Semiconductor device and method of manufacture
View Patent ↗A semiconductor component and method of manufacture, including an insulated gate bipolar transistor (IGBT) ( 100 ) including a semiconductor substrate ( 110 ) having a first conductivity type and buried semiconductor region ( 115 ) having a second conductivity type located above the semiconductor substrate. The IGBT further includes a plurality of first semiconductor regions ( 120 ) having the first conductivity type, a plurality of second semiconductor regions ( 130 ) having the first conductivity type, and a plurality of third semiconductor regions ( 140 ) having the second conductivity type. A sinker region ( 142 ) having the second conductivity type is disposed in a third semiconductor region and a first semiconductor region during manufacture to define the plurality of regions and tie the buried semiconductor region to the plurality of third semiconductor regions. An emitter ( 150 ) having the first conductivity type is disposed in one of the third semiconductor regions, a collector ( 170 ) having the first conductivity type is disposed in the other of the third semiconductor regions. A field poly plate ( 162 ) is provided and tied to the collector ( 170 ). In a particular embodiment, the plurality of third semiconductor regions and the buried semiconductor region deplete the plurality of first semiconductor regions in response to a reverse bias potential applied between the plurality of second semiconductor regions and the plurality of third semiconductor regions.
1. A method of manufacturing a semiconductor component comprising:
providing a composite substrate comprising a semiconductor epitaxial layer above a semiconductor substrate, the composite substrate having a first conductivity type;
forming a buried semiconductor region in the epitaxial layer, having a second conductivity type;
forming a first semiconductor region in the epitaxial layer, having the first conductivity type and located above the buried semiconductor region;
forming a plurality of second semiconductor regions in the epitaxial layer, having the first conductivity type and located above the first semiconductor region;
forming a third semiconductor region in the epitaxial layer, having the second conductivity type and located above the first semiconductor region;
forming a sinker region disposed in the first semiconductor region and the third semiconductor region, thereby defining a plurality of first semiconductor regions and a plurality of third semiconductor regions;
disposing an emitter having the first conductivity type in one of the second semiconductor regions in the epitaxial layer;
disposing a collector having the first conductivity type in one of the other of the second semiconductor regions in the epitaxial layer; and
forming a poly field plate above a portion of the second semiconductor region having the collector formed therein and a portion of the third semiconductor region,
wherein the plurality of third semiconductor regions and the buried semiconductor region deplete the plurality of first conductor regions in response to a reverse bias potential applied between the plurality of second semiconductor regions and the plurality of third semiconductor regions.
2. A method of manufacturing a semiconductor component as claimed in claim 1 wherein the first conductivity type is P-type and the second conductivity type is N-type.
3. A method of manufacturing a semiconductor component as claimed in claim 1 wherein forming the buried semiconductor region is formed as a continuous layer.
4. A method of manufacturing a semiconductor component as claimed in claim 1 further including the step of doping each of the first semiconductor regions to define a first portion and a second portion, at least a substantial part of each of the first portions is formed under one of the plurality of second semiconductor regions in the epitaxial layer, at least a substantial part of each of the second portions is formed under one of the plurality of third semiconductor regions in the epitaxial layer, and a doping concentration of each of the first portions is less than a doping concentration of each of the second portions.
5. A method of manufacturing a semiconductor component as claimed in claim 1 wherein the poly field plate is electrically tied to collector and provides high reverse blocking capability.