IC tiling pattern method, IC so formed and analysis method

1. An integrated circuit ( 6 ) (IC) including at least one layer having a first electrical structure ( 10 , 12 , 14 ) non-orthogonally angled relative to a second electrical structure ( 16 ), the IC comprising:

a first tile pattern ( 32 ) in the at least one layer having a first tile orientation oriented substantially parallel to the first electrical structure; and

a second tile pattern ( 34 ) in the at least one layer having a second tile orientation oriented substantially parallel to the second electrical structure, wherein the first tile orientation is different from the second tile orientation;

wherein the first tile pattern ( 32 ) comprises a plurality of tiles having an edge oriented substantially parallel to the first electrical structure and the second tile pattern ( 34 ) comprises a plurality of tiles having an edge oriented substantially parallel to the second electrical structure and wherein the first electrical structure ( 10 , 12 , 14 ) is provided orthogonally relative to other structure ( 18 ) of the IC, and the second electrical structure ( 16 ) is provided non-orthogonally to other structure of the IC.

2. The IC of claim 1 , wherein the first and second tiling pattern ( 32 , 34 ) in combination with the first and second electrical structure ( 10 , 12 , 14 , 16 ) provide a substantially uniform density across the at least one layer of the IC.

3. The IC of claim 2 , wherein a size and orientation of each tiling pattern ( 32 , 34 ) is constant within a respective tiled area.

4. The IC of claim 1 , wherein the electrical structures ( 10 , 12 , 14 , 16 ) are wire segments.

5. The IC of claim 1 wherein the first tile pattern ( 32 ) comprises a plurality of tiles each of which is a conductive shape that is added to an area of the IC that does not include wiring and the second tile pattern ( 34 ) comprises a plurality of tiles each of which is a conductive shape that is added to an area of the IC that does not include wiring.

6. A method of electrical analysis of an integrated circuit ( 6 ) (IC) having a layer including a first electrical structure ( 10 , 12 , 14 ) non-orthogonally angled relative to a second electrical structure ( 16 ), the method comprising the steps of:

determining by a processor an electrical impact of a tile pattern ( 32 ) in the layer having a first tile orientation oriented substantially parallel to the first electrical structure on the first electrical structure;

determining by a processor an electrical impact of a tile pattern ( 34 ) in the layer having a second tile orientation oriented substantially parallel to the second electrical structure on the second electrical structure, wherein the first tile orientation is different from the second tile orientation; and

conducting by a processor an electrical analysis based on the determined electrical impacts; wherein the first electrical structure ( 10 , 12 , 14 ) is provided orthogonally relative to other structure ( 18 ) of the IC, and the second electrical structure ( 16 ) is provided non-orthogonally to other structure of the IC and wherein the first tile pattern ( 32 ) comprises a plurality of tiles having an edge oriented substantially parallel to the first electrical structure and the second tile pattern ( 34 ) comprises a plurality of tiles having an edge oriented substantially parallel to the second electrical structure.

7. The method of claim 6 , wherein the steps of determining include:

determining an oriented tile area ( 26 ) in the layer in which tiling oriented substantially parallel to the first electrical structure ( 10 , 12 , 14 ) causes non-uniform effects on electrical properties of the second electrical structure; and

filling the oriented tile area with a tiling pattern ( 34 ) in the layer oriented substantially parallel to the second electrical structure ( 16 ).

8. The method of claim 6 wherein the first tile pattern ( 32 ) comprises a plurality of tiles each of which is a conductive shape that is added to an area of the IC that does not include wiring and the second tile pattern ( 34 ) comprises a plurality of tiles each of which is a conductive shape that is added to an area of the IC that does not include wiring.

9. An integrated circuit ( 6 ) (IC) including at least one layer having a first electrical structure ( 10 , 12 , 14 ) non-orthogonally angled relative to a second electrical structure ( 16 ), the IC comprising:

a substantially uniform density across the layer created by having a first tile pattern ( 32 ) in the at least one layer having a first tile orientation oriented substantially parallel to the first electrical structure ( 10 , 12 , 14 ); and

a second tile pattern ( 34 ) in the at least one layer having a second tile orientation oriented substantially parallel to the second electrical structure ( 16 ), wherein the first tile orientation is different from the second tile orientation;

wherein the first tile pattern ( 32 ) comprises a plurality of tiles having an edge oriented substantially parallel to the first electrical structure and wherein the first electrical structure ( 10 , 12 , 14 ) is provided orthogonally relative to other structure ( 18 ) of the IC, and the second electrical structure ( 16 ) is provided non-orthogonally to other structure of the IC and the second tile pattern ( 34 ) comprises a plurality of tiles having an edge oriented substantially parallel to the second electrical structure.

10. The IC of claim 9 , wherein a size and orientation of each tiling pattern ( 32 , 34 ) is constant within a respective tiled area.

11. The IC of claim 9 , wherein the electrical structures are wire segments.

12. The IC of claim 9 wherein the first tile pattern ( 32 ) comprises a plurality of tiles each of which is a conductive shape that is added to an area of the IC that does not include wiring and the second tile pattern ( 34 ) comprises a plurality of tiles each of which is a conductive shape that is added to an area of the IC that does not include wiring.