High-density NVRAM
View Patent ↗A cross point array and peripheral circuitry that accesses the cross point array. The peripheral circuitry receives a supply voltage of approximately 1.8 volts or less, generates voltages of a magnitude not more than approximately 3 volts, and senses current that is indicative of a nonvolatile memory state.
1. A high density NVRAM comprising:
a first layer of conductive array lines, the conductive array lines being arranged so that they do not come into direct contact with each other, each conductive array line having a plurality of bottom memory plug sites;
a second layer of conductive array lines, the conductive array lines being arranged so that they cross over the conductive array lines of the first layer without coming into direct contact with each other or any of the conductive array lines of the first layer, each conductive array line having a plurality of top memory plug sites, each top memory plug site being located directly above a corresponding bottom memory plug site, the bottom memory plug site and its associated top memory plug constituting a memory plug site pair; and
peripheral circuitry that receives a supply voltage of approximately 1.8 volts or less, generates voltages to conductive array lines of a magnitude not more than approximately 3 volts, senses current that is indicative of a nonvolatile memory state.
2. The high density NVRAM of claim 1 , wherein the peripheral circuitry can access at least a megabit of information.
3. The high density NVRAM of claim 1 , wherein each memory plug site pair can experience a voltage drop of a magnitude of not more than approximately 6 volts.
4. The high density NVRAM of claim 3 , wherein the voltage drop experienced by memory plug site pairs are caused by the peripheral circuitry applying a first voltage to the first layer of conductive array lines and a second voltage to the second layer of conductive array lines, the second voltage being approximately equal in magnitude and opposite in polarity to the first voltage.
5. The high density NVRAM of claim 1 , further comprising at least one additional layer of conductive array lines that is associated with at least one additional level of memory plug site pairs.
6. The high density NVRAM of claim 5 , wherein:
the second layer of conductive array lines has a plurality of second level bottom memory plug sites; and
the at least one additional layer of conductive array lines are arranged so that they cross over the conductive array lines of the second layer without coming into direct contact with each other or any of the conductive array lines of the second layer, each conductive array line having a plurality of second level top memory plug sites, each second level top memory plug site being located directly above a corresponding second level bottom memory plug site, the second level bottom memory plug site and its associated second level top memory plug constituting a memory plug site pair.
7. The high density NVRAM of claim 6 , wherein the at least one additional layer of conductive array lines includes at least three additional layers of conductive array lines and the at least one additional level of memory plug site pairs includes at least three additional levels of memory plug site pairs.
8. The high density NVRAM of claim 1 , wherein a material having a substantially perovskite crystalline lattice structure is disposed in between the memory plug site pairs.
9. The high density NVRAM of claim 1 , wherein a non-ohmic device is disposed in between the memory plug site pairs.
10. The high density NVRAM of claim 1 , wherein the high density NVRAM has an effective density of not more than approximately 4 F 2 , whereby F is the fabrication width.
11. The high density NVRAM of claim 1 , wherein the high density NVRAM has an effective density of not more than approximately 1 F 2 .
12. An apparatus comprising:
a cross point array including
a first layer of conductive array lines, the conductive array lines being arranged so that they do not come into direct contact with each other, each conductive array line having a plurality of bottom memory plug sites;
a second layer of conductive array lines, the conductive array lines being arranged so that they cross over the conductive array lines of the first layer without coming into direct contact with each other or any of the conductive array lines of the first layer, each conductive array line having a plurality of top memory plug sites, each top memory plug site being located directly above a corresponding bottom memory plug site, the bottom memory plug site and its associated top memory plug constituting a memory plug site pair; and
peripheral circuitry that receives an external supply voltage of approximately 1.8 volts or less, generates voltages to selected array lines in the cross point array of a magnitude not more than approximately 3 volts, and senses current that is indicative of a nonvolatile memory state.
13. The apparatus of claim 12 , wherein the peripheral circuitry can access at least a megabit of information.
14. The apparatus of claim 12 , wherein a material having a substantially perovskite crystalline lattice structure is disposed in between the memory plug site pairs.
15. The apparatus of claim 12 , wherein a non-ohmic device is disposed in between the memory plug site pairs.
16. An apparatus comprising:
a first layer of conductive array lines fabricated to a width F and having a plurality of bottom memory plug sites;
a second layer of conductive array lines fabricated to a width F and having a plurality of top memory plug sites, each top memory plug site being located directly above a corresponding bottom memory plug site, the bottom memory plug site and its associated top memory plug constituting a memory plug site pair; and
peripheral circuitry using fabrication widths of F that receives a supply voltage of approximately 1.8 volts or less, generates voltages to conductive array lines of a magnitude not more than approximately 3 volts, and senses current that is indicative of a nonvolatile memory state.
17. The apparatus of claim 16 , wherein the peripheral circuitry can access at least a megabit of information.
18. The apparatus of claim 16 , wherein a material having a substantially perovskite crystalline lattice structure is disposed in between the memory plug site pairs.
19. The apparatus of claim 16 , wherein a non-ohmic device is disposed in between the memory plug site pairs.