Circuit device with at least partial packaging and method for forming
View Patent ↗A circuit device ( 15 ) is placed within an opening of a conductive layer ( 10 ) which is then partially encapsulated with an encapsulant ( 24 ) so that the active surface of the circuit device ( 15 ) is coplanar with the conductive layer ( 10 ). At least a portion of the conductive layer ( 10 ) may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device ( 115 ) may be placed on a conductive layer ( 100 ) such that an active surface of circuit device ( 115 ) is between conductive layer ( 100 ) and an opposite surface of circuit device ( 115 ). The conductive layer ( 100 ) has at least one opening ( 128 ) to expose the active surface of circuit device ( 115 ). The encapsulant ( 24, 126, 326 ) may be electrically conductive or electrically non-conductive.
1. A device with at least partial packaging, comprising:
a circuit device having a first surface and a second surface opposite the first surface, wherein the first surface comprises active circuitry;
an electrically conductive layer having a first surface, a second surface opposite the first surface, and at least one opening, wherein:
the at least one opening at least partially surrounds the circuit device,
the first surface of the circuit device is substantially coplanar with the first surface of the electrically conductive layer, and
the electrically conductive layer comprises a first reference voltage plane;
an electrical contact, electrically coupled to the first reference voltage plane, said electrical contact enabling electrical contact to be made to said first reference voltage plane; and
an encapsulant layer at least partially filling a gap within the at least one opening between the circuit device and the electrically conductive layer, wherein the encapsulant layer overlies at least a first portion of the second surface of the electrically conductive layer.
2. The device of claim 1 , wherein the encapsulant layer comprises an electrically conductive material.
3. The device of claim 1 , wherein the encapsulant layer overlies at least a portion of the second surface of the circuit device.
4. The device of claim 1 , further comprising a second circuit device in physical contact with a second portion of the second surface of the electrically conductive layer.
5. The device of claim 4 , wherein the second circuit device is selected from a group consisting of a passive device, an optical device, an active device, and a semiconductor device, an antennae, and a micro-electro-mechanical system (MEMS) device.
6. The device of claim 4 , wherein the encapsulant layer overlies at least a portion of the second circuit device.
7. The device of claim 1 , wherein the first reference voltage plane is electrically coupled to the circuit device.
8. A device with at least partial packaging, comprising:
a circuit device having a first surface and a second surface opposite the first surface, wherein the first surface comprises active circuitry;
an electrically conductive layer having a first surface, a second surface opposite the first surface, and at least one opening, wherein:
the at least one opening at least partially surrounds the circuit device,
the first surface of the circuit device is substantially coplanar with the first surface of the electrically conductive layer, and
the electrically conductive layer comprises a first reference voltage plane;
an electrical contact, electrically coupled to the first reference voltage plane, said electrical contact enabling electrical contact to be made to said first reference voltage plane; and
an encapsulant layer at least partially filling a gap within the at least one opening between the circuit device and the electrically conductive layer, wherein the encapsulant layer overlies at least a portion of the second surface of the circuit device.
9. A device with at least partial packaging, comprising:
a circuit device having a first surface and a second surface opposite the first surface, wherein the first surface comprises active circuitry;
an electrically conductive layer having a first surface, a second surface opposite the first surface, and at least one opening, wherein:
the at least one opening at least partially surrounds the circuit device,
the first surface of the circuit device is substantially coplanar with the first surface of the electrically conductive layer, and
the electrically conductive layer comprises a first reference voltage plane;
an electrical contact, electrically coupled to the first reference voltage plane, said electrical contact enabling electrical contact to be made to said first reference voltage plane;
an encapsulant layer at least partially filling a gap within the at least one opening between the circuit device and the electrically conductive layer; and
a plurality of circuit devices, wherein said circuit device is a first one of the plurality of circuit devices, wherein the electrically conductive layer comprises a plurality of openings, wherein each of the plurality of openings at least partially surrounds one of the plurality of circuit devices.
10. The device of claim 9 , wherein each of the plurality of circuit devices has a first surface comprising active circuitry and a second surface opposite the first surface, wherein the first surfaces of each of the plurality of the circuit devices is substantially coplanar with the first surface of the electrically conductive layer.
11. The device of claim 10 , wherein the encapsulant layer overlies at least a portion of the second surfaces of the plurality of circuit devices.
12. The device of claim 11 , wherein the encapsulant layer comprises an electrically conductive material.
13. A method for forming a device having at least partial packaging, comprising:
providing an electrically conductive layer having a first surface, a second surface opposite the first surface, and at least one opening;
attaching an adhesive layer to the electrically conductive layer;
placing a circuit device on the adhesive layer within the at least one opening, wherein an active surface of the circuit device is substantially coplanar with the first surface of the electrically conductive layer, and wherein the electrically conductive layer comprises a reference voltage plane;
providing an electrical contact electrically coupled to the reference voltage plane;
forming an encapsulant layer to at least partially fill a gap within the at least one opening between the circuit device and the electrically conductive layer; and
removing the adhesive layer after forming the encapsulant layer.
14. The method of claim 13 , wherein the adhesive layer comprises a tape.
15. A method for forming a device having at least partial packaging, comprising:
providing an electrically conductive layer having a first surface, a second surface opposite the first surface, and at least one opening;
attaching an adhesive layer to the electrically conductive layer;
placing a circuit device on the adhesive layer within the at least one opening, wherein an active surface of the circuit device is substantially coplanar with the first surface of the electrically conductive layer, and wherein the electrically conductive layer comprises a reference voltage plane;
providing an electrical contact electrically coupled to the reference voltage plane;
forming an encapsulant layer to at least partially fill a gap within the at least one opening between the circuit device and the electrically conductive layer, wherein forming the encapsulant layer comprises forming a mold compound overlying the circuit device and the second surface of the electrically conductive layer.