IP Library Granted Patent US 7,359,044
Granted Patent B2
US 7,359,044 · App. 11/180,536 · Granted Apr 15, 2008

Method and apparatus for inspecting pattern defects

Assignee: Hitachi High-Technologies Corporation
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Quick Facts
Patent No.
US 7,359,044
App. No.
11/180,536
Granted
Apr 15, 2008
Kind
B2
Abstract

A method of inspecting pattern defects can detect target defects in various processes stably by reducing erroneous detection of grains and morphology and decreasing the influence of an intensity nonuniformity in interference light. For this purpose, lights emitted from two sources of illumination capable of outputting a plurality of wavelengths are reflected by a beam splitter and irradiated onto a wafer. Diffracted light from the wafer is converged by an objective lens, is made to pass through light modulation units and imaged on an image sensor in a light detection unit. Then, defects are detected in a signal processing unit. Further, the optical modulation unit is made to have a structure that uses a plurality of optical components selectively and which can be optimized according to target defects.

Claims (76)

1. An apparatus for inspecting defects of a pattern, comprising:

illumination means for illuminating a sample on whose surface a pattern was formed;

imaging optical system means for forming an optical image of the pattern of the sample illuminated by the illumination means;

detecting means for detecting an optical image of the pattern of the sample by detecting the optical image formed by the imaging optical system means;

defect detecting means for detecting pattern defects on the sample by processing the detected image by the detecting means; and

selecting means for selecting a combination of an illumination wavelength of the illumination means and an aperture diaphragm of the illumination means and/or the imaging optical system according to the pattern,

wherein, prior to detecting pattern defects, said defect detecting means processes the images detected by the detecting means to reduce noise, and reconstructs noise reduced images that have been degraded by the noise reduction process.

2. The apparatus for inspecting pattern defects according to claim 1 , wherein

the illumination means is equipped with a plurality of illumination light sources,

the plurality of illumination light sources including a lamp light source and a laser light source.

3. The apparatus for inspecting pattern defects according to claim 1 , wherein

the illumination means is equipped with a lamp light source.

4. The apparatus for inspecting pattern defects according to claim 1 , wherein

the illumination means includes a laser light source.

5. The apparatus for inspecting pattern defects according to claim 1 , wherein

the illumination means has a plurality of illumination light sources having different wavelengths,

an intensity measurement unit for measuring respective intensities of the plurality of illumination light sources,

an intensity measurement unit that adjusts intensities of lights emitted from the plurality of illumination light sources so that a ratio of intensities of the plurality of illumination light sources measured by the intensity measurement unit becomes constant.

6. An apparatus for inspecting pattern defects, comprising:

illumination means for illuminating a sample on whose surface a pattern was formed;

imaging optical system means for forming an image of diffracted light from the sample illuminated by the illumination means;

light modulating means that is disposed in an optical path of the illumination means and/or the imaging optical system means and controls the intensity and/or phase of the light;

image detecting means for picking up an image of diffracted light from the sample that is formed by the imaging optical system means and outputting the image signal; and

defect detecting means for detecting defects of a pattern formed on the sample by processing the image signal outputted from the image detecting means,

wherein, prior to detecting pattern defects, said defect detecting means processes the images detected by the image detecting means to reduce noise, reconstructs the noise reduced images that have been degraded by the noise reduction process.

7. The apparatus for inspecting pattern defects according to claim 6 , wherein

the illumination means is equipped with a plurality of illumination light sources,

the plurality of light sources containing a lamp light source and a laser light source.

8. The apparatus for inspecting pattern defects according to claim 6 , wherein

the illumination means is equipped with a lamp light source.

9. The apparatus for inspecting pattern defects according to claim 6 , wherein

the illumination means contains a laser light source.

10. The apparatus for inspecting pattern defects according to claim 6 , wherein

the illumination means has a plurality of illumination light sources whose wavelengths are different,

an intensity measurement unit for measuring intensities of the plurality of illumination light sources,

and an intensity adjustment unit that adjusts the intensities of lights emitted from the plurality of illumination light sources so that a ratio of the intensities of the plurality of illumination light sources measured by the intensity measurement unit becomes constant.

11. The apparatus for inspecting pattern defects according to claim 6 , wherein

the light modulating means is equipped with a half wave plate and a quarter wave plate.

12. The apparatus for inspecting pattern detects according to claim 6 , wherein

the light modulating means is equipped with a differential interference optical system.

13. The apparatus for inspecting pattern defects according to claim 6 , wherein

the light modulating means is equipped with a filter that uses a dielectric film whose transmittance is controlled.

14. A method of inspecting pattern defects, comprising the following steps of:

illuminating a sample on whose surface a pattern was formed by light emitted from illumination means;

forming an optical image of the pattern of the illuminated sample with an imaging optical system;

detecting an image of the pattern of the sample by detecting the formed optical image; and

detecting pattern defects on the sample by processing the detected image; wherein:

the step of illuminating further comprises a step of selecting a combination of a wavelength of light for illuminating the sample, and an aperture diaphragm of the illumination means,

the step of forming an optical image further comprises a step of selecting an aperture diaphragm of the imaging optical system, and

prior to performing the step of detecting a pattern defect, performing the steps of processing the detected image to reduce noise, and reconstructing noise reduced images that have been degraded from the noise reduction process.

15. The method of inspecting pattern defects according to claim 14 , wherein

the sample is illuminated by a lamp and a laser.

16. The method of inspecting pattern defects according to claim 14 , wherein

the sample is illuminated by a lamp.

17. The method of inspecting pattern defects according to claim 14 , wherein

the sample is illuminated by a laser.

18. The apparatus for inspecting pattern defects according to claim 14 , wherein

the illumination is performed using a plurality of lights having different wavelengths, intensities of the plurality of illumination lights are measured, and

the intensities of the plurality of illumination lights are adjusted so that a ratio of the measured intensities of the plurality of illumination lights becomes constant.

19. A method of inspecting pattern defects, comprising the following steps of:

illuminating a sample on whose surface a pattern was formed with light emitted from illumination means;

forming an optical image of the pattern of the sample with an imaging optical system;

detecting an image of the pattern of the sample by detecting the formed optical image; and

detecting pattern defects on the sample by processing the detected image;

wherein the step of forming an optical image further comprises a step of controlling the intensity and/or phase of the light, and

wherein prior to performing the step of detecting a pattern defect, performing the steps of processing the detected image to reduce noise, and reconstructing noise reduced images that have been degraded from the noise reduction process.

20. The method of inspecting pattern defects according to claim 19 , wherein

the sample is illuminated using a lamp and a laser.

21. The method of inspecting pattern defects according to claim 19 , wherein

the sample is illuminated by a lamp.

22. The method of inspecting pattern defects according to claim 19 , wherein

the sample is illuminated by a laser.

23. The method of inspecting pattern defects according to claim 19 , wherein

the illumination is done using a plurality of illumination lights having different wavelengths,

the intensities of the plurality of illumination lights are measured, and

the intensities of the plurality of illumination lights are adjusted so that a ratio of the measured intensities of the plurality illumination lights becomes constant.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2005
From: NISHIYAMA, HIDETOSHI; SHIBATA, YUKIHIRO; MAEDA, SHUNJI; YOSHIDA, MINORU
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 016781/0007 →
Priority Claims (1)
JP 2004-206688 · Jul 14, 2004 · national
Continuity (1)
Related Publication 20060012780A1 · Jan 19, 2006