separation between the channel layer and the gate control surface of the second transistor; and
a circuit portion coupled to both of the respective gate control surfaces of the first and second transistors and configured to produce an output voltage that is a function of the difference between gate voltages associated with the respective gate control surfaces, wherein the circuit portion further comprises a temperature compensation circuit configured to produce a current in the circuit portion that compensates for a current change in the first and/or second transistor associated with a temperature change.
12. A circuit, comprising:
a first transistor and a second transistor configured to provide a reference voltage based at least in part on a difference between a spatial dimension of the first transistor and a corresponding spatial dimension of the second transistor, wherein the first transistor and the second transistor are field effect transistors (FETs), the first and the second transistors comprising respective channel layers in electrical communication with respective gate control surfaces, a separation between the channel layer and the gate control surface of the first transistor being different than a separation between the channel layer and the gate control surface of the second transistor; and
a regulator circuit coupled to respective drains of the first and second transistors and to the respective gate control surfaces of the first and second transistors, the regulator circuit being responsive to changes in current through the first and second transistors and providing respective gate-source voltages to the gate control surfaces of the first and second transistors that stabilize the currents through the first and second transistors into a substantially fixed relationship.
13. The circuit of claim 12 , wherein the first and the second transistors are high electron mobility transistors (HEMTs).
14. The circuit of claim 12 , wherein the first transistor is a depletion-mode transistor and the second transistor is an enhancement-mode transistor.
15. The circuit of claim 12 , wherein the first and second transistors are implemented on a common chip.
16. The circuit of claim 12 wherein the gate control surface of at least one of the first and second transistors is formed in an amorphized region beneath a respective gate contact.
17. The circuit of claim 12 further comprising a circuit portion coupled to both of the respective gate control surfaces of the first and second transistors and configured to produce an output voltage that is a function of the difference between gate voltages associated with the respective gate control surfaces.
18. The circuit of claim 17 , wherein the circuit portion further comprises a temperature compensation circuit configured to produce a current in the circuit portion that compensates for a current change in the first and/or second transistor associated with a temperature change.
19. An electronic device, comprising:
a circuit configured to receive a reference voltage;
a reference-voltage circuit that generates the reference voltage, the reference-voltage circuit including an enhancement-mode high electron mobility transistor (HEMT) and a depletion-mode HEMT; and
wherein the reference-voltage circuit includes a regulator circuit portion configured to regulate the enhancement-mode HEMT and the depletion-mode HEMT so that currents through the respective HEMTs have a substantially fixed relationship.
20. The electronic device of claim 19 , wherein the enhancement-mode HEMT and the depletion-mode HEMT are implemented on a common semiconductor substrate.
21. The electronic device of claim 19 , wherein the enhancement-mode HEMT and the depletion-mode HEMT are pseudomorphic HEMTs (pHEMTs).
22. The electronic device of claim 19 , wherein the reference voltage is based on a difference between a gate-source voltage of the enhancement-mode HEMT and a gate-source voltage of the depletion-mode HEMT.
23. The electronic device of claim 19 , wherein the enhancement-mode HEMT includes a gate contact overlying a barrier layer, the barrier layer comprising an amorphized region beneath the gate contact.