Exposure mask manufacturing method, drawing apparatus, semiconductor device manufacturing method, and mask blanks product
View Patent ↗A method of manufacturing an exposure mask includes generating or preparing flatness variation data relating to a mask blanks substrate to be processed into an exposure mask, the flatness variation data being data relating to change of flatness of the mask blank substrate caused when the mask blank substrate is chucked by a chuck unit of an exposure apparatus, generating position correction data of a pattern to be drawn on the mask blanks substrate based on the flatness variation data such that a mask pattern of the exposure mask comes to a predetermined position in a state that the exposure mask is chucked by the chuck unit, and drawing a pattern on the mask blanks substrate, the drawing the pattern including drawing the pattern with correcting a drawing position of the pattern and inputting drawing data corresponding to the pattern and the position correction data into a drawing apparatus.
1. A method of manufacturing an exposure mask comprising:
generating or preparing flatness variation data relating to a real mask blanks substrate to be processed into a real exposure mask, the flatness variation data being data relating to a change of flatness of the real mask blanks substrate caused when the real mask blanks substrate is chucked by a chuck unit of an exposure apparatus;
inputting the flatness variation data into a computer to generate position correction data of a pattern to be drawn on the real mask blanks substrate based on the flatness variation data such that a mask pattern of the real exposure mask comes to a predetermined position in a state that the real exposure mask is chucked by the chuck unit;
setting the real mask blanks substrate in a drawing apparatus;
inputting drawing data and the position correction data into the drawing apparatus wherein the drawing data corresponds to the pattern to be drawn on the real mask blanks substrate; and
drawing a pattern on the real mask blanks substrate by using the drawing apparatus, wherein the drawing apparatus draws the pattern with correcting a drawing position of the pattern based on the position correction data such that the mask pattern of the real exposure mask comes to the predetermined position in the state that the real exposure mask is chucked by the chuck unit.
2. The method of manufacturing an exposure mask, according to claim 1 ,
wherein generating the flatness variation data includes:
preparing flatness of the real mask blanks substrate in a state not chucked by the chuck unit and predicted flatness of the real mask blanks substrate in a state chucked by the chuck unit; and
generating the flatness variation data based on the flatness of the real mask blanks substrate and the predicted flatness of the real mask blanks substrate.
3. The method of manufacturing an exposure mask, according to claim 1 ,
wherein the generating flatness variation data includes:
preparing flatness of the real mask blanks substrate in a state not chucked by the chuck unit and data relating to the chuck unit; and
generating the flatness variation data based on the flatness of the real mask blanks substrate and the date relating to the chuck unit.
4. The method of manufacturing an exposure mask, according to claim 1 ,
wherein the chuck unit is a vacuum chuck.
5. The method of manufacturing an exposure mask, according to claim 1 ,
wherein the position correction data includes positional information of an X-Y stage, and the real mask blanks substrate is mounted on the X-Y stage when the pattern is drawn on the real mask blanks substrate.
6. A drawing apparatus comprising:
a position correction data generating unit configured to generate position correction data of a pattern to be drawn on a real mask blanks substrate to be processed into a real exposure mask, the position correction data being data for bringing a pattern of the real exposure mask in a state chucked by a chuck unit of an exposure apparatus into a predetermined position; and
a drawing unit configured to draw the pattern on the real mask blanks substrate based on the drawing data corresponding to the pattern and the position correction data wherein the drawing unit draws the pattern with correcting a drawing position of the pattern based on the position correction data such that the mask pattern of the real exposure mask comes to the predetermined position in the state that the real exposure mask is chucked by the chuck unit.
7. The drawing apparatus according to claim 6 ,
wherein the position correction data generating unit generates the position correction data based on the flatness of the real mask blanks substrate in a state not chucked by the chuck unit and predicted flatness of the real mask blanks substrate in a state chucked by the chuck unit.
8. The drawing apparatus according to claim 6 ,
wherein the position correction data generating unit generates flatness variation data based on the flatness of the real mask blanks substrate in a state not chucked by the chuck unit and data relating to the chuck unit, and generates the position correction data based on the flatness variation data.
9. The drawing apparatus according to claim 6 ,
wherein the position correction data generating unit generates the position correction data based on flatness variation data relating to change of flatness of the real mask blanks substrate, the change of the flatness of the real mask blanks substrate being caused by chucking the real mask blanks substrate by the chuck unit.
10. The drawing apparatus according to claim 6
wherein the chuck unit is a vacuum chuck.
11. The drawing apparatus according to claim 6 ,
wherein the position correction data includes positional information of an X-Y stage, and the real mask blanks substrate is mounted on the X-Y stage when the pattern is drawn on the real mask blanks substrate.