IP Library Granted Patent US 7,443,732
Granted Patent B2
US 7,443,732 · App. 11/229,527 · Granted Oct 28, 2008

High performance flash memory device capable of high density data storage

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Quick Facts
Patent No.
US 7,443,732
App. No.
11/229,527
Granted
Oct 28, 2008
Kind
B2
Abstract

A method is provided for programming a nonvolatile memory array including an array of memory cells, where each memory cell including a substrate, a control gate, a charge storage element, a source region and a drain region. The method includes receiving a programming window containing a predetermined number of bits that are to be programmed in the array and determining which of the predetermined number of bits are to be programmed in the memory array. The predetermined number of bits are simultaneously programmed to corresponding memory cells in the array. A programming state of the predetermined number of bits in the array is simultaneously verified.

Claims (55)

1. A method of programming a nonvolatile memory array including an away of memory cells, each memory cell including a substrate, a control gate, a charge storage element, a source region and a drain region, comprising:

receiving a programming window containing a predetermined number of bits that are to be programmed in the array;

determining which of the predetermined number of bits are to be programmed in the memory array;

simultaneously programming the predetermined number of bits to corresponding memory cells in the array; and

simultaneously verifying a programming state of the predetermined number of bits in the array.

2. The method of claim 1 , further comprising:

pre-charging bit lines associated with the predetermined number of bits prior to simultaneously programming the predetermined number of bits.

3. The method of claim 2 , wherein the pre-charging bit lines associated with the predetermined number of bits comprises pre-charging bit lines to a voltage corresponding to a voltage source.

4. The method of claim 1 , wherein the programming window includes 64 bits.

5. The method of claim 1 , wherein the programming window includes 128 bits.

6. The method of claim 1 , wherein the determining which of the predetermined number of bits are to be programmed in the away is based on an inverse programming method.

7. The method of claim 6 , wherein the inverse programming method includes:

determining whether the predetermined number of bits is greater than one half of the number of bits in the programming window, where bits in the programming window not included in the predetermined number of bits are the remaining bits;

simultaneously programming the memory cells in the array corresponding to the remaining bits in the programming window if it is determined that the predetermined number of bits is greater that one half of the number of bits in the programming window; and

setting an indication bit to a predetermined logic state indicative of whether the predetermined number of bits is greater than one half of the number of bits in the programming window.

8. The method of claim 1 , wherein the simultaneously verifying a programming state comprises simultaneously verifying a programming state for a number of program windows.

9. The method of claim 1 , wherein the simultaneously verifying includes:

determining whether the predetermined number of bits on the array are programmed; and wherein the method further comprises:

reprogramming any non-programmed bits in the predetermined number of bits.

10. The method of claim 1 , wherein the simultaneously verifying a programming state comprises simultaneously verifying a programming state for 256 bits.

11. The method of claim 1 , wherein the away of memory cells include SONOS (silicon-oxide-nitride-oxide-silicon) type NOR memory cells.

12. The method of claim 1 , wherein the charge storage element comprises a dielectric charge storage element configured to store at least two independent charges for each memory cell.

13. A memory device comprising:

at least one away of non-volatile memory cells;

a voltage supply component configured to generate a programming voltage for simultaneously programming a plurality of the memory cells, the voltage supply component including a DC-to-DC converter; and

control logic configured to simultaneously program the plurality of memory cells, where the plurality of memory cells corresponds to a programming window including a predetermined number of bits to be programmed.

14. The memory device of claim 13 , wherein the at least one array of non-volatile memory cells includes:

a plurality of bit lines each connected to source or drain regions of a plurality of the memory cells; and

a plurality of word lines, arranged orthogonally to the bit lines, each word line being connected to gate regions of a plurality of the memory cells.

15. The memory device of claim 14 , wherein the memory cells include NOR-type memory cells.

16. The memory device of claim 14 , further comprising:

a plurality of sense amplifiers operatively connected to the plurality of bit lines, where the plurality of sense amplifiers are low-power sense amplifiers; and

control logic configured to simultaneously verify a number of bits in programmed memory cells by monitoring a threshold voltage for each memory cell with a corresponding one of the plurality of sense amplifiers.

17. The memory device of claim 13 , wherein the programming window includes 64 bits.

18. The memory device of claim 13 wherein the predetermined number of bits is 256 bits.

19. A memory device comprising:

a core array including at least one array of non-volatile memory cells, the at least one array comprising:

a plurality of bit lines each connected to source or drain regions of a plurality of the memory cells; and

a plurality of word lines, arranged orthogonally to the bit lines, each word line being connected to gate regions of a plurality of the memory cells;

a plurality of sense amplifiers operatively connected to the plurality of bit lines for sensing a threshold voltage for memory cells connected to the bit lines;

a voltage supply component configured to generate a programming voltage for simultaneously programming a plurality of the memory cells, the voltage supply component including a DC-to-DC converter;

control logic configured to receive a programming window containing a predetermined number of bits that are to be programmed in the at least one array, and determine which of the predetermined number of bits are to be programmed in the memory array;

control logic configured to pre-charge bit lines associated with the predetermined number of bits;

control logic configured to simultaneously program the predetermined number of bits to corresponding memory cells in the array; and

control logic configured to simultaneously verify a programming state of the predetermined number of bits in the array.

20. A memory device comprising:

a core array including at least one array of non-volatile memory cells, the at least one array comprising:

a plurality of bit lines each connected to source or drain regions of a plurality of the memory cells; and

a plurality of word lines, arranged orthogonally to the bit lines, each word line being connected to gate regions of a plurality of the memory cells;

control logic configured to receive a programming window containing a predetermined number of bits that are to be programmed in the at least one array, and determine which of the predetermined number of bits are to be programmed in the at least one array;

control logic configured to simultaneously program the predetermined number of bits to corresponding memory cells in the at least one array; and

control logic configured to simultaneously read a programming state of the predetermined number of bits in the at least one array.

21. The memory device of claim 20 , further comprising:

a plurality of sense amplifiers operatively connected to the plurality of bit lines, where the plurality of sense amplifiers are low-power sense amplifiers; and

control logic configured to simultaneously read a number of bits in programmed memory cells by monitoring a threshold voltage for each memory cell with a corresponding one of the plurality of sense amplifiers.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2022
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES LLC
Reel/Frame 059721/0467 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036039/0406 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2005
From: KUO, TIAO-HUA; LEONG, NANCY; YANG, NIAN; WANG, GUOWEI; LEE, AARON; CHANDRA, SACHIT; VANBUSKIRK, MICHAEL A.; CHEN, JOHNNY; HAMILTON, DARLENE; LE, BINH QUANG
To: SPANSION LLC
Reel/Frame 017008/0881 →