Electronic device package
An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.
1. An integrated circuit package comprising:
a substrate;
a plurality of adhesive bumps on the substrate, wherein the adhesive bumps comprise an epoxy resin formed from one or more oxiranes; and
a die on the plurality of adhesive bumps.
2. The integrated circuit package of claim 1 wherein the epoxy resin is formed from oxiranes that are identical.
3. The integrated circuit package of claim 1 wherein the epoxy resin is formed from oxiranes that are not identical.
4. The integrated circuit package of claim 1 wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 1,000.
5. The integrated circuit package of claim 1 wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 100.
6. The integrated circuit package of claim 1 wherein the epoxy resin is formed from oxiranes that are not identical and the number of different oxirane monomers is from 2 to about 10.
7. The integrated circuit package of claim 1 wherein the epoxy resin is a mixture of two or more epoxy resins.
8. The integrated circuit package of claim 1 wherein the epoxy resin is a mixture of 2 to about 100 epoxy resins.
9. The integrated circuit package of claim 1 wherein the epoxy resin is a mixture of 2 to about 50 epoxy resins.
10. The integrated circuit package of claim 1 wherein the epoxy resin is a mixture of 2 to about 10 epoxy resins.
11. The integrated circuit package of claim 1 wherein the epoxy resin is formed from an oxirane of formula (I):
wherein
each of R 1 , R 2 , R 3 , and R 4 is independently hydrogen, halo, trifluoromethyl, cyano, hydroxy, nitro, (C 1 -C 24 )alkyl, (C 2 -C 24 )alkenyl, (C 2 -C 24 )alkynyl, (C 3 -C 8 )cycloalkyl, (C 1 -C 24 alkyl (C 3 -C 8 )cycloalkyl, (C 6 -C 10 )aryl, (C 6 -C 10 )heteroaryl, (C 1 -C 24 )alkyl (C 6 -C 10 )aryl, (C 1 -C 24 )alkyl (C 6 -C 10 )heteroaryl, (C 6 -C 10 )aryl (C 1 -C 24 )alkyl, (C 6 -C 10 )heteroalkyl (C 1 -C 24 )alkyl, or (C 3 -C 8 )cycloalkyl (C 1 -C 24 )alkyl;
wherein any alkyl, alkenyl, alkynyl, cycloalkyl, aryl, or heteroaryl can optionally be substituted with one or more (e.g., 1, 2, 3, or 4) (C 1 -C 24 )alkoxy, epoxy (C 1 -C 24 )alkyl, epoxy (C 1 -C 24 )alkoxy, halo, trifluoromethyl, cyano, hydroxy, nitro, C(═O)OR 6 , wherein R 6 is hydrogen or (C 1 -C 24 )alkyl, or NR 7 R 8 , wherein each R 7 and R 8 are independently hydrogen or (C 1 -C 24 )alkyl; and
wherein any alkyl, alkenyl, or alkynyl is optionally interrupted with one or more (e.g., 1, 2, 3, or 4) oxo, thio, sulfonyl, or sulfinyl;
or a suitable salt thereof.
12. The integrated circuit package of claim 11 , wherein R 1 includes an aryl oxy (C 1 -C 24 )alkyl, and wherein the aryl is substituted with epoxy (C 1 -C 24 )alkoxy.
13. The integrated circuit package of claim 11 wherein R 1 is
14. The integrated circuit package of claim 11 wherein R 2 is hydrogen.
15. The integrated circuit package of claim 11 wherein R 3 is hydrogen.
16. The integrated circuit package of claim 11 wherein R 4 is hydrogen.
17. The integrated circuit package of claim 11 wherein the compound of formula (I) is oxirane 2,2′-(1,6-naphthalenediylbis (oxymethylene))bis- or 1,6-Bis(2,3-epoxypropoxy) naphthalene, shown below:
18. The integrated circuit package of claim 1 wherein the epoxy resin is polymerized from one or more oxiranes under basic conditions.
19. The integrated circuit package of claim 1 wherein the epoxy resin is polymerized from one or more oxiranes under acidic conditions.
20. The integrated circuit package of claim 1 wherein the epoxy resin is polymerized from one or more oxiranes under basic or acidic conditions and further includes a solidifier, a catalyst, or a combination thereof.
21. The integrated circuit package of claim 1 wherein the epoxy resin is polymerized from one or more oxiranes under basic or acidic conditions and further includes bisphenol A, bisphenol F, methyl hexahydrophthalic anhydride, silica, carbon black, CTBN or a combination thereof.
22. The integrated circuit package of claim 1 wherein the epoxy resin comprises about 2 to about 1,000,000 monomers formed from the oxirane.
23. The integrated circuit package of claim 1 wherein the epoxy resin comprises about 2 to about 100,000 monomers formed from the oxirane.
24. The integrated circuit package of claim 1 wherein the epoxy resin comprises about 2 to about 50,000 monomers formed from the oxirane.
25. The integrated circuit package of claim 1 wherein the epoxy resin comprises about 2 to about 10,000 monomers formed from the oxirane.
26. The integrated circuit package of claim 1 wherein the epoxy resin is formed at room temperature.
27. The integrated circuit package of claim 1 wherein the epoxy resin is formed at an elevated temperature.
28. The integrated circuit package of claim 1 wherein the epoxy resin is formed at a temperature above about 77° F. (25° C.).
29. The integrated circuit package of claim 1 wherein the epoxy resin is formed at a pressure above about 1 atm. (14.7 psi).
30. The integrated circuit package of claim 1 wherein the epoxy resin is formed via the use of radiant energy.
31. The integrated circuit package of claim 1 wherein the epoxy resin is formed via the use of UV, electron beam, microwave, beta radiation, gamma radiation, neutron beam, proton beam, infra red, or a combination thereof.
32. An integrated circuit package comprising:
a substrate;
a plurality of adhesive bumps on the substrate;
a die on the plurality of adhesive bumps and spaced from the substrate; and
an underfill material in the space between the substrate and the die, wherein the underfill material cross-links to the plurality of adhesive bump forming an essentially homogeneous material in the space between the substrate and the die.
33. The integrated circuit package of claim 32 , wherein the plurality of adhesive bumps includes a high viscosity adhesive material.
34. The integrated circuit package of claim 32 wherein the underfill material includes an epoxy encapsulant.
35. The integrated circuit package of claim 32 , wherein the adhesive bumps comprise an epoxy resin formed from one or more oxiranes.
36. The integrated circuit package of claim 32 , wherein the epoxy resin is formed from an oxirane of formula (I):
wherein
each of R 1 , R 2 , R 3 , and R 4 is independently hydrogen, halo, trifluoromethyl, cyano, hydroxy, nitro, (C 1 -C 24 )alkyl, (C 2 -C 24 )alkenyl, (C 2 -C 24 )alkynyl, (C 3 -C 8 )cycloalkyl, (C 1 -C 24 alkyl (C 3 -C 8 )cycloalkyl, (C 6 -C 10 )aryl, (C 6 -C 10 )heteroaryl, (C 1 -C 24 )alkyl (C 6 -C 10 )aryl, (C 1 -C 24 )alkyl (C 6 -C 10 )heteroaryl, (C 6 -C 10 )aryl (C 1 -C 24 )alkyl, (C 6 -C 10 )heteroalkyl (C 1 -C 24 )alkyl, or (C 3 -C 8 )cycloalkyl (C 1 -C 24 )alkyl;
wherein any alkyl, alkenyl, alkynyl, cycloalkyl, aryl, or heteroaryl can optionally be substituted with one or more (e.g., 1, 2, 3, or 4) (C 1 -C 24 )alkoxy, epoxy (C 1 -C 24 )alkyl, epoxy (C 1 -C 24 )alkoxy, halo, trifluoromethyl, cyano, hydroxy, nitro, C(═O)OR 6 , wherein R 6 is hydrogen or (C 1 -C 24 )alkyl, or NR 7 R 8 , wherein each R 7 and R 8 are independently hydrogen or (C 1 -C 24 )alkyl; and
wherein any alkyl, alkenyl, or alkynyl is optionally interrupted with one or more (e.g., 1, 2, 3, or 4) oxo, thio, sulfonyl, or sulfinyl;
or a suitable salt thereof.
37. The integrated circuit package of claim 36 , wherein R 1 includes an aryl oxy (C 1 -C 24 )alkyl, and wherein the aryl is substituted with epoxy (C 1 -C 24 )alkoxy.
38. The integrated circuit package of claim 36 wherein R 1 is