Method of forming double gate transistors having varying gate dielectric thicknesses
View Patent ↗Double gate transistors ( 12, 13 ) having different bottom gate dielectric thicknesses are formed on a first wafer ( 101 ) by forming a first gate dielectric layer ( 107 ); removing part of the first gate dielectric layer ( 107 ) from a first area ( 60 ); forming a second gate dielectric layer ( 108 ) to obtain a thinner bottom gate dielectric layer ( 150 ) over the first area ( 60 ) and a thicker bottom gate dielectric layer ( 151 ) over the second area ( 70 ); and forming a planar bottom gate layer ( 109 ) over first and second gate dielectric layers. After inverting and bonding the first wafer ( 101 ) to a second wafer ( 103 ), the bottom gate electrodes ( 109 - 2, 109 - 3 ), bottom gate dielectric layers ( 107, 108 ) and channel regions ( 203 - 2, 203 - 3 ) for the first and second double gate transistors ( 12, 13 ) are selectively etched prior to formation of the top gate structures.
1. A method of making double gate transistors on an integrated circuit having a plurality of circuit areas of predetermined gate dielectric effective thicknesses, comprising:
providing a first wafer, said first wafer having a first side and a second side, said first wafer comprising a first semiconductor substrate structure at the first side;
forming a first dielectric layer over first, second and third circuit areas on the first side;
removing the first dielectric layer from the first circuit area;
forming a second dielectric layer over the first, second and third circuit areas;
removing the second dielectric layer from the first circuit area;
forming a final dielectric layer of a substantially uniform thickness over the first and second circuit areas on the first side, thereby forming a plurality of bottom gate dielectric layers, comprising:
a first bottom gate dielectric layer over the first circuit area comprised of the final dielectric layer,
a second bottom gate dielectric layer over the second circuit area comprised of the first, second and final dielectric layers, and
a third bottom gate dielectric layer over the third circuit area comprised of the first and second dielectric layers;
forming a substantially planar layer of bottom gate conductor material on the first side;
bonding the first side of the first wafer to a second wafer;
forming a top gate layer over and insulated from the first semiconductor substrate structure; and
forming a plurality of self-aligned top gate structures, channel regions, and bottom gate structures by using an active area mask to selectively etch the top gate layer to form the plurality of top gate structures which are used as a mask to selectively etch the first semiconductor substrate structure and the plurality of bottom gate dielectric layers and the layer of bottom gate conductor material;
whereby each of the bottom gate dielectric layers has predetermined effective thicknesses.
2. The method of claim 1 , where the first dielectric layer or the final dielectric layer are formed by depositing a layer of high-k dielectric material.
3. The method of claim 1 , where the first dielectric layer or the final dielectric layer are formed by growing a layer of dielectric material.
4. The method of claim 1 , where forming a plurality of self-aligned top gate structures, channel regions, and bottom gate structures comprises applying a photoresist masking process to selectively mask and etch at least a portion of the top gate layer to form a plurality of top gate structures which are separated from the channel regions by a plurality of top gate dielectric layers.
5. The method of claim 1 , where removing the first dielectric layer from the first circuit area comprises:
patterning the first dielectric layer with a first patterned layer to mask the second circuit area; and
removing the first dielectric layer from the first circuit area.
6. The method of claim 1 wherein the layer of bottom gate conductor material comprises polysilicon, silicide, or a metal gate stack.
7. The method of claim 1 , further comprising removing a first portion of the first semiconductor substrate structure to leave a layer of the first semiconductor substrate structure after the bonding.
8. The method of claim 7 , wherein the removing further comprises:
implanting a dopant in the first semiconductor substrate structure to create a stress layer in the first semiconductor substrate structure; and
separating the first portion from the layer of the first semiconductor substrate structure at the stress layer.
9. The method of claim 1 , where the second wafer comprises a multi layered composite film wafer substrate comprising a noise reduction shielding conductor plate.
10. The method of claim 1 , where the second wafer comprises a second semiconductor substrate structure formed under a first insulator layer.