Method for reducing the fogging effect

1. Method for reducing the fogging effect in an electron beam lithography system, wherein the exposure is controlled in order to obtain patterns resulting after a process to optimize the global CD-uniformity over a whole mask or wafer which is conforming to design data comprising the steps of:

exposing proximity corrected test patterns;

measuring the geometry of the resulting test structures within the test pattern and thereby obtaining a set of measurement data showing the influence of the fogging effect on the dimensions as required by the design data;

determining basic fogging input parameters for a Gaussian or other function, the function type being chosen in accordance with a Kernel type used in a proximity corrector describing the fogging effect, from the set of measurement data;

fitting a model for the fogging effect by individually changing at least the basic fogging input parameters of the Gaussian or other function, by considering a proximity effect, to the set of measurement data and thereby obtaining an optimized set of parameters for a single common proximity and fogging control function; and

applying the common proximity and fogging control function to an exposure control of the electron beam lithography system during the exposure of a pattern according to the design data,

wherein the test patterns are surrounded by an exposed area with a separation gap between the test patterns and the exposure area boundary, and wherein the method further comprises the step of

applying the individually changed fogging parameters to a calculation and comparing the calculated results with the set of measurement data.

2. The method as claimed in claim 1 , wherein the method further includes a proximity effect correction to obtain the proximity corrected test patterns comprising the steps of:

exposing arbitrary set patterns applying the process for controlling the proximity correction;

measuring the geometry of the resulting test structures and thereby obtaining a set of measurement data;

determining basic input parameters of a proximity control function from the set of measurement data;

fitting a model by individually changing at least the basic input parameters of the proximity control function to measurement data set and thereby obtaining an optimised set of parameters,

applying the control function to an exposure control of the electron beam lithography system during the exposure of a pattern according to the design data.

3. The method as claimed in claim 1 , wherein the common proximity and fogging control function is a sum of at least two Gaussian functions.

4. The method as claimed in claim 1 , wherein the common proximity and fogging control function for the proximity effect is determined by a sum of three Gaussian functions.

5. The method as claimed in claim 1 , wherein the common proximity and fogging control function PF(r) is determined by:

PF ( r )= c f G f ( r )+ c b G b ( r )+ c fog G fog ( r ),

wherein a first term with index f characterizes the short-range of forward scattering correction by a Gaussian function G f (r) multiplied with factor C f , a second term with index b—the backscattering correction by a Gaussian function G f (r) multiplied with factor c f , and a third term with index fog determines a Gaussian control function G fog (r) for the fogging effect, wherein r is a distance from a point of electron incidence.

6. The method as claimed in claim 1 , wherein the common proximity and fogging control function for the proximity effect is determined by a sum of four Gaussian functions.

7. The method as claimed in claim 1 , wherein with the use of a single control function for proximity and fogging effects correction with the e-beam lithographic system the dimensional errors over the whole wafer or mask are reduced to less than 10 nm.

8. The process as claimed in claim 2 , wherein the proximity control function is embedded in a PROX-In software.