IP Library Granted Patent US 7,193,926
Granted Patent B2
US 7,193,926 · App. 11/158,492 · Granted Mar 20, 2007

Memory device for reducing leakage current

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Quick Facts
Patent No.
US 7,193,926
App. No.
11/158,492
Granted
Mar 20, 2007
Kind
B2
Abstract

Disclosed is a memory device for reducing leakage current generated by a bridge between a word line and a bit line when the memory device is in a waiting mode. The memory device includes: N memory cell blocks each of which includes plurality of memory cell blocks, wherein N represents a natural number; (N+1) sense amp blocks corresponding to the N memory cell blocks; 2N switching blocks connecting the N memory cell blocks to the (N+1) sense amp blocks, respectively; and N controllers for controlling the 2N switching blocks, respectively, wherein the N controllers turn off the 2N switching blocks when the memory device is in a waiting mode, and the N controllers selectively turn on the 2N switching blocks when the memory device is in an operation mode.

Claims (17)

1. A memory device for reducing leakage current, the memory device comprising:

N memory cell blocks each of which includes plurality of memory cell blocks, wherein N represents a natural number;

(N+1) sense amp blocks corresponding to the N memory cell blocks;

2N switching blocks connecting the N memory cell blocks to the (N+1) sense amp blocks, respectively;

N controllers for controlling the 2N switching blocks, respectively, each of the controllers having an output; and

N inverters, each inverter of the N inverters having an input coupled to the output of a corresponding one of the N controllers, each inverter of the N inverters having an output that is coupled to a corresponding pair of the 2N switching blocks;

wherein an output signal from each of the N controllers is inverted by a corresponding inverter, and wherein said inverted signal from a controller turns off the 2N switching blocks when the memory device is in a waiting mode, and the N controllers selectively turn on the 2N switching blocks when the memory device is in an operation mode.

2. The memory device as claimed in claim 1 , wherein N word lines connect the memory cells with each other, the N word lines corresponding to the N memory cell blocks respectively, bit lines corresponding to the memory cells connect the N memory cell blocks, the 2N switching blocks and the (N+1) sense amp blocks with each other, and a random i th controller of the N controllers is connected to a (2i−1) th switching block and a 2i.sup.th switching block of the 2N switching blocks, wherein i represents a constant having a value of 1, 2, . . . , N.

3. The memory device as claimed in claim 1 , wherein both a (2k−1) th switching block and a 2k th switching block of the 2N switching blocks are turned on by an k th controller of the N controllers when the memory device is in an operation mode for selecting an k th memory cell block of the N memory cell blocks, wherein k represents a constant having a value of 1, 2, . . . , N.

4. A memory device having a folded bit line structure, the memory device comprising:

N memory cell blocks; and

a first switching block, a sense amp block and a second switching block disposed every between the memory cell blocks,

wherein the first switching block is located between an i th memory cell block and the sense amp block,

the second switching block is located between an (i−1) th memory cell block and the sense amp block,

the first switching block and the second switching block are turned off by a signal from an inverter, said inverter receiving a signal from a controller when the memory device is in a waiting mode, and

only the first switching block adjacent to the i th memory cell block is turned on when the memory device is in an operation mode.

5. The memory device as claimed in claim 4 , wherein when the memory device is in a waiting mode, bit lines of the memory cell block maintain ground voltage.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS HYNIX SEMICONDUCTOR INC. NOT HYNIX-SEMICONDUCTOR INC. THERE IS NO HYPHEN IN THE NAME. PREVIOUSLY RECORDED ON REEL 67328 FRAME 814. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
CHANGE OF NAME Recorded May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2005
From: PARK, SANG IL; LEE, SANG KWON
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 016719/0156 →