IP Library Granted Patent US 7,432,698
Granted Patent B1
US 7,432,698 · App. 11/197,911 · Granted Oct 7, 2008

Modular active test probe and removable tip module therefor

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Quick Facts
Patent No.
US 7,432,698
App. No.
11/197,911
Granted
Oct 7, 2008
Kind
B1
Abstract

A modular active test probe and removable tip module therefor. Within the scope of the invention, there is a probe tip module comprising a first probe tip adapted for probing a circuit under test to receive a signal therefrom. The probe tip module includes an amplifier having a first input solidly connected to the probe tip, an output connected to an output connector, and a housing for supporting the probe tip, the amplifier, and the output connector. A probe body is cooperatively adapted with the housing for repeatably removably receiving at least the output connector.

Claims (30)

1. A method for probing a circuit under test and transmitting a signal therefrom to a circuit under test signal measuring apparatus, comprising the steps of:

(a) selecting a probe tip module from among a plurality of probe tip modules each said probe tip module comprising a probe tip, an amplifier having an input solidly connected to the respective said probe tip, an identification circuit suitable for providing identification data signals regarding the probe tip module in which the identification circuit is positioned, and an output connected to a respective output connector;

(b) providing a distinct probe body having a controller suitable for communicating with said identification circuit, said probe body adapted to receive the output connectors of said plurality of probe tip modules;

(c) connecting the selected probe tip module and said probe body together at said output connector;

(d) receiving the circuit under test signal at said input of said amplifier;

(e) amplifying the circuit under test signal and providing the amplified circuit under test signal to said probe body through said output connector; and

(f) transmitting the amplified circuit under test signal from said probe body to the signal measuring apparatus.

2. The method of claim 1 , further comprising compensating for selected electrical characteristics of the selected probe tip in said probe tip module.

3. The method of claim 1 , wherein the circuit under test is remote from the signal measuring apparatus, and wherein said step of transmitting is conducted over an elongate, flexible cable to facilitate accessing the circuit under test from the signal measuring apparatus.

4. The method of claim 1 , further comprising the step of compensating for selected electrical characteristics of the selected probe tip in said probe tip module based on said identification data signals.

5. The method of claim 1 , further comprising the step of providing a compensation box functionally interconnected with said probe body, said compensation box having a compensation box connection scheme adapted to mate with an associated signal measuring apparatus connection scheme such that said compensation box is configured to mate with an associated signal measuring apparatus.

6. The method of claim 5 , wherein said step of providing a compensation box further comprises the step of providing a compensation box having a compensation box connection scheme, said compensation box connection scheme may be selected from a group consisting of:

(a) BNC;

(b) BMA;

(c) SMP;

(d) SMA;

(e) N-connector; and

(f) future developed connection schemes.

7. The method of claim 1 , further comprising the step of programming said controller to provide information, said information selected from the group consisting of:

(a) information about said probe body;

(b) information about a compensation box functionally interconnected with said probe body; and

(c) information about a cable between said probe body and said compensation box.

8. The method of claim 1 , wherein said step of selecting a probe tip module from among a plurality of probe tip modules further comprises the step of selecting a probe tip module from among a plurality of probe tip modules, the plurality of probe tip modules including at least two probe tip modules selected from a group consisting of:

(a) active testing probe tip module;

(b) passive testing probe tip module;

(c) voltage testing probe tip module;

(d) current testing probe tip module;

(e) optic testing probe tip module;

(f) wireless testing probe tip module; and

(g) future developed connection scheme probe tip module.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Oct 19, 2012
From: RBS CITIZENS, N.A.
To: TELEDYNE LECROY, INC.
Reel/Frame 029155/0478 →
MERGER Recorded Oct 19, 2012
From: LECROY CORPORATION
To: TELEDYNE LECROY, INC.
Reel/Frame 029162/0724 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2012
From: MANUFACTURERS AND TRADERS TRUST COMPANY, AS AGENT
To: LECROY CORPORATION
Reel/Frame 029128/0280 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2012
From: MANUFACTURERS AND TRADERS TRUST COMPANY, AS AGENT
To: LECROY CORPORATION
Reel/Frame 029129/0880 →
SECURITY AGREEMENT Recorded Aug 30, 2011
From: LECROY CORPORATION
To: RBS CITIZENS, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 026826/0850 →
SECURITY AGREEMENT Recorded Aug 27, 2010
From: LECROY CORPORATION
To: MANUFACTURERS AND TRADERS TRUST COMPANY
Reel/Frame 024892/0689 →
SECURITY AGREEMENT Recorded May 23, 2007
From: LECROY CORPORATION
To: MANUFACTURERS AND TRADERS TRUST COMPANY
Reel/Frame 019331/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2005
From: CAMPBELL, JULIE A.; JACOBS, LAWRENCE W.; SEKEL, STEPHEN MARK
To: LECROY CORPORATION
Reel/Frame 016867/0421 →