IP Library Granted Patent US 7,286,388
Granted Patent B1
US 7,286,388 · App. 11/165,005 · Granted Oct 23, 2007

Resistive memory device with improved data retention

Assignee: Spansion LLC
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Quick Facts
Patent No.
US 7,286,388
App. No.
11/165,005
Granted
Oct 23, 2007
Kind
B1
Abstract

In the present method of programming a memory device from an erased state, the memory device includes first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrodes. In the programming method, (i) an electrical potential is applied across the first and second electrodes from higher to lower potential in one direction to reduce the resistance of the memory device, and (ii) an electrical potential is applied across the first and second electrodes from higher to lower potential in the other direction to further reduce the resistance of the memory device.

Claims (26)

1. A method of programming a memory device, the memory device comprising first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrodes, the method comprising:

applying a first electrical potential across the first and second electrodes to reduce the resistance of the memory device, and

applying a second electrical potential across the first and second electrodes to further reduce the resistance of the memory device, wherein the first electrical potential is applied from higher to lower potential in the direction from the first electrode to the second electrode, and wherein the second electrical potential is applied from higher to lower potential in the direction from the second electrode to the first electrode.

2. The method of claim 1 wherein the second electrical potential is different in magnitude from the first electrical potential.

3. The method of claim 2 wherein the second electrical potential is lower in magnitude than the first electrical potential.

4. A method of programming a memory device, the memory device comprising first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrodes, the method comprising:

applying a first electrical potential across the first and second electrodes from higher to lower potential in the direction from the first electrode to the second electrode, and

applying a second electrical potential across the first and second electrodes from higher to lower potential in the direction from the second electrode to the first electrode to reduce the resistance of the memory device.

5. The method of claim 4 wherein application of the first electrical reduces the resistance of the memory device.

6. The method of claim 5 wherein application of the second electrical potential further reduces the resistance of the memory device.

7. The method of claim 6 wherein the second electrical potential is different in magnitude from the first electrical potential.

8. The method of claim 7 wherein the second electrical potential is lower in magnitude than the first electrical potential.

9. A method of programming a memory device, the memory device comprising a first electrode, a passive layer on and in contact with the first and second electrodes, an active layer on and in contact with the first and second electrodes, and a second electrode on and in contact with then active layer, the method comprising:

applying a first electrical potential across the first and second electrodes from higher to lower potential in the direction from the first electrode to the second electrode to reduce the resistance of the memory device, and

applying a second electrical potential across the first and second electrodes from higher to lower potential in the direction from the second electrode to the first electrode to further reduce the resistance of the memory device.

10. The method of claim 9 wherein the second electrical potential is different in magnitude from the first electrical potential.

11. The method of claim 10 wherein the second electrical potential is lower in magnitude than the first electrical potential.

12. A method of programming a memory device, the memory device comprising first and second electrodes, and an active layer between the first and second electrodes, the method comprising:

applying a first electrical potential across the first and second electrodes to move electronic charge carriers into the active layer, and

applying a second electrical potential across the first and second electrodes;

wherein the first electrical potential is applied across the first and second electrodes from higher to lower potential in the direction from the first electrode to the second electrode, and the second electrical potential is applied across the first and second electrodes from higher to lower potential in the direction from the second electrode to the first electrode.

13. The method of claim 12 wherein application of the first electrical potential reduces the resistance of the memory device.

14. The method of claim 12 wherein application of the second electrical potential further reduces the resistance of the memory device.

15. The method of claim 12 wherein the application of the second electrical potential moves ions into the active layer.

16. The method of claim 12 wherein application of the first electrical potential reduces the resistance of the memory device, and application of the second electrical potential further reduces the resistance of the memory device.

17. The method of claim 12 and further comprising a plurality of said memory devices making up an array thereof.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036036/0738 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2005
From: CHEN, AN; HADDAD, SAMEER; FANG, TZU-NING; WU, YI-CHING JEAN; BILL, COLIN S.
To: SPANSION LLC
Reel/Frame 016731/0250 →