Targets for measurements in semiconductor devices
View Patent ↗Targets or test structures used for measurements in semiconductor devices having long lines exceeding design rule limitations are divided into segments. In one embodiment, the segments have periodicity in a direction parallel to the length of the lines. In another embodiment, the segments of test structures in adjacent lines do not have periodicity in a direction parallel to the length of the lines. The lack of periodicity is achieved by staggering segments of substantially equal lengths in adjacent lines, or by dividing the lines into segments having unequal lengths. The test structures may be formed in scribe line regions or die regions of a semiconductor wafer.
1. A test structure for a semiconductor device, comprising:
at least one grating, the grating comprising a plurality of parallel lines, each of the plurality of parallel lines having a first length, wherein each line is divided into a plurality of discrete segments along the first length of the line,
wherein the segments of the lines comprise varying dimensions,
wherein segments in adjacent lines are staggered in the direction parallel to the first length of the plurality of parallel lines, and
wherein the plurality of parallel lines comprises a first line and at least one second line parallel to the first line, wherein the first line comprises a first segment and at least one second segment, the first segment and second segment comprising different lengths, wherein the at least one second line comprises a third segment and a fourth segment, the third segment and the fourth segment comprising different lengths, wherein the first segment of the first line is proximate the third segment of the at least one second line, wherein a first end of the first segment is not aligned with a first end of the third segment, wherein a second end of the first segment is not aligned with a second end of the second segment, wherein the second segment of the first line is proximate the fourth segment of the at least one second line, wherein a first end of the second segment is not aligned with a first end of the fourth segment, and wherein a second end of the second segment is not aligned with a second end of the fourth segment.
2. The test structure according to claim 1 , wherein each segment comprises a length less than a design rule limitation dimension for the semiconductor device.
3. The test structure according to claim 1 , wherein a majority of the segments of the lines comprise substantially the same dimension.
4. The test structure according to claim 3 , wherein segments at the ends of the lines comprise a smaller dimension than segments in a central region of the lines.
5. The test structure according to claim 1 , wherein segments in adjacent lines are staggered in the direction parallel to the first length of the plurality of parallel lines.
6. The test structure according to claim 1 , wherein the gratings are arranged in two horizontal rows having a first end and a second end, and two vertical columns disposed at the first end and the second end of the two horizontal rows.
7. The test structure according to claim 1 , wherein the test structure is located in a scribe line region of a semiconductor wafer or in a die region of a semiconductor wafer.
8. The test structure according to claim 1 , wherein the test structure comprises a target for measurements of scatterometry, alignment, or overlay.
9. A method of designing a test structure for a semiconductor device, the method comprising:
designing a test structure comprising at least one grating, the grating comprising a plurality of parallel lines, each of the plurality of parallel lines having a first length; and
dividing each line of the grating into a plurality of discrete segments along the first length of the line,
wherein dividing each line of the grating into the plurality of discrete segments comprises dividing each line such that segments in adjacent parallel lines lack periodicity in a direction parallel to the first length of the plurality of parallel lines,
wherein dividing each line of the grating into a plurality of discrete segments comprises dividing each line such that the segments of the lines comprise varying dimensions, and
wherein the plurality of parallel lines comprise a first line and at least one second line parallel to the first line, wherein dividing each line of the grating into a plurality of discrete segments comprises dividing each line such that the first line comprises a first segment and at least one second segment, the first segment and second segment comprising different lengths, such that the at least one second line comprises a third segment and a fourth segment, the third segment and the fourth segment comprising different lengths, wherein dividing each line of the grating into a plurality of discrete segments further comprises dividing each line such that the first segment of the first line is proximate the third segment of the at least one second line, such that a first end of the first segment is not aligned with a first end of the third segment, such that a second end of the first segment is not aligned with a second end of the second segment, such that the second segment of the first line is proximate the fourth segment of the at least one second line, such that a first end of the second segment is not aligned with a first end of the fourth segment, and such that a second end of the second segment is not aligned with a second end of the fourth segments.
10. The method according to claim 9 , wherein dividing each line of the grating into a plurality of discrete segments comprises dividing each line such that each segment comprises a length less than a design rule limitation dimension for the semiconductor device.
11. The method according to claim 9 , wherein dividing each line of the grating into a plurality of discrete segments comprises dividing each line such that each segment comprises a length less than a design rule limitation dimension for the semiconductor device.
12. The method according to claim 9 , wherein dividing each line of the grating into a plurality of discrete segments comprises dividing each line such that a majority of the segments of the lines comprise substantially the same dimension.
13. The method according to claim 12 , wherein dividing each line of the grating into a plurality of discrete segments comprises dividing each line such that segments at the ends of the lines comprise a smaller dimension than segments in a central region of the lines.
14. The method according to claim 9 , wherein dividing each line of the grating into a plurality of discrete segments comprises dividing each line such that segments in adjacent lines are staggered in the direction parallel to the first length of the plurality of parallel lines.
15. The method according to claim 9 , wherein dividing each line of the grating into a plurality of discrete comprises dividing each line such that segments in adjacent lines are staggered in the direction parallel to the first length of the plurality of parallel lines.
16. The method according to claim 9 , wherein designing the test structure comprises designing a test structure comprising two horizontal rows of gratings each having a first end and a second end, and two vertical columns of gratings disposed at the first end and the second end of the two horizontal rows of gratings.
17. The method according to claim 9 , wherein designing the test structure comprises designing a test structure located in a scribe line region of a semiconductor wafer or in a die region of a semiconductor wafer.
18. The test structure according to claim 1 , wherein segments in adjacent parallel lines lack periodicity in a direction parallel to the first length of the plurality of parallel lines.
19. The test structure according to claim 18 , wherein each segment comprises a length less than a design rule limitation dimension for the semiconductor device.