Method for manufacturing a semiconductor device
A method for manufacturing a semiconductor device formed by stacking a plurality of semiconductor elements on a substrate includes the steps of stacking the plurality of semiconductor elements on the substrate to form plural stages, placing the substrate substantially vertically and charging an underfill agent into spaces defined between the substrate and the corresponding semiconductor element and spaces defined among the stacked semiconductor elements through a nozzle from above side faces of the stacked semiconductor elements, and curing the charged underfill agent.
1. A method for manufacturing a semiconductor device formed by stacking a plurality of semiconductor elements on a substrate, comprising, in the order recited, the steps of:
stacking the plurality of semiconductor elements on the substrate to form plural stages of stacked semiconductor elements;
placing the substrate substantially vertically;
charging a liquid resin into spaces defined between the substrate and the plurality of semiconductor elements and into spaces defined among the stacked semiconductor elements from above the side faces of the stacked semiconductor elements; and
curing the charged liquid resin.
2. The method according to claim 1 , wherein when the substrate is placed substantially vertically, and wherein side faces of the stacked semiconductor elements are disposed horizontally.
3. The method according to claim 1 , wherein when the substrate is placed substantially vertically, and wherein side faces of the stacked semiconductor elements are disposed aslant from horizontal.
4. The method according to claim 1 , wherein in the step for charging the liquid resin, the liquid resin is simultaneously injected into the respective spaces.
5. The method according to claim 1 , wherein in the step for charging the liquid resin, the liquid resin is injected into every respective space.
6. The method according to claim 1 , further comprising prior to charging the liquid resin, forming dam members for preventing an outflow of the liquid resin from regions of side faces lying on sides opposite to the side faces for charging of the liquid resin so the dam members extend along the side faces lying on sides opposite to the side faces for charging of the liquid resin.
7. The method according to claim 1 , further comprising the steps of:
providing a jig equipped with contact surfaces, which are brought into contact with side faces lying on sides opposite to the side faces for charging of the liquid resin, and discharge holes, which are made open at the contact surfaces and from which air is discharged from within the respective spaces; and
bringing the contact surfaces of the jig into contact with the side faces lying on the sides opposite to the side faces for charging of the liquid resin prior to the charging of the liquid resin.