Platen endpoint window with pressure relief
View Patent ↗A polish pad ( 40, 42 ) and platen ( 50 ) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen ( 50 ) having a vented endpoint window ( 62, 72, 82 ) with one or more venting passageways (e.g., 64, 66 ) and/or a grooved or channeled platen surface ( 176 ) to prevent air pressure buildup in the air gap ( 46 ) by discharging or venting air through one or more vent pathways ( 52 ) formed in the platen to provide a pathway to ambient or sub-ambient environment. The air permeable construction of the vented endpoint window ( 72 ) provides pressure relief for the air gap ( 46 ) between the pad endpoint window ( 44 ) and the vented endpoint window ( 72 ), but may also include passages ( 75, 76 ) that are filled with an air permeable hydrophobic material which protects the underlying endpoint detection system ( 30, 32 ) from contamination during cleaning of the platen endpoint window ( 72 ).
1. A method for performing chemical mechanical polishing, comprising;
assembling a polishing pad assembly by applying a polishing pad to an upper surface of a platen, where the platen comprises a vented platen endpoint window and at least one vent pathway formed through the platen for relieving pressure between the polishing pad and the vented platen endpoint window to an external environment; and
performing chemical mechanical polishing on a polish structure by placing the polishing pad assembly in polishing contact with the polish structure.
2. The method of claim 1 , where the vented platen endpoint window comprises one or more passageways for relieving air pressure between the vented platen endpoint window and the polishing pad.
3. The method of claim 1 , where the vented platen endpoint window comprises one or more passageways which are at least partly formed with an air permeable material for relieving air pressure between the vented platen endpoint window and the polishing pad.
4. The method of claim 1 , where the vented platen endpoint window is formed with an air permeable material for relieving air pressure between the vented platen endpoint window and the polishing pad.
5. The method of claim 1 , where vented platen endpoint window comprises one or more passageways to provide air flow from between the vented platen endpoint window and the polishing pad and to the vent pathway.
6. The method of claim 1 , where the platen comprises a groove pattern formed in the upper surface of a platen which does not extend to any peripheral edge of the upper surface of the platen and which is connected through the vent pathway to the external environment, such that air between the vented platen endpoint window and the polishing pad is able to vent through the vent pathway without allowing contaminants from the chemical mechanical polishing to infiltrate between the platen and the polishing pad.
7. The method of claim 1 , where assembling a polishing pad assembly comprises:
adhesively affixing the polishing pad to the upper surface of the platen; and
venting any air from between the polishing pad and the vented platen endpoint window through an air passage formed in the vented platen endpoint window and through the vent pathway and to an external environment without allowing contaminants from the chemical mechanical polishing to infiltrate between the platen and the polishing pad.
8. The method of claim 7 , further comprising venting any air from between the polishing pad and the vented platen endpoint window through a groove pattern formed in the upper surface of a platen and to an external environment.
9. A method for assembling a polishing pad assembly for use in performing a chemical mechanical polish process, comprising;
providing a polishing pad in which is formed a pad endpoint window;
adhesively affixing the polishing pad to a first surface of a platen, where the platen comprises:
a vented platen endpoint window, and
at least one passageway forming an air pathway between the vented platen endpoint window and an external environment; and
venting air from between the pad endpoint window and the platen endpoint window through the vented platen endpoint window and the passageway formed in the platen to an external environment.
10. The method of claim 9 , further comprising venting air from between the pad endpoint window and the platen endpoint window through one or more interconnected channels formed in the first surface of the platen which are enclosed by a peripheral sealing region on the first surface of the platen.
11. The method of claim 9 , where the vented platen endpoint window comprises a diffuser window which is permeable to air.
12. An apparatus for use in performing chemical mechanical polishing, comprising:
a platen comprising a vented platen endpoint window and an upper surface for adhesive attachment of a polishing pad; and
at least one vent pathway formed in the platen to connect the vented platen endpoint window with an opening in the platen, such that air between the vented platen endpoint window and the polishing pad is able to vent through the vented platen endpoint window and the vent pathway without allowing contaminants from the polishing process to infiltrate between the platen and the polishing pad.
13. The apparatus of claim 12 , where the vent pathway is connected to an ambient environment.
14. The apparatus of claim 12 , where the vented platen endpoint window comprises a diffuser window in which is formed one or more passageways for alleviating pressure buildup between the vented platen endpoint window and the polishing pad.
15. The apparatus of claim 12 , where the vented platen endpoint window comprises a diffuser window in which is formed at least one passageway that is at least partially filled with an air permeable hydrophobic material.
16. The apparatus of claim 12 , where the vented platen endpoint window comprises a diffuser window formed from an air permeable material.
17. The apparatus of claim 12 , where the vented platen endpoint window comprises a diffuser window formed from an air permeable hydrophobic material.
18. The apparatus of claim 12 , further comprising a predetermined groove pattern formed in the upper surface of the platen without extending to any peripheral edge of the upper surface of the platen so that air between the vented platen endpoint window and the polishing pad is able to vent through the predetermined groove pattern.
19. The apparatus of claim 18 , where the predetermined groove pattern comprises a pattern of concentric circles in combination with an X-shaped groove which are positioned to intersect with the vent pathway.
20. The apparatus of claim 12 , where the vented platen endpoint window comprises a diffuser window which is vented through a predetermined groove pattern formed in the upper surface of the platen and connected to the vent pathway so that air pressure between the diffuser window and the polishing pad is able to vent through the predetermined groove pattern.