Wafer level chip scale package and manufacturing method for the same
View Patent ↗Disclosed are a wafer level chip scale package and a method for manufacturing the same. An RDL is formed on a semiconductor die through a sputtering process, and a UBM is formed on the RDL through an electroplating process by using the RDL as a seed layer. Thus, the RDL sputtering, UBM electroplating, RDL etching and leakage descum processes are carried out only one time, thereby simplifying the structure and manufacturing processes of the package. Since a copper layer of the RDL is formed with a relatively large thickness through the sputtering process, current density is uniformly distributed during the electroplating process, so it is possible to uniformly form the thickness of the UBM by using pure nickel.
1. A wafer level chip scale package comprising:
a semiconductor die including at least one bond pad and a passivation layer formed at an outer peripheral portion of the bond pad;
a first insulative layer formed on the passivation layer and having a first opening corresponding to the bond pad and a second opening spaced from the bond pad by a distance;
a re-distribution layer (RDL) formed on the passivation layer so as to connect the first opening to the second opening;
an under bumped metal (UBM) formed on the RDL corresponding to the second opening of the first insulative layer;
a second insulative layer formed on the first insulative layer, the RDL and the UBM and having a third opening, wherein a size of the third opening is less than a size of the UBM such that a portion of the UBM is covered by the second insulative layer; and
a solder ball welded to the UBM.
2. The wafer level chip scale package as claimed in claim 1 , wherein the RDL includes a titanium layer formed through a sputtering process and a copper layer formed on the titanium layer through the sputtering process.
3. The wafer level chip scale package as claimed in claim 1 , wherein the first insulative layer and the second insulative layer are made from an insulative material selected from the group consisting of polybenzoxazoles (PBO) and benzocyclobutene (BCB).
4. The wafer level chip scale package as claimed in claim 1 , wherein the UBM includes pure nickel formed through a plating process.
5. The wafer level chip scale package as claimed in claim 4 , wherein a metal selected from the group consisting of Cu, Sn and Au is formed on the pure nickel through the plating process.
6. The wafer level chip scale package as claimed in claim 1 , wherein a welding area of the solder ball is defined by the second insulative layer formed at an outer portion of the UBM such that the solder ball is welded to the UBM.
7. The wafer level chip scale package as claimed in claim 1 , wherein a welding area of the solder ball is smaller than a width of the UBM.