Method of forming a magnetic device having a conductive clip
View Patent ↗A method of forming a magnetic device by providing a conductive substrate and placing a magnetic core proximate the conductive substrate with a surface thereof facing the conductive substrate. The method also includes placing a conductive clip proximate a surface of the magnetic core and electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core.
1. A method of forming a magnetic device employable in a power module, comprising:
providing a conductive substrate employable in said power module;
placing a magnetic core proximate said conductive substrate with a lower surface adhered to an adhesive on said conductive substrate, said magnetic core having an overall end-to-end length and a continuous upper surface;
placing a planar surface of a conductive clip above said continuous upper surface of said magnetic core, said conductive clip continuously spanning said overall end-to-end length and said continuous upper surface of said magnetic core in a plane parallel to said conductive substrate; and
electrically coupling ends of said conductive clip to said conductive substrate to allow said conductive clip to form a portion of a winding about said magnetic core.
2. The method as recited in claim 1 wherein said conductive clip is about 8 to 12 mils in thickness.
3. The method as recited in claim 1 wherein said continuous upper surface of said magnetic core is substantially planar.
4. The method as recited in claim 1 wherein said magnetic core is formed from manganese zinc ferrite.
5. The method as recited in claim 1 wherein said conductive substrate is a leadframe.
6. The method as recited in claim 1 wherein said adhesive is a die attached adhesive.
7. The method as recited in claim 1 wherein said ends of said conductive clip are bent toward said conductive substrate about ends of said magnetic core.
8. The method as recited in claim 1 further comprising soldering said conductive clip to said conductive substrate.
9. The method as recited in claim 1 further comprising providing a gap between said conductive clip and said magnetic core.
10. The method as recited in claim 1 further comprising encapsulating said magnetic core, said conductive clip and said conductive substrate.
11. The method as recited in claim 1 wherein said continuous upper surface of said magnetic core is rectangular.
12. A method of forming a magnetic device employable in a power module, comprising:
providing a patterned, conductive leadframe employable in said power module;
adhering a magnetic core formed from a bar of magnetic material to an adhesive on said conductive leadframe, said magnetic core having an overall end-to-end length and a continuous upper surface;
placing a planar surface of at least one conductive clip above said continuous upper surface of said magnetic core, said at least one conductive clip continuously spanning said overall end-to-end length and said continuous upper surface of said magnetic core in a plane parallel to said conductive leadframe; and
soldering ends of said at least one conductive clip to said conductive leadframe to allow said conductive clip to form a portion of a winding about said magnetic core.
13. The method as recited in claim 12 wherein said bar of magnetic material is formed from manganese zinc ferrite.
14. The method as recited in claim 12 further comprising forming terminals for external electrical connections by creating leadframe fingers in said conductive leadframe.
15. The method as recited in claim 12 further comprising electrically coupling portions of said conductive leadframe with at least one wire bond.
16. The method as recited in claim 12 wherein said ends of said at least one conductive clip are bent toward said conductive leadframe about ends of said magnetic core.
17. The method as recited in claim 12 further comprising providing a gap between said magnetic core and said at least one conductive clip.
18. The method as recited in claim 12 further comprising providing a gap between said magnetic core and said at least one conductive clip and further comprising substantially filling said gap with an encapsulant.
19. The method as recited in claim 12 further comprising encapsulating said magnetic core, said at least one conductive clip and said conductive leadframe.
20. The method as recited in claim 12 further comprising encapsulating said magnetic core, said at least one conductive clip and said conductive leadframe with an epoxy encapsulant.
21. The method as recited in claim 12 wherein said magnetic device is an inductor.