Radiation shielded module and method of shielding microelectronic device
View Patent ↗A radiation shielded module ( 120, 500, 600, 700 ) and method of shielding microelectronic devices ( 126, 412, 618 , and 718 ) including a single interconnect substrate ( 110, 400, 612, 712 ) having a first side ( 122, 410, 620, 720 ) and a second side ( 124, 416, 610, 710 ). At least one microelectronic device is coupled to the first side of the single interconnect substrate. A shielding structure ( 100, 200, 300, 614, 714 ) is coupled to the single interconnect substrate and configured to shield radio frequency interference (RFI) and electromagnetic interference (EMI) that propagate through at least a portion of the single interconnect substrate.
1. A radiation shielded module comprising:
a single interconnect substrate having a first side and a second side;
at least one microelectronic device coupled to said first side;
a cover consisting of a shielding structure coupled to said single interconnect substrate, a portion of which extends through to at least the second side, said shielding structure comprising a substantially planar surface and at least one tab extending substantially vertically about a perimeter of the substantially planar surface, said shielding structure coupled to said first side and defining a cavity therein; and
a shielding solder ring coupled about a perimeter of the radiation shielded module on said second side.
2. The module of claim ( 1 ), wherein said at least one tab comprises a plurality of castellation tabs.
3. The module of claim ( 1 ), wherein said at least one tab includes a plurality of sidewalls configured substantially perpendicular to said planar surface.
4. The module of claim ( 1 ), wherein said at least one tab includes a plurality of tabs having tapered sidewalls.
5. The module of claim ( 1 ), wherein said single interconnect substrate includes a plurality of apertures configured to allow said at least one tab to extend through to at least said second side.
6. The module of claim ( 1 ), further comprising an application board, wherein the at least one tab extends through the single interconnect substrate to a surface of the application board.
7. The module of claim ( 1 ), further including a plurality of shielding vias extending from said first side of the substrate to said second side.
8. A method of shielding radio frequency interference (RFI) and electromagnetic interference (EMI) in a radiation shielded module comprising the steps of:
providing a single interconnect substrate having a first side, a second side and a plurality of apertures formed therein;
coupling at least one microelectronic device to said single interconnect substrate on the first side;
coupling a cover consisting of a shielding structure to said single interconnect substrate, a portion of which extends through to at least the second side, the shielding structure including a plurality of tabs extending substantially vertically about a perimeter of a substantially planar surface and the step of coupling the shielding structure includes fixedly attaching the shielding structure to the first side of the interconnect substrate, wherein the plurality of tabs extend at least partially into the plurality of apertures; and
coupling a shielding solder ring about a perimeter of the radiation shielded module on said second side.
9. The method of claim 8 , further including the step of fabricating a plurality of shielding vias extending from said first side to said second side of said interconnect substrate.
10. A radiation shielded module comprising:
a single interconnect substrate having a first side and a second side;
at least one microelectronic device coupled to said first side;
a cover consisting of a shielding structure coupled to said single interconnect substrate, a portion of which extends through to at least the second side; and
a shielding solder ring coupled about a perimeter of the radiation shielded module on said second side.